DE69921893D1 - Leitfähige Pastenzusammensetzung zum Füllen - Google Patents

Leitfähige Pastenzusammensetzung zum Füllen

Info

Publication number
DE69921893D1
DE69921893D1 DE69921893T DE69921893T DE69921893D1 DE 69921893 D1 DE69921893 D1 DE 69921893D1 DE 69921893 T DE69921893 T DE 69921893T DE 69921893 T DE69921893 T DE 69921893T DE 69921893 D1 DE69921893 D1 DE 69921893D1
Authority
DE
Germany
Prior art keywords
filling
conductive paste
paste composition
composition
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69921893T
Other languages
English (en)
Other versions
DE69921893T2 (de
Inventor
Masatoshi Suehiro
Nobuaki Morishima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoto Elex Co Ltd
Original Assignee
Kyoto Elex Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoto Elex Co Ltd filed Critical Kyoto Elex Co Ltd
Application granted granted Critical
Publication of DE69921893D1 publication Critical patent/DE69921893D1/de
Publication of DE69921893T2 publication Critical patent/DE69921893T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
DE69921893T 1998-06-19 1999-06-17 Leitfähige Pastenzusammensetzung zum Füllen Expired - Lifetime DE69921893T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP17304798 1998-06-19
JP17304798 1998-06-19

Publications (2)

Publication Number Publication Date
DE69921893D1 true DE69921893D1 (de) 2004-12-23
DE69921893T2 DE69921893T2 (de) 2005-11-24

Family

ID=15953236

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69921893T Expired - Lifetime DE69921893T2 (de) 1998-06-19 1999-06-17 Leitfähige Pastenzusammensetzung zum Füllen

Country Status (3)

Country Link
US (1) US6080336A (de)
EP (1) EP0965997B1 (de)
DE (1) DE69921893T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881240B2 (en) * 2000-09-18 2005-04-19 Dowa Mining Co., Ltd. Copper powder for electrically conductive paste
US6749775B2 (en) * 2002-01-29 2004-06-15 Cts Corporation Conductive via composition
US20040094751A1 (en) * 2002-03-25 2004-05-20 Toshiaki Ogiwara Composition for filling through-holes in printed wiring boards
CA2464153A1 (en) * 2003-04-14 2004-10-14 Integral Technologies, Inc. Low cost lighting circuits manufactured from conductive loaded resin-based materials
TWI336608B (en) * 2006-01-31 2011-01-21 Sony Corp Printed circuit board assembly and method of manufacturing the same
WO2008120755A1 (ja) * 2007-03-30 2008-10-09 Nec Corporation 機能素子内蔵回路基板及びその製造方法、並びに電子機器
US20110290540A1 (en) * 2010-05-25 2011-12-01 Samsung Electro-Mechanics Co., Ltd. Embedded printed circuit board and method of manufacturing the same
CN104575664A (zh) * 2014-12-23 2015-04-29 合肥中南光电有限公司 一种高附着力的导电银浆
US9633883B2 (en) 2015-03-20 2017-04-25 Rohinni, LLC Apparatus for transfer of semiconductor devices
US10141215B2 (en) 2016-11-03 2018-11-27 Rohinni, LLC Compliant needle for direct transfer of semiconductor devices
US10504767B2 (en) 2016-11-23 2019-12-10 Rohinni, LLC Direct transfer apparatus for a pattern array of semiconductor device die
US10471545B2 (en) 2016-11-23 2019-11-12 Rohinni, LLC Top-side laser for direct transfer of semiconductor devices
US10062588B2 (en) 2017-01-18 2018-08-28 Rohinni, LLC Flexible support substrate for transfer of semiconductor devices
US10410905B1 (en) 2018-05-12 2019-09-10 Rohinni, LLC Method and apparatus for direct transfer of multiple semiconductor devices
US11094571B2 (en) 2018-09-28 2021-08-17 Rohinni, LLC Apparatus to increase transferspeed of semiconductor devices with micro-adjustment
US11905388B2 (en) * 2019-08-23 2024-02-20 Adeka Corporation Resin composition, method for forming cured product, and cured product
US11437162B2 (en) 2019-12-31 2022-09-06 Industrial Technology Research Institute Conductive material composition and conductive material prepared therefrom

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6167702A (ja) * 1984-09-07 1986-04-07 Mitsui Mining & Smelting Co Ltd 導電性粉末及びこれを用いた導電性組成物
JPH01231208A (ja) * 1988-03-11 1989-09-14 Toshiba Chem Corp 導電性ペースト
JP2584424B2 (ja) * 1988-03-31 1997-02-26 東芝ケミカル株式会社 樹脂封止型半導体装置
JPH0367402A (ja) * 1989-08-03 1991-03-22 Toagosei Chem Ind Co Ltd 導電性組成物
JPH06336563A (ja) * 1993-04-02 1994-12-06 Showa Denko Kk 導電性塗料
US5652042A (en) * 1993-10-29 1997-07-29 Matsushita Electric Industrial Co., Ltd. Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
WO1996024938A1 (fr) * 1995-02-08 1996-08-15 Hitachi Chemical Co., Ltd. Poudre composite conductrice, pate conductrice, procede de production de cette pate, circuit electrique et son procede de fabrication
JPH08218006A (ja) * 1995-02-17 1996-08-27 Hitachi Chem Co Ltd 導電性ペースト

Also Published As

Publication number Publication date
DE69921893T2 (de) 2005-11-24
US6080336A (en) 2000-06-27
EP0965997B1 (de) 2004-11-17
EP0965997A1 (de) 1999-12-22

Similar Documents

Publication Publication Date Title
DE69921893D1 (de) Leitfähige Pastenzusammensetzung zum Füllen
GB2350303B (en) Desiccation electrode
DE69903248T2 (de) Leitfähige zusammensetzung
ID26186A (id) Komposisi sampo
ID28694A (id) Komposisi sampo
DE60138795D1 (de) Leitfähige Tintenzusammensetzung
ID26720A (id) Komposisi oral
DE59909242D1 (de) Referenzelektrode
ATE241597T1 (de) Geruchsmaskierte dimethylsulfid-zusammensetzung
GB2348206B (en) Photosensitive conductive paste
DE69903405T2 (de) Material für elektrode
GB9826596D0 (en) Conductive materials
DE60040168D1 (de) Fluorelastomer-zusammensetzung zum vernetzen
DE69942892D1 (de) Gaserzeugende zusammensetzung
DE69936208D1 (de) Modifiziermittel enthaltende zusammensetzung
DE69907084D1 (de) Dielektrische Porzellanzusammensetzung
HUP0203648A3 (en) Pharmaceutical compositions for ulcer
FR2782522B1 (fr) Composition hydrofuge
DE69901248T2 (de) Zusammensetzung zum abschrecken von schädlingen
DE69902472T2 (de) Zusammemsetzung zum fernhalten von ungeziefer
DE59908797D1 (de) Befülleinrichtung
GB9910087D0 (en) Solder paste tester
ID26295A (id) Komposisi keras-ultraviolet
DE60013868D1 (de) Leitfähige zusammensetzung
GB2363521B (en) Conductive paste

Legal Events

Date Code Title Description
8364 No opposition during term of opposition