DE8812039U1 - LED housing - Google Patents
LED housingInfo
- Publication number
- DE8812039U1 DE8812039U1 DE8812039U DE8812039U DE8812039U1 DE 8812039 U1 DE8812039 U1 DE 8812039U1 DE 8812039 U DE8812039 U DE 8812039U DE 8812039 U DE8812039 U DE 8812039U DE 8812039 U1 DE8812039 U1 DE 8812039U1
- Authority
- DE
- Germany
- Prior art keywords
- light
- emitting diode
- housing according
- diode housing
- molded part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000005855 radiation Effects 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 210000002105 tongue Anatomy 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000000049 pigment Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Description
Gunter Jungck, Waldeckstr. 34, 7&THgr;42 Kandern 1Gunter Jungck, Waldeckstr. 34, 7&THgr;42 Kandern 1
"Leuchtdiodengehäuse""Light-emitting diode housing"
Bekannte Leuchtdiodengehäuse, insbesondere diejenigen, deren Querschnitt nicht kreisförmig sondern z.B. rechteckig oder dreieckig ist. besitzen meist einen prismeiifurmigen Teil, desBen Deckfläche die Lichtaustrittsflache darstellt. Diese Gehäusef orm erfordert eine geeignete ·&iacgr; ierschnittsf lächenähnl ic lie öffnung in der Frontplatte, wo das Bauteil seinen Platz finden soll .Known light-emitting diode housings, especially those whose cross-section is not circular but, for example, rectangular or triangular, usually have a prism-shaped part, the top surface of which represents the light exit surface. This housing shape requires a suitable opening in the front panel that is similar to the cross-section, where the component is to be placed.
Besonders schwierig jedoch ist das nachträgliche !!erstellen einer passungsgenauen eckigen öffnung in einer Platte insbesondere in dickeren Schaltpultolatten.However, it is particularly difficult to subsequently create a precisely fitting square opening in a panel, especially in thicker control panel slats.
Der Erfindung liegt die Aufgabe zugrunde, ein Gehäuse für Leuchtdioden zu schaffen, das in runde Öffnungen eingesetzt werden kann aber trotzdem z.B. rechteckige Abstrahlungsflachen besitzt. Runde öffnungen lassen sich leicht durch Bohren herstellen.The invention is based on the task of creating a housing for light-emitting diodes that can be inserted into round openings but still has, for example, rectangular radiation surfaces. Round openings can be easily created by drilling.
Erfindungsgemäß besitzt deshalb d-s neue Gehäuse einen zylinderförmigen, runden Schaft Cl), an dessen oberen Ende das Teil (2) mit der geometrisch gewünschten Srezialforrr. sitzt.According to the invention, the new housing therefore has a cylindrical, round shaft (C1), at the upper end of which the part (2) with the geometrically desired special shape is located.
Das Formteil (2) ist vorzugsweise entsprechend groß gestaltet, so daß es das Schaftloch rundum überdecken kann.The molded part (2) is preferably designed to be large enough to cover the shaft hole all around.
Eine zufriedenstellende Ausleuchtung der Lichtaustrittsfläche (3) wird durch geeignete Maßnahmen erzielt. Wichtig sind bei der gegebenen Divergenz der Lichtstrahlen im Gehäuse die Nivellierung der Strahlenquelle {5} im Schaft sowie eine starker diffundierend wirkende Schicht an der Austrittsflache der Strahlen im Formteil (2) wie dies in Figur 1 gezeigt ist.A satisfactory illumination of the light exit surface (3) is achieved by suitable measures. Given the divergence of the light rays in the housing, it is important to level the radiation source {5} in the shaft and to have a strong diffusing layer on the exit surface of the rays in the molded part (2) as shown in Figure 1.
Die Divergenz der Strahlen wird erreicht durch die Verwendung einer geeigneten Form des Strahlers bzw. durch eine reflektierende konkave Vertiefung seiner Umgebung und durch die Verwendung von Kunststoff mit einer möglichst großen Brechzahl für dasThe divergence of the rays is achieved by using a suitable shape of the radiator or by a reflective concave depression in its surroundings and by using plastic with the highest possible refractive index for the
Gehäuse bzw. der Zugabe diffundierender Partikel.Housing or the addition of diffusing particles.
Der Ubergangsbereich (4) zwischen den Teilen (1) und (2) ist normalerweise rechtwinklig geformt. In einer anderen Ausführung is=*, er konisch geformt, damit, mehr direkte Strahlung auf die Lichtaustrittsöffnung fallen kann. Dies hat allerdings zur Folge, daß man das Bohrloch entsprechend anphasen muß.The transition area (4) between parts (1) and (2) is normally rectangular. In another design it is conical so that more direct radiation can fall on the light exit opening. However, this means that the drill hole must be chamfered accordingly.
Für die Ausführung des Formteile, (2) sind alle geometrischen Formen denkbar wie z.B. rechteckige oder dreieckige Quader oder Pyramidenstümpfe mit jeweils ebenen oder gewölbten Flächen. Aber auch wiederum zylindrische Formen oder Kegelstümpfe und natürlich &lgr;&pgr;&lgr; K Q r\ i-i r\ or f /~» r* m &ohgr; r*i 1^i-S n^?ii5r^"' B Dof Arm + o &Ggr;3 T^ &tgr; &agr; m ö &eegr; r~t &Lgr;For the design of the molded parts (2), all geometric shapes are conceivable, such as rectangular or triangular cuboids or truncated pyramids with flat or curved surfaces. But also cylindrical shapes or truncated cones and of course &lgr;&pgr;&lgr; KQ r\ ii r\ or f /~» r* m ωr*i 1 ^i - S n ^?ii5 r ^"' B Dof Arm + o &Ggr;3 T^ &tgr;αgr; m ö &eegr; r~t &Lgr;
Damit dieses Teil einen flächenhaften Charakter erhält und nicht allzusehr auE der Platte herausragt, in der die Leuchtdiode sitzt, ist die Höhe des Formteils möglichst gering zu halten.In order to give this part a flat character and not protrude too much from the plate in which the LED is located, the height of the molded part should be kept as low as possible.
Als Sonderform des erfindungsgemäßen Leuchtdiodengehäuses ist eine zweiteilige Ausführung für bestimmte Anwendungen vorteilhaft, wobei das Formteil (2) als LED-Kappe separat angefertigt ist und nachträglich auf den Gehäuseteil (1) aufgesteckt oder aufgeklebt wird.As a special form of the LED housing according to the invention, a two-part design is advantageous for certain applications, whereby the molded part (2) is manufactured separately as an LED cap and is subsequently attached or glued onto the housing part (1).
Durch die Trennung der Teile (1) und (2) würde die Montage von bereits auf Leiterplatten angelöteten LEDs ermöglicht.Separating parts (1) and (2) would enable the mounting of LEDs already soldered onto circuit boards.
Die das Gehäuseteil (i) aufnehmende Seite des Formteils (2) ist vorzugsweise entsprechend konkav ausgebildet, so daß für den Gehäuseteil (1) auch handelsübliche LEDs vervJencet werden können.The side of the molded part (2) that accommodates the housing part (i) is preferably designed to be correspondingly concave, so that commercially available LEDs can also be used for the housing part (1).
Als weitere Ausführungsform ist das erfindungsgemäße LED-Gehäuse zusätzlich mit einem Rahmen ausgestattet, der über lichtreflektierende Oberflächenanteile verfügt und als der Abstrahlungsflache nachgeformter Reflektor wirkt.As a further embodiment, the LED housing according to the invention is additionally equipped with a frame that has light-reflecting surface portions and acts as a reflector shaped after the radiation surface.
Dieser Rahmen ist vorzugsweise aus Kunststoff oder auch ganz aus Metall gefertigt und verfügt über ein Gewinde, das durch das Befestigungsloch durchführt oder über Druckzungen, die der Halterung des Gehäuses im Bohrloch dienen.This frame is preferably made of plastic or entirely of metal and has a thread that runs through the mounting hole or pressure tongues that serve to hold the housing in the drill hole.
Im folgenden ist eine Querschnittszeichnung des gesamten LED-Gehäuses (Fig. 1) gezeigt sowie weitere Ausführungsbeispiele des Formteils (2) (Fig. 2) und, auch im Querschnitt, eine Ausbildung dieses Teils als LED-Kappe (Fig. 3).The following shows a cross-sectional drawing of the entire LED housing (Fig. 1) as well as further embodiments of the molded part (2) (Fig. 2) and, also in cross section, a formation of this part as an LED cap (Fig. 3).
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8812039U DE8812039U1 (en) | 1988-09-23 | 1988-09-23 | LED housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8812039U DE8812039U1 (en) | 1988-09-23 | 1988-09-23 | LED housing |
Publications (1)
Publication Number | Publication Date |
---|---|
DE8812039U1 true DE8812039U1 (en) | 1988-12-29 |
Family
ID=6828228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8812039U Expired DE8812039U1 (en) | 1988-09-23 | 1988-09-23 | LED housing |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE8812039U1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4223795A1 (en) * | 1992-07-20 | 1994-02-03 | Priesemuth W | Optoelectronic component |
US5452190A (en) * | 1993-07-19 | 1995-09-19 | Priesemuth; Wolfgang | Optoelectronic component |
DE19619478A1 (en) * | 1996-05-14 | 1997-11-20 | Sick Ag | Optical arrangement with diffractive optical element |
DE19830751A1 (en) * | 1998-07-09 | 1999-09-09 | Vishay Semiconductor Gmbh | LED with transparent encapsulation |
DE10023353A1 (en) * | 2000-05-12 | 2001-11-29 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing it |
DE20212490U1 (en) | 2002-08-14 | 2002-10-02 | A. Schweizer GmbH Optische Fabrik, 91301 Forchheim | Magnifying optical device |
DE10214566A1 (en) * | 2002-04-02 | 2003-10-30 | G L I Global Light Ind Gmbh | Homogeneous parallel light emitting diode |
WO2006009376A2 (en) * | 2004-07-20 | 2006-01-26 | Lg Electronics Inc. | Drying machine |
DE102006037737A1 (en) * | 2005-12-09 | 2007-06-14 | Osram Opto Semiconductors Gmbh | Optical device, optoelectronic device and production method have optoelectronic device inserted into a recess in a trough structure in an optical device base region |
US8227821B2 (en) | 2004-09-22 | 2012-07-24 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component |
-
1988
- 1988-09-23 DE DE8812039U patent/DE8812039U1/en not_active Expired
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4223795A1 (en) * | 1992-07-20 | 1994-02-03 | Priesemuth W | Optoelectronic component |
US5452190A (en) * | 1993-07-19 | 1995-09-19 | Priesemuth; Wolfgang | Optoelectronic component |
DE19619478A1 (en) * | 1996-05-14 | 1997-11-20 | Sick Ag | Optical arrangement with diffractive optical element |
DE19830751A1 (en) * | 1998-07-09 | 1999-09-09 | Vishay Semiconductor Gmbh | LED with transparent encapsulation |
DE10023353A1 (en) * | 2000-05-12 | 2001-11-29 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for producing it |
US7455461B2 (en) | 2000-05-12 | 2008-11-25 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof |
DE10214566A1 (en) * | 2002-04-02 | 2003-10-30 | G L I Global Light Ind Gmbh | Homogeneous parallel light emitting diode |
DE10214566B4 (en) * | 2002-04-02 | 2007-05-24 | G.L.I. Global Light Industries Gmbh | Homogeneously parallel light-emitting light-emitting diode |
WO2004025328A2 (en) * | 2002-08-14 | 2004-03-25 | A. Schweizer Gmbh Optische Fabrik | Magnifying optical device |
WO2004025328A3 (en) * | 2002-08-14 | 2004-05-21 | Schweizer Gmbh Optische Fabrik | Magnifying optical device |
DE20212490U1 (en) | 2002-08-14 | 2002-10-02 | A. Schweizer GmbH Optische Fabrik, 91301 Forchheim | Magnifying optical device |
WO2006009376A2 (en) * | 2004-07-20 | 2006-01-26 | Lg Electronics Inc. | Drying machine |
WO2006009376A3 (en) * | 2004-07-20 | 2007-02-01 | Lg Electronics Inc | Drying machine |
US8227821B2 (en) | 2004-09-22 | 2012-07-24 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component |
DE102006037737A1 (en) * | 2005-12-09 | 2007-06-14 | Osram Opto Semiconductors Gmbh | Optical device, optoelectronic device and production method have optoelectronic device inserted into a recess in a trough structure in an optical device base region |
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