DE898931C - Process for removing stoved lacquer layers based on polyamide, in particular from wires - Google Patents

Process for removing stoved lacquer layers based on polyamide, in particular from wires

Info

Publication number
DE898931C
DE898931C DES25453A DES0025453A DE898931C DE 898931 C DE898931 C DE 898931C DE S25453 A DES25453 A DE S25453A DE S0025453 A DES0025453 A DE S0025453A DE 898931 C DE898931 C DE 898931C
Authority
DE
Germany
Prior art keywords
solvent
boiling
polyamide
wires
volatile
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DES25453A
Other languages
German (de)
Inventor
Hans-Joachim Dr Phil Schenck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DES25453A priority Critical patent/DE898931C/en
Application granted granted Critical
Publication of DE898931C publication Critical patent/DE898931C/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
    • H02G1/1287—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by means of a solvent

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Paints Or Removers (AREA)

Description

Verfahren zum Entfernen von Einbrenn-Lackschichten auf Basis von Polyamid, insbesondere von Drähten Polyamvde zeichnen sich durch eine gute Lösungsmittelbeständigkeit aus. Sie werden für die Verwendung in der Elektrotechnik, besonders als Drahtlack, meist mit härtbaren Kunstharzen, wie P'henolharzen, Melaminharzen oder Polyaryläthylenoxyd'harzen, kombiniert. Dadurch werden die Lackfilme chemisch noch widerstandsfähiger. Es bereitet daher große Schwierigkeiten, eingebrannte Filme, z. B. von Drähten, rasch und auf eine für den .damit Hantierenden und für,die übrige Isolierung unschädliche Art zu entfernen. Diese Abisolierung ist praktisch wichtig, um @z. B. ein glattes Löten von Lackdraht- oder -litzenenden zu ermöglichen.Process for removing stoved lacquer layers based on polyamide, Polyamide wires, in particular, are characterized by good resistance to solvents the end. They are used in electrical engineering, especially as wire enamel, mostly with curable synthetic resins such as phenolic resins, melamine resins or polyarylethylene oxide resins, combined. This makes the paint films even more chemically resistant. It prepares therefore great difficulty in recovering burned-in films, e.g. B. of wires, quickly and on a kind that is harmless for the person handling it and for the rest of the insulation to remove. This stripping is practically important to @z. B. a smooth soldering of enamelled wire or stranded wire ends.

Es ist bekannt, zum Abisolieren in solchen Fällen Gemische aggressiver Lösungsmittel, wie Alkohole, mit Säuren oder Basen oder Kresol zu verwenden oder niedere Fettsäuren, wie Ameisensäure oder Essigsäure. Diese Stoffe haben .den Nachteil, entweder physiologisch gefährlich zu sein oder nur langsam einzuwirken oder die Isolierung, besonders bei Litzen, in unkontrollierbarer Weise zu zerstören, indem Teile des Abbeizmittels durch Kapillarwirkung an den Lackdrähten entlang wandern und sich festsetzen.It is known to use more aggressive mixtures for stripping in such cases Solvents, such as alcohols, with acids or bases or cresol to use or lower fatty acids such as formic acid or acetic acid. These substances have the disadvantage either to be physiologically dangerous or to act slowly or the Insulation, especially in the case of strands, can be destroyed in an uncontrollable manner by Parts of the paint stripper migrate along the enameled wires due to capillary action and get stuck.

Erfindungsgemäß -werden diese Schwierigkeiten durch die aufeinanderfolgende Anwendung eines heißen hochsiedenden, physiologischund korrossionschemisch nicht aggressiven Lösungsmittels und eines leichtflüchtigen Nichtlösers umgangen. Das Lösungsmittel läßt man dabei in heißem Zustand kurz auf die .abzuisolierende Stelle einwirken, worauf anschließend etwaige Reste durch mehrmaliges Eintauchen in einen leichtflüchtigen Nichtlöser für die PolyamIdkombin.ationen abgespült werden und die Reste ,des leichtflüchtigen Nichtlösers verdunsten. Die Verdunstung kann dabei beispielsweise durch Gegenblasen von Luft beschleunigt werden.According to the invention, these difficulties are caused by the successive Use of a hot, high-boiling, physiological and corrosion-chemical not bypassed aggressive solvents and a volatile non-solvent. That Solvent is left in a hot state briefly on the point to be stripped act, whereupon any residues are subsequently dipped into a volatile non-solvent rinsed off for the polyamide combinations and the residues of the volatile non-solvent evaporate. The evaporation can be accelerated, for example, by counter-blowing air.

Für .die Zwecke .der Erfindung haben sich als hochsiedender Löser insbesondere Benzylalkohol und als niedrigsiedender Nichtlöser Benzol als besonders geeignet erwiesen. Statt .dieser Mittel können aber auch je nach den vorliegenden Be-,dingungen andere Stoffe für die Zwecke des erfindungsgemäßen Verfahrens Verwendung finden.For .the purposes of the invention have proven to be high-boiling solvents especially benzyl alcohol and, as a low-boiling non-solvent, benzene as special proved suitable. Instead of these means, however, depending on the present Conditions other substances for the purposes of the method according to the invention use Find.

Claims (1)

PATENTANSPRÜCHE: i. Verfahren zum Entfernen von Einbrenn-Lackschichten auf Basis von Polyamid, insbesondere von Lackdrähten oder -litzen, gekennzeichnet durch die aufeinanderfolgende. Anwendung eines heißen hochsiedenden, physiologisch und korrosionschemisch nicht aggressiven Lösungsmittels und eines leichtflüchtigen Nichtlösers. Verfahren nach Anspruch i, dadurch gekennzeichnet, daß man das hochsiedende Lösungsmittel auf .die zu isolierende Stelle in heißem Zustand kurz einwirken läßt, worauf durch gegebenenfalls mehrmaliges Eintauchen in einen leichtflüchtigen Nichtlöser die abisolierte Stelle abgespült wird. 3. Verfahren nach Anspruch 2, dadurch gekennzeichnet, daß eine Verdunstung des leichtflüchtiger Nichtlösers im Anschluß an .die Behandlung durch Gegenblasen von Luft be-Ischleunigt wird. q.. Verfahren nach Anspruch i, gekennzeichnet durch -die Verwendung von Benzylalkohol als hochsiedendes Lösungsmittel. 5. Verfahren nach Anspruch i, gekennzeichnet ,durch Benzol als niedrigsiedender Nichtlöser.PATENT CLAIMS: i. Process for removing layers of baked enamel based on polyamide, especially enamelled wires or strands through the successive. Application of a hot high boiling point, physiological and non-corrosive chemically aggressive solvent and a highly volatile one Nonsolver. Process according to Claim i, characterized in that the high-boiling Lets solvent act briefly on the hot spot to be isolated, followed by repeated immersion in a volatile non-solvent, if necessary the stripped area is rinsed off. 3. The method according to claim 2, characterized in that that an evaporation of the volatile nonsolvent after the treatment is accelerated by counterblowing air. q .. The method according to claim i, characterized through the use of benzyl alcohol as a high-boiling solvent. 5. Procedure according to claim i, characterized by benzene as the low-boiling non-solvent.
DES25453A 1951-11-02 1951-11-02 Process for removing stoved lacquer layers based on polyamide, in particular from wires Expired DE898931C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DES25453A DE898931C (en) 1951-11-02 1951-11-02 Process for removing stoved lacquer layers based on polyamide, in particular from wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES25453A DE898931C (en) 1951-11-02 1951-11-02 Process for removing stoved lacquer layers based on polyamide, in particular from wires

Publications (1)

Publication Number Publication Date
DE898931C true DE898931C (en) 1953-12-07

Family

ID=7478356

Family Applications (1)

Application Number Title Priority Date Filing Date
DES25453A Expired DE898931C (en) 1951-11-02 1951-11-02 Process for removing stoved lacquer layers based on polyamide, in particular from wires

Country Status (1)

Country Link
DE (1) DE898931C (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1135537B (en) * 1960-10-13 1962-08-30 Siemens Ag Method and device for stripping wires
DE102009000547A1 (en) * 2009-02-02 2010-10-14 Tyco Electronics Amp Gmbh Method for stripping a cable device
WO2014085754A1 (en) * 2012-11-29 2014-06-05 Abb Technology Ltd. Stripping structure and method for removing enamel insulation from lead ends

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1135537B (en) * 1960-10-13 1962-08-30 Siemens Ag Method and device for stripping wires
DE102009000547A1 (en) * 2009-02-02 2010-10-14 Tyco Electronics Amp Gmbh Method for stripping a cable device
DE102009000547B4 (en) * 2009-02-02 2018-11-15 Te Connectivity Germany Gmbh Method for stripping a cable device
WO2014085754A1 (en) * 2012-11-29 2014-06-05 Abb Technology Ltd. Stripping structure and method for removing enamel insulation from lead ends

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