DE9004562U1 - - Google Patents

Info

Publication number
DE9004562U1
DE9004562U1 DE9004562U DE9004562U DE9004562U1 DE 9004562 U1 DE9004562 U1 DE 9004562U1 DE 9004562 U DE9004562 U DE 9004562U DE 9004562 U DE9004562 U DE 9004562U DE 9004562 U1 DE9004562 U1 DE 9004562U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE9004562U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atg Electronic 6980 Wertheim De GmbH
Original Assignee
Atg Electronic 6980 Wertheim De GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atg Electronic 6980 Wertheim De GmbH filed Critical Atg Electronic 6980 Wertheim De GmbH
Priority to DE9004562U priority Critical patent/DE9004562U1/de
Publication of DE9004562U1 publication Critical patent/DE9004562U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
DE9004562U 1989-04-26 1990-04-23 Expired - Lifetime DE9004562U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE9004562U DE9004562U1 (en) 1989-04-26 1990-04-23

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3913796 1989-04-26
DE9004562U DE9004562U1 (en) 1989-04-26 1990-04-23

Publications (1)

Publication Number Publication Date
DE9004562U1 true DE9004562U1 (en) 1990-07-19

Family

ID=25880315

Family Applications (1)

Application Number Title Priority Date Filing Date
DE9004562U Expired - Lifetime DE9004562U1 (en) 1989-04-26 1990-04-23

Country Status (1)

Country Link
DE (1) DE9004562U1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997043656A2 (en) * 1996-05-17 1997-11-20 Formfactor, Inc. Wafer-level burn-in and test
WO1997044676A1 (en) * 1996-05-17 1997-11-27 Formfactor, Inc. Microelectronic contact structure and method of making same
DE19813526A1 (en) * 1998-03-26 1999-06-17 Siemens Ag Multiple contact device for fine-pitch ball-grid-array (FPBGA) component
DE19821128C1 (en) * 1998-05-12 1999-09-09 Feinmetall Gmbh Contact element for touch contact with tested microchip
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US6417684B1 (en) 1997-11-05 2002-07-09 Feinmetall Gmbh Securement of test points in a test head
US6475822B2 (en) 1993-11-16 2002-11-05 Formfactor, Inc. Method of making microelectronic contact structures
US6525555B1 (en) 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
DE19847244B4 (en) * 1997-11-05 2005-05-19 Feinmetall Gmbh Test head for microstructures with interface
US7888955B2 (en) 2007-09-25 2011-02-15 Formfactor, Inc. Method and apparatus for testing devices using serially controlled resources
US7944225B2 (en) * 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
US7977959B2 (en) 2007-09-27 2011-07-12 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US8095841B2 (en) 2008-08-19 2012-01-10 Formfactor, Inc. Method and apparatus for testing semiconductor devices with autonomous expected value generation
US8122309B2 (en) 2008-03-11 2012-02-21 Formfactor, Inc. Method and apparatus for processing failures during semiconductor device testing

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6788094B2 (en) 1993-11-16 2004-09-07 Formfactor, Inc. Wafer-level burn-in and test
US6482013B2 (en) 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US7345493B2 (en) 1993-11-16 2008-03-18 Formfactor, Inc. Wafer-level burn-in and test
US7078926B2 (en) 1993-11-16 2006-07-18 Formfactor, Inc. Wafer-level burn-in and test
US7688090B2 (en) 1993-11-16 2010-03-30 Formfactor, Inc. Wafer-level burn-in and test
US6064213A (en) * 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US6525555B1 (en) 1993-11-16 2003-02-25 Formfactor, Inc. Wafer-level burn-in and test
US6475822B2 (en) 1993-11-16 2002-11-05 Formfactor, Inc. Method of making microelectronic contact structures
WO1997043656A3 (en) * 1996-05-17 1998-03-12 Formfactor Inc Wafer-level burn-in and test
WO1997044676A1 (en) * 1996-05-17 1997-11-27 Formfactor, Inc. Microelectronic contact structure and method of making same
WO1997043656A2 (en) * 1996-05-17 1997-11-20 Formfactor, Inc. Wafer-level burn-in and test
US6417684B1 (en) 1997-11-05 2002-07-09 Feinmetall Gmbh Securement of test points in a test head
DE19847244B4 (en) * 1997-11-05 2005-05-19 Feinmetall Gmbh Test head for microstructures with interface
DE19813526A1 (en) * 1998-03-26 1999-06-17 Siemens Ag Multiple contact device for fine-pitch ball-grid-array (FPBGA) component
DE19821128C1 (en) * 1998-05-12 1999-09-09 Feinmetall Gmbh Contact element for touch contact with tested microchip
US7888955B2 (en) 2007-09-25 2011-02-15 Formfactor, Inc. Method and apparatus for testing devices using serially controlled resources
US7977959B2 (en) 2007-09-27 2011-07-12 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US8872534B2 (en) 2007-09-27 2014-10-28 Formfactor, Inc. Method and apparatus for testing devices using serially controlled intelligent switches
US8122309B2 (en) 2008-03-11 2012-02-21 Formfactor, Inc. Method and apparatus for processing failures during semiconductor device testing
US8095841B2 (en) 2008-08-19 2012-01-10 Formfactor, Inc. Method and apparatus for testing semiconductor devices with autonomous expected value generation
US7944225B2 (en) * 2008-09-26 2011-05-17 Formfactor, Inc. Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test

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