DE8122562U1 - Circuit board for communications engineering - Google Patents

Circuit board for communications engineering

Info

Publication number
DE8122562U1
DE8122562U1 DE19818122562 DE8122562U DE8122562U1 DE 8122562 U1 DE8122562 U1 DE 8122562U1 DE 19818122562 DE19818122562 DE 19818122562 DE 8122562 U DE8122562 U DE 8122562U DE 8122562 U1 DE8122562 U1 DE 8122562U1
Authority
DE
Germany
Prior art keywords
circuit board
communications engineering
conductor tracks
enamelled
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19818122562
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19818122562 priority Critical patent/DE8122562U1/en
Publication of DE8122562U1 publication Critical patent/DE8122562U1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H05K7/08—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses on perforated boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Description

t t I t t I

SIEMENS AKTIENGESELLSCHAFT Unser Zeichen Berlin und München VPA 81 G 6 4 9 8 DESIEMENS AKTIENGESELLSCHAFT Our mark Berlin and Munich VPA 81 G 6 4 9 8 DE

Leiterplatte für die NachrichtentechnikCircuit board for communications engineering

Die Neuerung bezieht sich auf eine Leiterplatte für die Nachrichtentechnik, die aus einem Stahlblech besteht, das eine emaillierte Schicht trägt, auf die Leiterbahnen und gegebenenfalls weitere Bauelemente aufgebracht sind.The innovation relates to a circuit board for communications technology, which consists of sheet steel, which carries an enamelled layer, applied to the conductor tracks and possibly other components are.

Solche emaillierte Substrage aus Stahlblech sind bekannt. Es werden oft Schaltungsplatten benötigt, die mehrdimensional abgewinkelt angeordnet sind.Such enamelled substrates made of sheet steel are known. Circuit boards are often needed that are arranged at an angle in several dimensions.

Der Neuerung liegt die Aufgabe zugrunde, bei einem solchen Substrat eine einfache Bauart hierfür anzugeben . The object of the innovation is to provide a simple type of construction for such a substrate.

Diese Aufgabe wird neuerungsgemäß dadurch gelöst, daß zum Zwecke des Abwinkeins von Teilen dieser Leiterplatte an den Biegestellen anstelle der emaillierten Schicht sich eine Perforation befindet und die Leiterbahnen dort über angelötete flexible Verbindungselemente wie Bandleitungen und dergleichen verbunden sind.This object is achieved according to the invention in that for the purpose of bending parts of this circuit board at the bending points instead of the enamelled ones Layer there is a perforation and the conductor tracks there via soldered-on flexible connecting elements how ribbon lines and the like are connected.

Es ist dadurch auf einfache Weise ein dreidimensionaler Schaltungsaufba.u möglich.A three-dimensional circuit structure is thereby possible in a simple manner.

Nachstehend wird anhand von zwei Figuren die Neuerung erläutert.The innovation is explained below with the aid of two figures.

Figur 1 zeigt eine perspektivische Anordnung im abgewinkelten Zustand der Schaltungsplatte,Figure 1 shows a perspective arrangement in the angled state of the circuit board,

Gz 1 PhI / 31.7.1981Gz 1 PhI / July 31, 1981

- 2 - VPA 81G 6 4 9 3 DE- 2 - VPA 81G 6 4 9 3 DE

Figur 2 zeigt eine Draufsicht auf die Schaltungsplatte im gestreckten Zustand.Figure 2 shows a plan view of the circuit board in the stretched state.

Die Schaltungsplatte 1 ist an den später für Abweichungen vorgesehenen Linien mit Perforationslöchern 2 versehen. Zweckmäßig sind dafür beim Beschichten der Schaltungsplatte mit Emaille die entsprechenden Flächen um die Löcher frei von Emailleschicht gehalten. Eventuelle Durchkontaktierungslöcher 2a können ebenfalls bereits vor dem Emaillieren ebenso wie die Perforierungen im Blechträger vorgesehen sein. Auf die Emaillierschicht sind nach üblichen Verfahren Leiterbahnen 3 aufgebracht und gegebenenfalls Widerstands- oder Kapazität s strukturen 4, 5. Im ausgestreckten Zustand kann die Schaltungsplatte dann auch noch mit Hybridschaltungen versehen werden, um zusätzliche Bauelemente, zum Beispiel durch ein Reflow-Lötverfahren mit der Schaltung zu verbinden. Nach, dem AbbiegeVorgang an den Perforationen werden die Enden der gegenüberliegenden Leiterbahnen durch flexible Verbindungselemente 7 zum Beispiel durch eine flexible Verdrahtung miteinander verlötet.Es besteht so eine einstückige dreidimensionale Leiterplatte, wenn, wie gezeigt, die Elemente 6 gegen die Grundplatte 1 abgebogen werden.The circuit board 1 is attached to the later for discrepancies provided lines with perforation holes 2. These are useful when coating the circuit board The corresponding areas around the holes were kept free of the enamel layer with enamel. Eventual Via holes 2a can also be made before enamelling, as can the perforations in the Sheet metal support can be provided. Conductor tracks 3 are applied to the enamel layer using conventional methods and optionally resistance or capacitance s structures 4, 5. In the extended state, can the circuit board can then also be provided with hybrid circuits in order to add additional components, for example by a reflow soldering process with the Connect circuit. After the turning process The perforations are the ends of the opposing conductor tracks by flexible connecting elements 7 soldered together, for example, using flexible wiring Circuit board when, as shown, the elements 6 are bent against the base plate 1.

2 Figuren2 figures

1 Schutzanspruch1 right to protection

Claims (1)

•t·· t• t ·· t « · rf·«· Rf · - 3 - VPA 81 G 6 <>· 9 3 DE- 3 - VPA 81 G 6 <> 9 3 DE SchutzanspruchClaim to protection Leiterplatte für die Nachrichtentechnik, die aus einem Stahlblech besteht, das eine emaillierte Schicht trägt, auf die Leiterbahnen und gegebenenfalls weitere Bauelemente aufgebracht sind, dadurch gekennzeichnet , daß zum Zwecke des Abwinkeins von Teilen dieser Leiterplatte an den Biegestellen anstelle der emaillierten Schicht sich eine Perforation.befindet und die Leiterbahnen dort über angelötete flexible Verbindungselemente wie 3andleitungen und dergleichen verbunden sind.Circuit board for communications engineering, made from a sheet of steel bearing an enamelled layer, are applied to the conductor tracks and optionally other components, characterized that for the purpose of bending parts of this circuit board at the bending points instead There is a perforation in the enamelled layer and the conductor tracks are connected there via soldered-on flexible connecting elements such as 3and lines and the like are.
DE19818122562 1981-07-31 1981-07-31 Circuit board for communications engineering Expired DE8122562U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19818122562 DE8122562U1 (en) 1981-07-31 1981-07-31 Circuit board for communications engineering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19818122562 DE8122562U1 (en) 1981-07-31 1981-07-31 Circuit board for communications engineering

Publications (1)

Publication Number Publication Date
DE8122562U1 true DE8122562U1 (en) 1981-12-03

Family

ID=6730008

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19818122562 Expired DE8122562U1 (en) 1981-07-31 1981-07-31 Circuit board for communications engineering

Country Status (1)

Country Link
DE (1) DE8122562U1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010025591A1 (en) * 2010-06-29 2011-12-29 Conti Temic Microelectronic Gmbh Sensor carrier and sensor module in particular for use in a motor vehicle suburb control unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010025591A1 (en) * 2010-06-29 2011-12-29 Conti Temic Microelectronic Gmbh Sensor carrier and sensor module in particular for use in a motor vehicle suburb control unit

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