DE7130329U - Electrical conductor arrangement - Google Patents

Description

DEUTSCHE ITT INDUSTRIES GESELLSCHAFT LIMITED LIABILITY

FREIBURG I.B.

Electrical conductor arrangement

The priority of the application dated August 13, 1970 in Great Britain is used.

The invention relates to an electrical conductor arrangement with contacting surfaces for electrical components. It is characterized according to the invention by a plurality of parallel spaced conductor layers in a block of insulating material , the contacting surfaces of which are exposed at the ends of the conductor layers on at least a first surface side of the block in a normal area to the surface of the conductor layers.

A preferred embodiment of the invention is explained below with reference to the drawing, in which

Fig. 1

a perspective view of a partially wired electrical circuit arrangement with an electrical conductor arrangement according to the invention and

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713032910.10.74

R.B.W. Cooke et al 13-3 Fl 679

Fig. 2 is a perspective partial view of a conductor layer with a plurality of Illustrate Leiusrsügsft.

A block 1 of electrically insulating material contains a plurality of parallel spaced conductor layers 2, each consisting of a profiled conductor run with a connecting conductor run 3 extending in the longitudinal direction within the block and with si ch perpendicular to the connecting conductor run 3 at a distance from each other Conductor parts 4 which end in alignment on the front surface 5 of the block 1, forming contacting surfaces 6 arranged in columns.

Each of the connecting conductor tracks 3 has a further individual tab conductor 7 which is perpendicular to the former and extends opposite to the conductor parts 4 in order to extend over the rear surface side 8 of the block to raise.

Successive conductor layers 2 have their tab conductors 7 arranged in different positions to the length of the connecting conductor line 3, so that the tab conductor 7 on the rear surface side 8 are staggered.

The number of conductor layers in the block is given by the number of contact surfaces required for each column. In the present embodiment, there are 35 such conductor layers, all of which are not shown and each have a thickness of 75 »µm with a uniform thickness of the insulating material between adjacent conductor layers, available.

As Figure 1 illustrates, the front surface side rises 5 of the block at each column of the contact

7130329 io.io.74 -3-

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I ■ · · · ■ · 13-3 Indentations Fl 679 / - - 3 -. intervening Substrate thickness the front 1 R.D.W. Cooke et al the about the the areas over the for an amount

semiconductor solid-state circuits to be fed and corrected is equivalent to.

In the present embodiment, the solid-state circuits are 10 matrices of 5x7 light emitting diodes, where each matrix at the edge 35 has pads II.

Each solid-state circuit 10 is arranged on a different remote part 9. The individual wires 12 are somehow fastened between the connection pad 13 and the matching one of the contacting surfaces 8. An automatic connection is facilitated because the two sets of connectors are substantially coplanar.

The external connections are attached ar \ exiting from the rear surface side of the block 1 L ^ rule manager. 7 These tab conductors 7 can also end in alignment on the rear surface side 8.

7130329 ig.io.74

Claims (8)

Ι »Electrical conductor arrangement with contacting surfaces for electrical components, characterized by a plurality of parallel spaced apart in one Block (1) of insulating material arranged conductor layers (2), the contact surfaces (6) on the Ends of the conductor layers (2) on at least a front surface side of the block (1) in one Normal surface to the surface of the conductor layers (2) are exposed. 2. Electrical conductor arrangement according to claim 1, characterized characterized in that the contact surfaces (6) on the ends of the conductor layers (2) on a surface side of the block (1) are arranged in columns. 3. An electrical conductor arrangement according to claim 2, characterized in that the parts of the surface side of the block (I) surrounding the column of contacting surfaces (6) rise above the parts (9) in between. 4. Electrical conductor arrangement according to claims 1, 2 or 3, characterized in that each of the conductor layers (2) a connecting conductor run (3) within the block (1) contains parallel to the normal surface, which connects a plurality of spaced conductor parts (4), which extend perpendicular to the connecting conductor run (3) and which are aligned on the normal surface end up. 713032910.10.74 -5- Deutsche ITT Ind. GmbH June 11, 1974 New page 5 (replaces original page 5) 5. Electrical conductor arrangement according to claim 4, characterized in that that each of the conductor layers (2) has a single tab conductor (7) which extends perpendicularly from the connecting Conductor run (3) opposite to the conductor parts (4) extends and in alignment on the rear surface side of the block (1) opposite to the front surface side of the block (1) ends or rises above it. 6. Electrical conductor arrangement according to claim 5, characterized in that that the tab conductors (7) are staggered on the rear surface side of the block (1). 7. Electrical conductor arrangement according to claims 1 to 6, characterized in that at least one solid-state circuit (10) on the front surface side of the block (1) in a recess (9), the depth of which is approximately equal to the substrate thickness, is arranged. 8. Electrical conductor arrangement according to one of claims 1 to 7, characterized in that light-emitting semiconductor diodes are arranged in a matrix on the front surface side of the block (1). 713032910.10.74