DE7729539U1 - ELECTRONIC COMPONENT - Google Patents
ELECTRONIC COMPONENTInfo
- Publication number
- DE7729539U1 DE7729539U1 DE7729539U DE7729539U DE7729539U1 DE 7729539 U1 DE7729539 U1 DE 7729539U1 DE 7729539 U DE7729539 U DE 7729539U DE 7729539 U DE7729539 U DE 7729539U DE 7729539 U1 DE7729539 U1 DE 7729539U1
- Authority
- DE
- Germany
- Prior art keywords
- electronic component
- heat sink
- opening
- carrier
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
Description
BLAUPUNKT-WERKE GMBH « h.los.heim. .«,.»,μ,.*.«»«, «οBLAUPUNKT-WERKE GMBH «h.los.heim. . «,.», μ,. *. «» «,« Ο
PLI/Gebranzig-wf/texl - 1 - 20. September 1977PLI / Gebranzig-wf / texl - 1 - September 20, 1977
R.Nr. 1518R.No. 1518
Die vorliegende Erfindung betrifft ein elektronisches Bauelement nach dem Oberbegriff von Anspruch 1.The present invention relates to an electronic component according to the preamble of claim 1.
Zur Miniaturisierung elektronischer Schaltkreise werden Halbleiterbauelemente direkt auf einem mit Leitungsbahnen versehenen Träger festgelegt und durch sogenanntes Bonden mit den Leitungsbahnen elektrisch verbunden. Die beim Betrieb der Halbleiterbauelemente als Wärme auftretende Verlustleistung wird über den Träger abgeführt.Semiconductor components are used to miniaturize electronic circuits fixed directly on a carrier provided with conductor tracks and electrically by so-called bonding with the conductor tracks connected. The power loss that occurs as heat during operation of the semiconductor components is dissipated via the carrier.
Dabei hat es sich jedoch als nachteilig erwiesen, daß in dieser Weise aufgebaute elektronische Schaltkreise nur für Halbleiterbauelemente mit kleinen Verlustleistungen geeignet sind. Bei höheren Verlustleistungen ist die Wärmeableitung über die Träger aufgrund ihrer zu geringen Wärmeleitwerte unzureichend. Somit werden die Halbleiterbauelemente derartiger elektronischer Schaltkreise häufig durch Überschreiten der zulässigen Betriebstemperaturen zerstört.However, it has proven to be disadvantageous in this way built-up electronic circuits are only suitable for semiconductor components with low power losses. At higher power losses the heat dissipation via the carrier is insufficient due to their inadequate thermal conductivity. Thus, the semiconductor components Such electronic circuits are often destroyed by exceeding the permissible operating temperatures.
Es stellt sich daher die Aufgabe, ein mit auf der Oberseite eines Trägeis angeordneten Leitungsbahnen verbundenes elektronisches Bauelement zu entwickeln, bei dem auch große Verlustleistungen abgeführt werden können und durch damit verbundene geringe Betriebstemperaturen eine Schädigung des elektronischen Bauelements vermieden wird.There is therefore the task of having one with on top of an inertia to develop electronic components connected to arranged conductor paths, in which large power losses can also be dissipated and the associated low operating temperatures avoid damage to the electronic component.
Diese Aufgabe wird gemäß der vorliegenden Erfindung dadurch gelöst, daß in dem Träger ein Durchbruch vorgesehen ist, in den das elektronische Bauelement einfügbar ist, an der Unterseite des Trägers ein den Durchbruch überdeckender Kühlkörper festgelegt ist und das elektronische Bauelement im Durchbruch auf dem Kühlkörper befestigt ist.This object is achieved according to the present invention in that an opening is provided in the carrier, into which the electronic component can be inserted, and an opening is provided on the underside of the carrier overlapping heat sink is set and the electronic component is fastened in the opening on the heat sink.
7729539 19.Ol787729539 19.Ol78
BLAUPUNKT-WERKE GMBH » hild«he.m. Rob.rt.Β.*.««a»BLAUPUNKT-WERKE GMBH "hild" he.m. R if. Rt .Β. *. "" A "
PLlfGebranzig-wf/texl - 2 - 20. September 1977PLlfGebranzig-wf / texl - 2 - September 20, 1977
R.Nr. 1518R.No. 1518
Dabei ist der Kühlkörper in vorteilhafter Weise gemäß der Erfindung am Rand des Durchbruchs mit dem Träger verklebt.The heat sink is advantageously according to the invention on Edge of the opening glued to the carrier.
In einer vo teilhaften Ausbildung der Erfindung irt das elektronische Bauelement im Durchbruch auf dem Kühlkörper festgeklebt.In a vo part embodiment of the invention, the electronic irt Component glued to the heat sink in the opening.
Bei einer weiteren vorteilhaften Ausgestaltung der Erfindung weist der Kühlkörper einen in den Durchbruch einpaßbaren Plateaubereich auf und das elektronische Bauelement --«■ auf diesem Plateaubereich festgelegt.In a further advantageous embodiment of the invention, the Heat sink on a plateau area that can be fitted into the opening, and the electronic component is fixed on this plateau area.
Dazu ist es günstig, den Kühlkörper als Kühlblech auszubilden.For this purpose, it is beneficial to design the heat sink as a cooling plate.
Zum Schutz vor störenden mechanischen und chemischen Einflüssen werden das elektronische Bauelement und dessen Anschlußdrähte mit einer isolierenden Abdeckmasse überdeckt.To protect against disruptive mechanical and chemical influences the electronic component and its connecting wires are covered with an insulating covering compound.
Die Vorteile der vorliegenden Erfindung sind insbesondere darin zu sehen, daß bei einer äußerst wirksamen Kühlung des elektronischen Bauelements der Kühlkörper aufgrund seiner Anordnung auf der Unterseite des Trägers die Möglichkeiten des Aufbaus der elektronischen Schaltung auf der Oberseite des Trägers nicht einschränkt. Der Kühlkörper kann dabei in Form und Größe nahezu beliebig gestaltet werden. Darüber hinaus kann ein erfindungsgemäßes elektronisches Bauelement vor dem Verguß mit der isolierenden Abdeckmasse unter Betriebsbedingungen, also im Leistungsbetrieb, erprobt werden, da über den Kühlkörper die gesamte Verlustleistung abgeführt wird. Ein möglicherweise defektes elektronisches Bauelement kann mit dem Kühlkörper aus lern Träger herausgedrückt und durch ein technisch einwandfreies Bauelement ersetzt werden.The advantages of the present invention are particularly to be seen in the fact that, with extremely effective cooling of the electronic component, the heat sink does not restrict the possibilities of constructing the electronic circuit on the upper side of the carrier due to its arrangement on the underside of the carrier. The heat sink can be designed in almost any shape and size. In addition, an electronic component according to the invention can be tested prior to encapsulation with the insulating covering compound under operating conditions, that is to say in power mode, since the entire power loss is dissipated via the heat sink. A possibly defective electronic component can be pushed out of the carrier with the heat sink and replaced by a technically flawless component.
7723539 m Ol 787723539 m Ol 78
PLI/Gebranzig-wf/texl - 3 - 20. September 1977PLI / Gebranzig-wf / texl - 3 - September 20, 1977
R.Nr. 1518R.No. 1518
Nachfolgend wird die Erfindung an einer Figur, in der ein in den Durchbruch eines Trägers eingefügtes und auf einem Kühlkörper befestigtes elektronisches Bauelement im Querschnitt dargestellt ist, näher erläutert.The invention is based on a figure in which a in the breakthrough a carrier inserted and attached to a heat sink electronic component is shown in cross section, explained in more detail.
Dabei Dedeutet 1 den mit einem Durchbruch 2 versehenen Träger, auf dem Leitungsbahnen 8 festgelegt sind. An der Unterseite des Trägers 1 ist der Kühlkörper 4 beispielsweise durch Kleben befestigt. Der Kühlkörper sollte zur Vermeidung von bei einem Temperaturwechsel auftretenden Verspannungen nur am Rand des Durchbruchs 2 mit dem Träger 1 verklebt werden. Der Kühlkörper 4 weist einen in den Durchbruch 2 des Trägers 1 hineinragenden Plateaubereich 5 auf. Das elektronische Bauelement 3 ist auf diesem Plateaubereich 5 beispielsweise durch Kleben festgelegt. Durch die Festlegung des elektronischen Bauelements 3 auf dem Plateaubereich liegt dieses auf einer Höhe relativ zu den Leitungsbahnen 8, die ein übliches Bonden zur Verbindung des elektronischen Bauelements 3 mit den Leitungsbahnen 8 über Anschlußdrähte 6 ermöglicht.1 indicates the carrier provided with an opening 2 on which Line tracks 8 are set. The heat sink 4 is attached to the underside of the carrier 1, for example by gluing. The heat sink should to avoid tension that occurs when the temperature changes be glued to the carrier 1 only at the edge of the opening 2. The heat sink 4 has an opening 2 in the carrier 1 protruding plateau area 5. The electronic component 3 is fixed on this plateau area 5, for example by gluing. Through the fixing of the electronic component 3 on the plateau area, this is at a level relative to the conductor tracks 8, which are a usual bonding to connect the electronic component 3 with the Conductor tracks 8 via connecting wires 6 enables.
Das elektronische Bauelement 3 und seine Anschlußdrähte 6 werden nach -^ einem Funktionstest unter üblichen Betriebsbedingungen mit einer elektrisch isolierenden Abdeckmasse 7 überdeckt. Hierfür sind unter Wärmeeinwirkung aushärtende zweikomponentige Kunstharze besonders gut geeignet. Die Abdeckmasse 7 schützt das elektronische Bauelement 3 und ; die Anschlußdrähte 6 vor störenden mechanischen und chemischen Einwirkungen .The electronic component 3 and its connecting wires 6 are after - ^ a function test under normal operating conditions with an electrical insulating covering compound 7 covered. Two-component synthetic resins that harden under the action of heat are particularly suitable for this. The covering compound 7 protects the electronic component 3 and; the connecting wires 6 against disruptive mechanical and chemical effects .
7729539 19.01787729539 19.0178
PLI/Gebranzig-wf/texl - 4 - 20. September 1977PLI / Gebranzig-wf / texl - 4 - September 20, 1977
R.Nr. 1518R.No. 1518
Als Kühlkörper sind insbesondere Kühlbleche aus Kupfer und Aluminium gut geeignet. Durch eine geeignete, die Oberfläche vergrößernde Formgebung der Kiihlbleche kann die Wärmeabfuhr durch Konvektion und Strahlung erhöht werden. Zur Verbesserung der Wärmeabstrahlung des Kühlköifpers 3 kann dessen Emissionsvermögen durch eine entsprechende Färbung der Oberfläche erhöht werden.In particular, cooling plates made of copper and aluminum are used as heat sinks well suited. With a suitable shape of the cooling plates that increases the surface area, heat can be dissipated by convection and Radiation increased. To improve the heat radiation of the Kühlköifpers 3 can its emissivity by a corresponding Coloring of the surface can be increased.
Darüber hinaus sind auch Kühlkörper aus keramischen Materialien, insbesondere aus Metalloxyden, zur Kühlung von elektronischen Bauelementen mit hohen Verlustleistungen geeignet.In addition, heat sinks made of ceramic materials, in particular made of metal oxides, suitable for cooling electronic components with high power losses.
772 9b 33 19.01.78772 9b 33 1/19/78
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE7729539U DE7729539U1 (en) | 1977-09-23 | 1977-09-23 | ELECTRONIC COMPONENT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE7729539U DE7729539U1 (en) | 1977-09-23 | 1977-09-23 | ELECTRONIC COMPONENT |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE7729539U1 true DE7729539U1 (en) | 1978-01-19 |
Family
ID=6682934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE7729539U Expired DE7729539U1 (en) | 1977-09-23 | 1977-09-23 | ELECTRONIC COMPONENT |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE7729539U1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4017697C2 (en) * | 1990-06-01 | 2003-12-11 | Bosch Gmbh Robert | Electronic component, process for its production and use |
-
1977
- 1977-09-23 DE DE7729539U patent/DE7729539U1/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4017697C2 (en) * | 1990-06-01 | 2003-12-11 | Bosch Gmbh Robert | Electronic component, process for its production and use |
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