DE820043C - Method of manufacturing selenium rectifier plates - Google Patents

Method of manufacturing selenium rectifier plates

Info

Publication number
DE820043C
DE820043C DEP4025A DE820043DA DE820043C DE 820043 C DE820043 C DE 820043C DE P4025 A DEP4025 A DE P4025A DE 820043D A DE820043D A DE 820043DA DE 820043 C DE820043 C DE 820043C
Authority
DE
Germany
Prior art keywords
selenium
plates
electric field
selenium rectifier
rectifier plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DEP4025A
Other languages
German (de)
Inventor
Kurt Dipl-Ing Kraemer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Application granted granted Critical
Publication of DE820043C publication Critical patent/DE820043C/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • H01L21/10Preliminary treatment of the selenium or tellurium, its application to the foundation plate, or the subsequent treatment of the combination
    • H01L21/101Application of the selenium or tellurium to the foundation plate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02623Liquid deposition
    • H01L21/02628Liquid deposition using solutions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Description

Verfahren zur Herstellung von Selengleichrichterplatten Das Auftragen dünner Schichten, wie sie für Selengleichrichterplatten angestrebt werden, hat man bisher auf verschiedene Weise versucht. Man hat Platten getaucht, man hat Selen durch Pinsel aufgetragen und schließlich hat man auch Selen aufgespritzt. Alle diese Verfahren haben Nachteile und erfüllen insbesondere nicht die Anforderungen, die gerade im Selengleichrichterbau gestellt werden.Method of manufacturing selenium rectifier plates Thinner layers, such as those striven for for selenium rectifier plates, are available tried so far in various ways. You dipped plates, you have selenium applied by brush and finally selenium was also sprayed on. All these Processes have disadvantages and in particular do not meet the requirements that are currently being used in selenium rectifier construction.

Das Tauchen verursacht nicht überall eine gleiche Schichtdicke; ferner ist es sehr schwierig, eine vorher festgelegte Schichtdicke zu erhalten. Das Aufstreichen mit Hilfe eines weichen Pinsels ergibt noch mehr Ungleichheiten in der Auftragungsstärke als das Tauchen. Selbst bei relativ kleinen Platten hat man Schwierigkeiten, Ungleichheiten in der Dicke zu vermeiden. Es ist erst recht hierbei schwierig, eine vorgeschriebene Schichtdicke zu erzielen. Verhältnismäßig günstiger erscheint noch das Spritzverfahren, obwohl es auch hierbei schwierig ist, eine vorgeschriebene Dicke zu erreichen. Vor allem aber bedeutet das Spritzen eine ungeheure Materialverschwendung, weil bei weitem nicht das gesamte verbrauchte Material auf den Flächen niedergeschlagen wird.Immersion does not cause the same layer thickness everywhere; further it is very difficult to obtain a predetermined layer thickness. The spreading with the help of a soft brush results in even more inequalities in the thickness of the application than diving. Even with relatively small plates you have difficulties, inequalities to avoid in thickness. It is all the more difficult to find a prescribed one To achieve layer thickness. The spraying process appears relatively cheaper, although it is difficult to achieve a prescribed thickness even here. before But above all, the spraying means an enormous waste of material, because with by far not all of the material used is deposited on the surfaces.

Für den Selengleichrichterbau liegen besondere schwierige Aufgaben vor. Einerseits soll der Widerstand der Selenschicht möglichst niedrig gehalten und demzufolge die Schichtdicke sehr gering sein, anderseits wird gefordert, daß die Schicht die notwendige Festigkeit gegen die elektrische Spannung aufweist, so daß also eine unbedingt gleichmäßig dichte Auflage notwendig ist, die noch dazu eine genau vorbestimmte Dicke haben soll. Ganz besondere Bedeutung hat hierbei auch die völlige Gleichmäßigkeit der Schichtdicke und Schichtdichte. Es gibt auch andere Anwendungsgebiete in der Elektrotechnik, bei denen eine sehr dünne, möglichst gleichmäßige Deckschicht angestrebt wird, wie z. B. bei Fotozellen. Aber hier würden gewisse Ungleichheiten keine Gefährdung der Brauchbarkeit haben, weil die Deckschicht nicht durch eine verhältnismäßig hohe elektrische Feldstärke beansprucht wird.There are particularly difficult tasks involved in building selenium rectifiers before. On the one hand, the resistance of the selenium layer should be kept as low as possible and consequently the layer thickness must be very small, on the other hand it is required that the layer has the necessary strength against the electrical voltage, so so that an absolutely evenly dense layer is necessary, which is also necessary should have a precisely predetermined thickness. Also has a very special meaning here the complete uniformity of the layer thickness and layer density. There are others Areas of application in electrical engineering, in which a very thin, as uniform as possible Top layer is aimed at, such as B. with photocells. But here would be certain inequalities have no endangerment of the usability, because the top layer is not through a relatively high electric field strength is claimed.

Um die verschiedenen, gerade für den Selengleichrichterbau gestellten Bedingungen zu erfüllen, werden bei einem Verfähren gemäß der Erfindung zur Herstellung von Selengleichrichterplatten die Platten in ein elektrisches Feld gebracht, und Selen wird in kolloidaler Form trocken oder in vorzugsweise wäßriger Dispersion durch das elektrische Feld auf den Platten niedergeschlagen. Die Herstellung eines kolloidalen feinen Selenpulvers oder auch einer Dispersion eines solchen Pulvers, z. B. in Wasser, kann mit bekannten Mitteln oder auch durch Ultraschall bewirkt werden. Es empfehlen sich aber vor allem bei dem trockenen Verfahren, bei dem also kolloidaler Selenstaub durch das elektrische Feld auf den Platten niedergeschlagen wird, besondere Vorsichtsmaßnahmen, um die Luft, welche den Feldraum füllt, von Staub und sonstigen Fremdkörpern freizuhalten. Die ganze Feldanordnung wird zweckmäßig in einem Glaskolben oder in einem mit Fenstern versehenen Gehäuse untergebracht, und die Verbindung mit der Außenluft soll nur durch Filter, zweckmäßig durch ölige Filter, möglich sein, welche nach einmaligem oder mehrmaligem Durchsaugen der Luft sämtliche Unreinigkeiten der Luft an sich binden. Die Erzeugung einer bestimmten Schichtdicke und einer bestimmten Dichte oder Porosität der Schicht kann man in üblicher Weise durch Regelung des elektrischen Feldes, der Zeitdauer und durch die Kornfeinheit des Selenstaubes vorher bestimmen.To the different, just provided for the selenium rectifier construction To meet conditions are in a method according to the invention for production The plates are brought into an electric field by selenium rectifier plates, and Selenium is dry in colloidal form or preferably in an aqueous dispersion deposited on the plates by the electric field. The making of a colloidal fine selenium powder or a dispersion of such a powder, z. B. in water, can be effected by known means or by ultrasound will. However, it is particularly recommended for the dry process, i.e. for the colloidal selenium dust deposited on the plates by the electric field Take special precautions to avoid the air that fills the field space Keep dust and other foreign bodies free. The whole field arrangement becomes appropriate housed in a glass bulb or in a windowed housing, and the connection with the outside air should only be through filters, expediently through oily ones Filters, which can be used after the air has been sucked through once or several times bind all impurities in the air. The generation of a certain Layer thickness and a certain density or porosity of the layer can be in Usually by regulating the electric field, the duration and the Determine the grain fineness of the selenium dust beforehand.

Claims (2)

PATENTANSPRÜCHE: i. Verfahren zur Herstellung von Selengleichrichterplatten, dadurch gekennzeichnet, daß die Platten in ein elektrisches Feld gebracht werden und daß Selen in kolloidaler Form trocken oder in vorzugsweise wäßriger Dispersion in das elektrische Feld geleitet wird. PATENT CLAIMS: i. Process for the production of selenium rectifier plates, characterized in that the plates are brought into an electric field and that selenium in colloidal form, dry or in preferably aqueous dispersion, is passed into the electric field. 2. Vorrichtung zur Durchführung des Verfahrens nach Anspruch i, dadurch gekennzeichnet, daß für die Anwendung trockenen Selenstaubes die das elektrische Feld erzeugende Anordnung nur über staubbindende Luftfilter mit der Raumluft in Verbindung steht. Angezogene Druckschriften: Deutsche Patentschriften Nr. 5o8 375, 643 474, 725286. 2. Apparatus for carrying out the method according to claim i, characterized in that for the application of dry selenium dust, the arrangement generating the electric field is only in contact with the room air via dust-binding air filters. Cited publications: German patent specifications No. 508 375, 643 474, 725286.
DEP4025A 1949-09-02 Method of manufacturing selenium rectifier plates Expired DE820043C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE820043T 1949-09-02

Publications (1)

Publication Number Publication Date
DE820043C true DE820043C (en) 1951-11-08

Family

ID=7359224

Family Applications (1)

Application Number Title Priority Date Filing Date
DEP4025A Expired DE820043C (en) 1949-09-02 Method of manufacturing selenium rectifier plates

Country Status (1)

Country Link
DE (1) DE820043C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2234665A1 (en) * 1973-06-19 1975-01-17 Int Standard Electric Corp

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE508375C (en) * 1925-12-07 1930-09-27 American Mach & Foundry Process and device for the production of metal coatings
DE643474C (en) * 1935-10-10 1937-04-08 Ludwig Veit Hand-operated device for sewing machines for producing a hemstitch seam
DE725286C (en) * 1938-09-28 1942-09-18 Aeg Process for the production of the semiconductor layer of selenium dry rectifiers or photocells

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE508375C (en) * 1925-12-07 1930-09-27 American Mach & Foundry Process and device for the production of metal coatings
DE643474C (en) * 1935-10-10 1937-04-08 Ludwig Veit Hand-operated device for sewing machines for producing a hemstitch seam
DE725286C (en) * 1938-09-28 1942-09-18 Aeg Process for the production of the semiconductor layer of selenium dry rectifiers or photocells

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2234665A1 (en) * 1973-06-19 1975-01-17 Int Standard Electric Corp

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