DE102006037737A1 - Optical device, optoelectronic device and production method have optoelectronic device inserted into a recess in a trough structure in an optical device base region - Google Patents

Optical device, optoelectronic device and production method have optoelectronic device inserted into a recess in a trough structure in an optical device base region

Info

Publication number
DE102006037737A1
DE102006037737A1 DE102006037737A DE102006037737A DE102006037737A1 DE 102006037737 A1 DE102006037737 A1 DE 102006037737A1 DE 102006037737 A DE102006037737 A DE 102006037737A DE 102006037737 A DE102006037737 A DE 102006037737A DE 102006037737 A1 DE102006037737 A1 DE 102006037737A1
Authority
DE
Germany
Prior art keywords
optical device
device according
optoelectronic
optical
housing body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102006037737A
Other languages
German (de)
Inventor
Simon BLÜMEL
Bert Dr. Braune
Frank Weberpals
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Opto Semiconductors GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102005058901 priority Critical
Priority to DE102005058901.4 priority
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102006037737A priority patent/DE102006037737A1/en
Publication of DE102006037737A1 publication Critical patent/DE102006037737A1/en
Application status is Withdrawn legal-status Critical

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/02Simple or compound lenses with non-spherical faces
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0203Containers; Encapsulations, e.g. encapsulation of photodiodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0232Optical elements or arrangements associated with the device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0232Optical elements or arrangements associated with the device
    • H01L31/02325Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

The invention relates to an optical device having an optical region and a base region with a recess, wherein the optical device is formed like a trough, so that an optoelectronic device can be inserted into the optical device. Furthermore, the invention relates to an optoelectronic device having such an optical device with an inserted optoelectronic component. And the invention relates to a method for producing such an optoelectronic device.

Description

  • The The invention relates on the one hand to an optical device, on the other hand an optoelectronic device comprising an optical device and an opto-electronic device. Furthermore it concerns the invention a method for producing an optoelectronic Contraption.
  • These Patent application claims the priority of German patent application 102005058901.4, the disclosure of which is hereby incorporated by reference.
  • at a lens which is attached to an encapsulation, there is the Risk of replacement. On the one hand, this may be due to low adhesion of the lens, in particular a silicone lens, originate from the encapsulation, on the other hand, a low mechanical resistance the cause of a used adhesive.
  • Another type of attachment is from the published patent application EP 1 022 787 A1 known. It describes an optoelectronic component which has a main body and an optical device. In one embodiment, the optical device has clips that snap into notches in the body. As a result, the optical device, which rests on the base body, attached to the base body.
  • The Fixing the optical device to the body by means of snap-in connections However, with a comparatively complex design of the optical Device and the body connected.
  • It It is an object of the present invention to provide an optical device specify on a housing body of a Optoelectronic device in a simple manner mechanically stable is fastened. This object is achieved by an optical device according to claim 1 solved.
  • Further It is an object of the present invention to provide an optoelectronic To provide apparatus that such an optical device and having an optoelectronic device. This task is done by an optoelectronic device according to claim 9 solved.
  • Furthermore It is an object of the present invention to provide a process for the preparation specify such an optoelectronic device. These Task is solved by a method according to claim 25.
  • advantageous Further developments of the optical device and the optoelectronic Device, as well as advantageous embodiments of the method are in the dependent claims specified.
  • A according to the invention optical Device has an optical area and a pedestal area with a recess, wherein the optical device trough-like is formed so that an optoelectronic device in the optical device can be inserted.
  • The trough-shaped optical device allows by Inserting the optoelectronic device a simple attachment the optical device on a housing body of the device. simultaneously allows the optical device is a mechanically stable connection, as it for one mechanical connection between the optical device and the Housing body by means the recess provides a sufficiently large interface.
  • Preferably is the recess on a side facing away from the optical area of the pedestal portion and is on the part of the optical portion through a radiation passage area of the optical device limited. In addition, can the optical device at least one recess bounding the recess side surface have, which extends transversely to the radiation passage area and preferably at the radiation passage surface connects or goes into this. The interface is thus composed of the radiation passage area and the side surface. An optical device having such a shaped recess allows a simple slipping of the optical Device over the housing body.
  • According to one preferred embodiment the optical device can be attached to the housing body without any connection to the rest. This means that for attachment to neither the optical device nor are provided on the component latching fasteners. Thus omitted in the manufacture of the optical device, a complex training of locking elements and during assembly a complex attachment process.
  • According to one another preferred embodiment the base region is formed like a frame. Thus, the pedestal area the housing body circumferentially wrap.
  • The optical device may have at least one first spacer on the radiation passage area. The first spacer, which is formed, for example, plateau-like, protrudes from the radiation passage area. By means of the first spacer, a first distance of between 0.1 mm and 1 mm, for example 0.5 mm, is set between the radiation passage area and one of the radiation passage area adjacent main surface of the case body.
  • As well can by means of at least one arranged on the side surface second spacer a second distance that is between 0.1 mm and 1 mm, for example 0.5 mm, between the side surface the optical device and a side surface of the adjacent housing body set become.
  • The Spacers are the same from the connecting surface protruding elevations.
  • Preferably the optical device is designed so flexible that it at thermal or mechanical loads, for example can occur during assembly of the device does not detach from the housing body. Especially Preferably, it is at the same time formed so hard that they no irreversible under thermal or mechanical loads damage experiences.
  • The Optical device may be a silicone, an epoxy or a mixture of a silicone and epoxide. In particular, the optical Device containing a silicone containing one or more chains or regions comprising one or more epoxide groups. Instead of the one or more epoxide groups, the silicone one or more vinyl groups, acrylate groups, urethane units or polymer units with which optically transparent materials can be generated. Alternatively, the optical device may include an epoxide that one or more areas comprising one or more siloxane units. After all For example, the optical device may be connected to a crosslinked silicone Contain crosslinked epoxy. Advantageously, such optical device under thermal or mechanical loads, which may occur, for example, during assembly of the device, stable across from Deformations, cloudiness and discoloration.
  • The optical device can by means of injection molding, compression molding or Injection molding be prepared, thereby advantageously a multiply curved Radiation exit or radiation entrance surface feasible is. Particularly suitable is a 2K (2 component) injection molding, which it allowed to form the optical region with a material that yourself from one for distinguishes the material used in the base area. This is insofar advantageous than for the two areas have different physical properties are important, which are different by different materials stand out. While for the optical range, the radiation transmission is important, is for the base area a comparatively good adhesion important.
  • in the Frame of the invention is under a Strahlungsaustritts- or Radiation entrance area in the case of a radiation-emitting device, to understand a radiation exit surface, while in the case of a radiation-receiving device including one Radiation entrance area to understand.
  • Of the Optical range, which is intended for beam shaping, can as a refractive, diffractive or dispersive region is formed be. The optical range will vary according to the particular application designed. It can optoelectronic devices with tight or realize wide emission or reception characteristics.
  • Especially Preferably, the radiation exit or radiation entrance surface, the the radiation passage area opposite, one concave curved Part area and a concave curved portion in one Distance to the optical axis at least partially surrounding, convex curved Partial area, wherein the optical axis through the concave curved portion runs.
  • If the optical device for beam shaping at a radiation-emitting Component is attached, such a shape of the radiation exit surface a Adaptation of a radiation characteristic of the device to a predetermined Facilitate radiation characteristic. In particular, the customization such that one at an angle to the optical axis radiation output coupled out of the optical device with respect to decoupled radiation power of the device without optical Device increases is. In particular, the convexly curved portion can contribute to this, the one under large angles coupled to the optical axis of the optoelectronic device Radiation fraction increased. The optoelectronic device with such an optical Device is therefore for homogeneous illumination of a comparatively huge, especially flat, surface also in areas laterally offset from the optical axis particularly suitable. The optoelectronic device is preferred for backlighting a display device, such as an LCD (liquid crystal display).
  • An optoelectronic device according to the invention has an optical device according to one of claims 1 to 8, wherein the optoelectronic component in the optical device is laid.
  • The Optoelectronic component has a housing body.
  • It It is conceivable that a geometric shape of the recess of a geometrical shape of the housing body differs. Conveniently, however, the two forms correspond to each other. Preferably the housing body a the radiation passage area opposing external main area and at least one of the side surfaces the optical device opposite external side surface on. Particularly preferably, the main surface is at least partially one Light area.
  • The trough-shaped optical device into which the device is inserted, the housing body can the outboard Overlap side surface, this means, that the optical device, the housing body in a lateral direction completely overstretched. The lateral direction runs this transverse to a connection direction in which the optical device is connected to the optoelectronic component.
  • According to one preferred embodiment the optical device without interference attached to the housing body. This means, that neither the optical device nor the housing body has fastening elements, the one for that are provided in the housing body or to intervene the optical device. Thus, both the optical Device as well as the housing body fasteners as cones, clamps, grooves, holes, recesses can be saved. This facilitates the production of the optoelectronic device and has a positive effect on the production costs.
  • According to one particularly preferred embodiment is a between the optical device and the housing body Adhesive layer arranged. This extends from a first side surface of the Housing body up to the main area of the housing body. through the adhesive layer can irreversibly fix the optical device to the housing body be. In particular, the device can by means of the adhesive layer in the optical device be glued.
  • The Attachment of the optical device may be further improved thereby be that the adhesive layer from a first outer side surface of the housing body over the Main area too one of the first side surface opposite second external side surface of the housing body extends. In particular, the adhesive layer may substantially completely and completely cover the major surface the side surfaces the housing body at least partially cover, so that the adhesive layer forms a positive coating. Furthermore, the connection surface the optical device so coated by the adhesive layer, that these at least partially form-fitting the recess.
  • For the adhesive layer is a material suitable, the opposite of the optoelectronic Component generated or received radiation, primarily short-wave radiation, is relatively insensitive, so that during operation of the optoelectronic device no significant Degradation phenomena are to be expected.
  • Conveniently, the adhesive layer is at least in the area of the radiation passage area for the radiation radiation-permeable.
  • Preferably contains the adhesive layer is a silicone, an epoxy or a mixture of a Silicones and epoxies. In particular, the adhesive layer may be a silicone containing one or more chains or areas comprising having one or more epoxide groups. Instead of one or multiple epoxide groups, the silicone may have one or more vinyl groups, Acrylate groups, urethane units or polymer units with which optically transparent materials can be generated exhibit. Alternatively, the adhesive layer may contain an epoxide which one or more regions comprising one or more siloxane units having. Finally, can the optical device is connected to a crosslinked silicone Contain crosslinked epoxy. Advantageously, a Such adhesive layer by a comparatively high aging stability and radiation permeability with short-wave radiation, in particular in the blue to ultraviolet Range of the optical spectrum, from.
  • Especially Preferably, the adhesive layer has a refractive index corresponding to the Refractive index of one on the side of the housing body adjacent to the adhesive layer Medium and the refractive index of one on the side of the optical Device adjacent medium or lies in between. Thereby can Radiation losses are reduced due to total reflection at a boundary between an optically denser medium and a optically thinner Medium occur. Such a limit exists, for example, when between the main surface and the radiation passage area an air gap is present.
  • Since a medium adjacent to the adhesion layer on the side of the housing body, as well as a medium adjoining the adhesion layer on the part of the optical device according to a preferred embodiment, contains a silicone material, the adhesion layer advantageously has a silicon-containing material al on. In particular, the medium adjacent to the adhesive layer on the side of the housing body is a sheath in which a semiconductor body is embedded, and the medium adjacent to the adhesive layer on the part of the optical device is the optical device itself.
  • The Adhesive layer is preferably formed bubble-free. advantageously, This reduces the risk of contamination of the device is reduced. This has a positive effect on the functionality of the optoelectronic Device off.
  • Further allows a bubble-free adhesive layer a reduction of radiation losses, the can occur due to scattering of gas bubbles.
  • According to one preferred embodiment the radiation passage area the optical device and the main surface of the housing body by means of the first spacer spaced apart. The first spacer can open the main surface seated.
  • Further can by means of the second spacer, the side surface of the optical device and the side surface of the housing body from each other be spaced. The second spacer may be on the side surface of the Housing body abut.
  • through of the first and the second spacer may be between the optical Device and the housing body Distance in the range between 0.1 mm and 1 mm, for example of 0.5 mm, can be adjusted.
  • Preferably the optoelectronic device is surface mountable, whereby a rational assembly the optoelectronic device is possible.
  • The Optoelectronic device can further preferably by means of lead-free soldering to be assembled. soldering temperatures between 200 ° C and 260 ° C at an exposure time between 100s and 120s on the optoelectronic Device usually no damaging effect, i. that neither deformation, turbidity or discoloration the optical device still a detachment of the optical device can be expected from the component.
  • Conveniently, the optoelectronic component comprises a radiation-emitting and / or radiation-receiving semiconductor body. For example, the Semiconductor body in one to the main surface arranged adjacent recess of the housing body be.
  • According to a preferred embodiment, the semiconductor body contains a semiconductor material based on a nitride compound. This means that at least one layer of the semiconductor body comprises a nitride III / V compound semiconductor material, preferably Al n Ga m In 1 nm N, where 0 ≦ n ≦ 1, 0 ≦ m ≦ 1 and n + m ≦ 1 This material does not necessarily have to have a mathematically exact composition according to the above formula. Rather, it may comprise one or more dopants as well as additional ingredients that do not substantially alter the characteristic physical properties of the Al n Ga m In 1-nm N material. For the sake of simplicity, however, the above formula contains only the essential constituents of the crystal lattice (Al, Ga, In, N), even if these may be partially replaced by small amounts of other substances.
  • in the The following is a method for producing an optoelectronic device according to the invention specified.
  • at the method according to the invention is an optical device according to one of the above-described embodiments educated. Into the optical device becomes an adhesive layer forming flowable material filled. The device is inserted into the optical device.
  • According to one preferred embodiment of the method is when inserting the Component, the device in the adhesive layer forming flowable material so impressed, that the material at least partially on the side surface of the Housing body distributed. This allows the material to be the main surface and the side surfaces of the Housing body at least partially cover.
  • To the insertion of the device is the adhesive layer forming flowable material hardened to the adhesive layer. As a result, the optical device on the device is irreversible attached, and the device is glued into the optical device.
  • Around To obtain a bubble-free adhesive layer can take various measures carried out become: A first possibility It is the adhesive layer forming material in an overpressure environment cure. In this case, gas bubbles that are trapped in the material, compressed, wherein the bubbling gas escapes.
  • A second option It is the adhesive layer forming material in a vacuum environment fill. Thus, a blistering is avoided from the outset.
  • A third possibility is to make the adhesive layer-forming material before inserting the Degassing device. In addition, the adhesive layer forming material may be degassed after loading and before curing.
  • A Combination of these possibilities may also be provided within the scope of the invention.
  • Further preferred features, advantageous refinements and developments and advantages of an optical device, an optoelectronic component and a method according to the invention will become apparent from the following in connection with FIGS 1 to 6 closer explained embodiments.
  • It demonstrate:
  • 1 a schematic perspective view of a first embodiment of an optical device according to the invention,
  • 2 a schematic cross-sectional view of the first embodiment of an optical device according to the invention,
  • 3 a schematic perspective sectional view of a first preferred housing body,
  • 4 a schematic perspective bottom view of a second preferred housing body,
  • 5 a schematic cross-sectional view of an embodiment of an optoelectronic device according to the invention,
  • 6a to 6d various steps of a method according to the invention for producing an optoelectronic component.
  • In the 1 illustrated perspective view shows a plan view of a radiation exit or radiation entrance surface 2 an optical device 1 , The optical device 1 has an optical range 3 and a pedestal area 4 on, which is formed like a frame. On two opposite side walls, the optical device 1 notch 5 on. These facilitate insertion of an optoelectronic component with a laterally led out leadframe into the trough-shaped optical device 1 , wherein in the inserted state of the lead frame in the notches 5 intervenes.
  • The radiation exit or radiation entrance surface 2 is preferably shaped such that it has a concave curved portion B and a concave curved portion B surrounding the convexly curved portion C.
  • 2 shows a cross section of in 1 illustrated optical device 1 along the axis AA '. The radiation exit or radiation entrance surface 2 of the optical area 3 has a swing-like shape in cross-section. The radiation exit or radiation entrance surface 2 opposite is a radiation passage area 7 arranged. This also forms a bottom surface one in the base area 4 shaped recess 6 , On the circumference of the recess is through an inner side surface 8th the optical device 1 limited. The radiation passage area 7 and the side surface 8th can be summarized to a contact surface, which is connectable to a housing body of an optoelectronic device.
  • The optical device points out of the radiation passage area 7 protruding first spacers 9 on. By means of the first spacers 9 may be a first distance between the optical device 1 and an optoelectronic component. The first spacers 9 expediently do not extend completely along an inner edge D, but are formed like an island in the direction of arrow E.
  • Furthermore, the optical device 1 from the side surface 8th protruding second spacers 10 on, which are preferably also island-like. By means of the second spacers 10 a second distance can be set.
  • Advantageously, the spacers 9 and 10 be enclosed by an adhesive layer extending from the side surface by the island-like formation 8th to the radiation passage area 7 extends.
  • Preferably, the optical device is 1 integrally formed. Particularly preferred is the optical device 1 by means of one of the already mentioned methods, for example by means of injection molding.
  • The optical device 1 is made of a silicone-containing material. It is suitable for SMD (surface mounted devices) components, in particular for optoelectronic components that emit or receive radiation in the blue to ultraviolet range.
  • The in the 1 and 2 illustrated optical device 1 can on the in 3 illustrated housing body 20 be placed so that the pedestal area 4 the housing body 20 is arranged circumferentially. The housing body 20 has a basic body 21 on, preferably an art fabric material, in particular a thermoset material or thermoplastic material containing. The main body 21 can be made for example by means of injection molding, transfer molding or compression molding.
  • In particular, the optical device 1 be placed on an optoelectronic device, as described for example in the publication WO 02/084749 A2, the content of which is hereby incorporated by reference.
  • In the main body 21 is a two-part lead frame with two electrical connection strips and a thermal connection part enclosed in it 23 embedded. On the side of a connection area 24 for a semiconductor body is the thermal connection part 23 largely plan trained.
  • A support surface 25 lies a main surface 28 opposite, by means of a in the main body 21 shaped recess 26 is interrupted in the middle. A side surface 27 the recess is bevelled so that it can serve as a reflector.
  • 4 shows a bottom perspective view of another preferred housing body, which can be inserted into an optical device according to the invention. A bottom surface of the thermal connection part 23 protrudes from the main body 21 out, so that in the assembled state, a good heat dissipation from the housing body 20 can be done. The heat can, for example, to a support on which the housing body 20 is mounted, be delivered.
  • In contrast to the embodiment described above, the main body 21 a groove 29 on. This groove 29 allows control of a connection between the housing body even in the assembled state 20 and the carrier.
  • In 5 is an opto-electronic device 14 shown in which an optoelectronic device 11 in the tub-like optical device 1 is inserted. The optoelectronic component 11 is in one of the optical device 1 facing part of the optical device 1 enclosed. The pedestal area 4 the optical device 1 does not extend to the bearing surface in this embodiment 25 , Rather, the optical device 1 like a cap over the optoelectronic component 11 imposed.
  • Between the optoelectronic component 11 and the optical device 1 is an adhesive layer 15 arranged. This extends from a side surface 16 of the basic body 21 to the main area 28 , In particular, the adhesive layer connects 15 the optoelectronic component 11 with the optical device 1 so that the optoelectronic device 11 in the optical device 1 is glued.
  • The adhesive layer 15 may be that of the optical device 1 cover facing part of the optoelectronic device such that the main surface 28 essentially the entire surface and the side surface 16 at least partially from the adhesive layer 15 is covered. The adhesive layer 15 is here interrupted at the points where spacers (not shown) on the body 21 issue.
  • The adhesive layer 15 is also provided as a refractive index-adapting layer, which has a refractive index jump or refractive index jumps at the transition between the main surface 28 and the radiation passage area 7 reduced. Preferably, the adhesive layer contains 15 a material that is one of a sheath 13 and the optical area 3 corresponding refractive index. For the serving 13 that the recess 26 At least partially, are suitable reactive resins such as epoxy resins, acrylic resins or silicone resins. In particular, the cladding 13 , the adhesive layer 15 and the optical device 1 Made of a material that contains silicone.
  • Into the serving 13 is a radiation-emitting or radiation-receiving semiconductor body 12 embedded. The semiconductor body 12 is mounted on the back of the thermal connector, which is connected to the electrical connection strip 22a connected is. Further, the semiconductor body 12 at the end by means of a bonding wire with the electrical connection strip 22b connected.
  • The optoelectronic device 14 is surface mountable. In particular, the optoelectronic device 14 be soldered by means of lead-free soldering at a soldering temperature between 200 ° C and 260 ° C, without affecting the device 11 , in particular on the optical device 1 , irreversible damage occurs. The soldering temperature acts between 100s and 120s.
  • Based on 6a to 6d different steps of an embodiment of a method for producing an optoelectronic device according to the invention are shown.
  • First, by filling a molding material in a mold 30 a trough-like optical device 1 manufactured, which has an optical area and a base area with a recess ( 6a ).
  • Before further processing of the optical device 1 can this in an ultrasonic bath 15 Cleaned for minutes and then in a Un terdruck environment 15 Dried at 120 ° C for minutes.
  • For further treatment, the optical device 1 placed so that it is trough-like arranged and thus fillable ( 6b ).
  • Into the optical device 1 is then filled a flowable, relatively high viscosity material ( 6c ), which leads to the formation of the adhesive layer 15 is provided. Preferably, the material contains 35 Silicone.
  • Subsequently, in the flowable material 35 the optoelectronic component 11 inserted. In particular, the device 11 when inserting so impressed that the material 35 on the side surface 16 of the basic body 21 distributed ( 6d ).
  • In a step, not shown, the flowable material 35 to the adhesive layer 15 hardened. The duration of curing is preferably 1 hour at a temperature of 150 ° C.
  • The adhesive layer 15 surrounds one of the optical device 1 facing part of the optoelectronic device 11 positive fit and clothes the recess 6 at least partially.
  • So that the adhesive layer 15 is formed bubble-free, the measures already mentioned can be carried out.
  • The The invention is not by the description based on the embodiments limited. Much more For example, the invention includes every novel feature as well as every combination of features, in particular any combination of features in the claims includes, even if this feature or this combination itself not explicitly stated in the patent claims or exemplary embodiments is.

Claims (31)

  1. Optical device that has an optical range and a base portion having a recess, wherein the optical device is formed like a trough, so that an optoelectronic Component can be inserted into the optical device.
  2. An optical device according to claim 1, wherein the Recess on a side facing away from the optical region of the Base area is arranged and part of the optical area through a radiation passage surface of the optical device and on the part of the base by at least one side surface of the optical device is limited, which extends transversely to the radiation passage area and preferably connects to the radiation passage area or goes into this.
  3. Optical device according to one of claims 1 or 2, the rest-free connection to a housing body of the optoelectronic Component is fastened.
  4. Optical device according to one of the preceding Claims, wherein the base portion is formed like a frame.
  5. Optical device according to one of claims 2 to 4, on the radiation passage area at least a first Spacer has.
  6. Optical device according to one of claims 2 to 5, on the side surface has at least one second spacer.
  7. Optical device according to one of the preceding Claims, which is a silicone, an epoxy or a mixture of a silicone and Contains epoxides.
  8. Optical device according to one of the preceding Claims, wherein the optical region is one of the radiation passage area opposite Has radiation exit or radiation entrance surface, the one concavely curved Part area and a concave curved portion in one Distance to an optical axis at least partially surrounding, convex curved Partial area comprises, wherein the optical axis through the concave curved portion runs.
  9. Optoelectronic device, which is an optical Device according to one of the claims 1 to 8, wherein the optoelectronic component in the optical device is inserted.
  10. An optoelectronic device according to claim 9, wherein the optoelectronic component has a housing body.
  11. Optoelectronic device according to claim 10 with an optical device according to claim 2 or one to claim 2 back claim, wherein the housing body a the radiation passage area opposing external main area and at least one of the side surfaces the external device opposite the optical device side surface having.
  12. Optoelectronic device according to claim 11, wherein the optical device engages over the side surface of the housing body.
  13. Optoelectronic device according to a of claims 10 to 12, wherein the optical device is attached without interference on the housing body.
  14. Optoelectronic device according to one of claims 10 to 12, wherein a disposed between the optical device and the housing body Adhesive layer extends from a first side surface of the housing body to the main surface of the housing body.
  15. Optoelectronic device according to claim 14, wherein the adhesive layer is from a first side surface of the Housing body over the main surface to one the first side surface opposite second side surface of the housing body extends.
  16. Optoelectronic device according to claim 14 or 15, wherein the adhesive layer is a silicone, an epoxy or a mixture of a silicone and epoxide.
  17. Optoelectronic device according to one of claims 14 to 16, wherein the adhesive layer has a refractive index corresponding to the Refractive index of one on the side of the housing body adjacent to the adhesive layer Medium and the refractive index of one on the side of the optical Device adjacent medium or lies in between.
  18. Optoelectronic device according to one of claims 14 to 17, wherein the adhesive layer is formed bubble-free.
  19. Optoelectronic device according to claim 11 or one referring back to claim 11 Claim with an optical device according to claim 4 or a referred to claim 4 Claim, wherein by means of the first spacer, the radiation passage area of the optical device and the main surface of the housing body spaced from each other are.
  20. Optoelectronic device according to claim 11 or one referring back to claim 11 Claim with an optical device according to claim 5 or a refer back to claim 5 Claim, wherein by means of the second spacer, the side surface of the optical device and the side surface of the housing body spaced from each other are.
  21. Optoelectronic device according to one of claims 9 to 20, which is surface mountable.
  22. Optoelectronic device according to one of claims 9 to 21, which can be mounted by means of lead-free soldering is.
  23. Optoelectronic device according to one of claims 9 to 22, which is solderable at temperatures between 200 ° C and 260 ° C.
  24. Optoelectronic device according to one of claims 9 to 23, wherein the optoelectronic component is a radiation-emitting and / or radiation-receiving semiconductor body.
  25. Method for producing an optoelectronic Device according to one of the claims 14 to 24, with the steps: - Forming an optical Device according to one of the claims 1 to 8, - filling one the adhesive layer forming flowable material into the optical device, - Insert the device in the optical device.
  26. The method of claim 25, wherein when inserting of the device, the device in the adhesive layer forming material is pressed in such a way that the material at least partially on the side surface of the Housing body distributed.
  27. A method according to claim 25 or 26, wherein after Inserting the device, the adhesive layer forming material is cured.
  28. The method of claim 27, wherein in an overpressure environment hardened becomes.
  29. Method according to one of claims 25 to 27, wherein the Adhesive layer-forming material is filled in a vacuum environment.
  30. A method according to any one of claims 26 or 27, wherein the Bonding layer-forming material degassed before inserting the device becomes.
  31. The method of claim 30, wherein the adhesive layer forming material before curing is degassed.
DE102006037737A 2005-12-09 2006-08-11 Optical device, optoelectronic device and production method have optoelectronic device inserted into a recess in a trough structure in an optical device base region Withdrawn DE102006037737A1 (en)

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DE102005058901.4 2005-12-09
DE102006037737A DE102006037737A1 (en) 2005-12-09 2006-08-11 Optical device, optoelectronic device and production method have optoelectronic device inserted into a recess in a trough structure in an optical device base region

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