DE9103494U1 - - Google Patents

Info

Publication number
DE9103494U1
DE9103494U1 DE9103494U DE9103494U DE9103494U1 DE 9103494 U1 DE9103494 U1 DE 9103494U1 DE 9103494 U DE9103494 U DE 9103494U DE 9103494 U DE9103494 U DE 9103494U DE 9103494 U1 DE9103494 U1 DE 9103494U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9103494U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamatech Halbleiter-Maschinenbau und Technologie 7137 Sternenfels De GmbH
Original Assignee
Hamatech Halbleiter-Maschinenbau und Technologie 7137 Sternenfels De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamatech Halbleiter-Maschinenbau und Technologie 7137 Sternenfels De GmbH filed Critical Hamatech Halbleiter-Maschinenbau und Technologie 7137 Sternenfels De GmbH
Priority to DE9103494U priority Critical patent/DE9103494U1/de
Publication of DE9103494U1 publication Critical patent/DE9103494U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
DE9103494U 1991-03-21 1991-03-21 Expired - Lifetime DE9103494U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9103494U DE9103494U1 (en) 1991-03-21 1991-03-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE9103494U DE9103494U1 (en) 1991-03-21 1991-03-21

Publications (1)

Publication Number Publication Date
DE9103494U1 true DE9103494U1 (en) 1992-07-16

Family

ID=6865541

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9103494U Expired - Lifetime DE9103494U1 (en) 1991-03-21 1991-03-21

Country Status (1)

Country Link
DE (1) DE9103494U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1210984A2 (en) 1994-12-22 2002-06-05 Steag HamaTech AG Process and device for lacquering or coating a substrate

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2021979A (en) * 1978-05-23 1979-12-12 Fsi Corp Applying processing fluid onto silicon wafers
US4550679A (en) * 1984-06-11 1985-11-05 Harvey Russack Device for producing decorative patterns on clothing
US4609575A (en) * 1984-07-02 1986-09-02 Fsi Corporation Method of apparatus for applying chemicals to substrates in an acid processing system
DE3705592A1 (en) * 1987-02-21 1988-09-01 Convac Gmbh Geraete Zur Halble Device for the thin coating (lacquering) of disc-shaped substrates for electronic applications, for example circuit boards, Compact Discs, etc.
US4889069A (en) * 1987-11-23 1989-12-26 Tazmo Co., Ltd. Substrate coating equipment
US4941426A (en) * 1987-09-18 1990-07-17 Tokyo Ohka Kogyo Co., Ltd. Thin-film coating apparatus
JPH05214639A (en) * 1991-09-07 1993-08-24 Sipra Patentwickl & Beteiligung Gmbh Circular knitting machine and sinker for manufacturing plush raw cloth

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2021979A (en) * 1978-05-23 1979-12-12 Fsi Corp Applying processing fluid onto silicon wafers
US4550679A (en) * 1984-06-11 1985-11-05 Harvey Russack Device for producing decorative patterns on clothing
US4609575A (en) * 1984-07-02 1986-09-02 Fsi Corporation Method of apparatus for applying chemicals to substrates in an acid processing system
DE3705592A1 (en) * 1987-02-21 1988-09-01 Convac Gmbh Geraete Zur Halble Device for the thin coating (lacquering) of disc-shaped substrates for electronic applications, for example circuit boards, Compact Discs, etc.
US4941426A (en) * 1987-09-18 1990-07-17 Tokyo Ohka Kogyo Co., Ltd. Thin-film coating apparatus
US4889069A (en) * 1987-11-23 1989-12-26 Tazmo Co., Ltd. Substrate coating equipment
JPH05214639A (en) * 1991-09-07 1993-08-24 Sipra Patentwickl & Beteiligung Gmbh Circular knitting machine and sinker for manufacturing plush raw cloth

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP Patents Abstracts of Japan: 1-176473 A., C.644, Oct.16, 1989, Vol.13, No.457 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1210984A2 (en) 1994-12-22 2002-06-05 Steag HamaTech AG Process and device for lacquering or coating a substrate

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