DE8801581U1 - - Google Patents

Info

Publication number
DE8801581U1
DE8801581U1 DE8801581U DE8801581U DE8801581U1 DE 8801581 U1 DE8801581 U1 DE 8801581U1 DE 8801581 U DE8801581 U DE 8801581U DE 8801581 U DE8801581 U DE 8801581U DE 8801581 U1 DE8801581 U1 DE 8801581U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8801581U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE8801581U priority Critical patent/DE8801581U1/de
Publication of DE8801581U1 publication Critical patent/DE8801581U1/de
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
DE8801581U 1988-02-08 1988-02-08 Expired DE8801581U1 (nl)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8801581U DE8801581U1 (nl) 1988-02-08 1988-02-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8801581U DE8801581U1 (nl) 1988-02-08 1988-02-08

Publications (1)

Publication Number Publication Date
DE8801581U1 true DE8801581U1 (nl) 1988-03-31

Family

ID=6820439

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8801581U Expired DE8801581U1 (nl) 1988-02-08 1988-02-08

Country Status (1)

Country Link
DE (1) DE8801581U1 (nl)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226816A1 (de) * 1992-08-13 1994-02-17 Licentia Gmbh Vorrichtung zur Wärmeableitung aus Gehäusen von integrierten Schaltungen
DE19515073A1 (de) * 1995-04-28 1996-10-31 Thomson Brandt Gmbh Klipp zum Befestigen von Elektronikbauelementen

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4226816A1 (de) * 1992-08-13 1994-02-17 Licentia Gmbh Vorrichtung zur Wärmeableitung aus Gehäusen von integrierten Schaltungen
DE19515073A1 (de) * 1995-04-28 1996-10-31 Thomson Brandt Gmbh Klipp zum Befestigen von Elektronikbauelementen

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