DE8800612U1 - - Google Patents

Info

Publication number
DE8800612U1
DE8800612U1 DE8800612U DE8800612U DE8800612U1 DE 8800612 U1 DE8800612 U1 DE 8800612U1 DE 8800612 U DE8800612 U DE 8800612U DE 8800612 U DE8800612 U DE 8800612U DE 8800612 U1 DE8800612 U1 DE 8800612U1
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8800612U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hluscu Anton Dipl-Ing 7530 Pforzheim De
Original Assignee
Hluscu Anton Dipl-Ing 7530 Pforzheim De
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hluscu Anton Dipl-Ing 7530 Pforzheim De filed Critical Hluscu Anton Dipl-Ing 7530 Pforzheim De
Priority to DE8800612U priority Critical patent/DE8800612U1/de
Publication of DE8800612U1 publication Critical patent/DE8800612U1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
DE8800612U 1988-01-20 1988-01-20 Expired DE8800612U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE8800612U DE8800612U1 (en) 1988-01-20 1988-01-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE8800612U DE8800612U1 (en) 1988-01-20 1988-01-20

Publications (1)

Publication Number Publication Date
DE8800612U1 true DE8800612U1 (en) 1988-04-07

Family

ID=6819743

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8800612U Expired DE8800612U1 (en) 1988-01-20 1988-01-20

Country Status (1)

Country Link
DE (1) DE8800612U1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19620194A1 (en) * 1996-05-20 1997-11-27 Gunter Dipl Ing Langer Arrangement for reducing electromagnetic radiation with circuit boards and other electronic circuit carriers
WO1998006243A1 (en) * 1996-07-31 1998-02-12 Dyconex Patente Process for producing connecting conductors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19620194A1 (en) * 1996-05-20 1997-11-27 Gunter Dipl Ing Langer Arrangement for reducing electromagnetic radiation with circuit boards and other electronic circuit carriers
WO1998006243A1 (en) * 1996-07-31 1998-02-12 Dyconex Patente Process for producing connecting conductors
US6486394B1 (en) 1996-07-31 2002-11-26 Dyconex Patente Ag Process for producing connecting conductors

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