DE69811069D1 - Verfahren und vorrichtung zum verbinden zweier millimeterelemente - Google Patents

Verfahren und vorrichtung zum verbinden zweier millimeterelemente

Info

Publication number
DE69811069D1
DE69811069D1 DE69811069T DE69811069T DE69811069D1 DE 69811069 D1 DE69811069 D1 DE 69811069D1 DE 69811069 T DE69811069 T DE 69811069T DE 69811069 T DE69811069 T DE 69811069T DE 69811069 D1 DE69811069 D1 DE 69811069D1
Authority
DE
Germany
Prior art keywords
millimeter
elements
millimeter elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69811069T
Other languages
English (en)
Other versions
DE69811069T2 (de
Inventor
Gerard Cachier
Jean-Yves Daden
Alain Grancher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Publication of DE69811069D1 publication Critical patent/DE69811069D1/de
Application granted granted Critical
Publication of DE69811069T2 publication Critical patent/DE69811069T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/04—Fixed joints
    • H01P1/047—Strip line joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
DE69811069T 1997-05-23 1998-05-15 Verfahren und vorrichtung zum verbinden zweier millimeterelemente Expired - Lifetime DE69811069T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9706328A FR2763746B1 (fr) 1997-05-23 1997-05-23 Procede et dispositif pour connecter deux elements millimetriques
PCT/FR1998/000981 WO1998053518A1 (fr) 1997-05-23 1998-05-15 Procede et dispositif pour connecter deux elements millimetriques

Publications (2)

Publication Number Publication Date
DE69811069D1 true DE69811069D1 (de) 2003-03-06
DE69811069T2 DE69811069T2 (de) 2003-11-06

Family

ID=9507176

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69811069T Expired - Lifetime DE69811069T2 (de) 1997-05-23 1998-05-15 Verfahren und vorrichtung zum verbinden zweier millimeterelemente

Country Status (7)

Country Link
US (1) US6239400B1 (de)
EP (1) EP0983616B1 (de)
AU (1) AU7773798A (de)
CA (1) CA2290647A1 (de)
DE (1) DE69811069T2 (de)
FR (1) FR2763746B1 (de)
WO (1) WO1998053518A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100552658B1 (ko) 1999-03-31 2006-02-17 삼성전자주식회사 전압제어발진기의 위상잡음 감소용 공동공진기
DE60035553T2 (de) 1999-08-11 2008-04-17 Kyocera Corp. Hochfrequenzschaltungsplatte und seine Verbindungsstruktur
US6529105B1 (en) 2000-01-31 2003-03-04 Thomson-Cfs Process and device for bonding two millimeter elements

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3997100A (en) * 1973-09-10 1976-12-14 Raytheon Company Method of beam lead bonding
FR2264434B1 (de) 1974-03-12 1976-07-16 Thomson Csf
FR2346897A1 (fr) 1975-01-22 1977-10-28 Thomson Csf Circuit millimetrique hyperfrequence
FR2346854A1 (fr) 1975-10-02 1977-10-28 Thomson Csf Circuit integre comportant une source d'ondes millimetriques, et procede de fabrication dudit circuit
FR2351503A1 (fr) 1976-05-11 1977-12-09 Thomson Csf Procede de realisation d'un circuit pour ondes millimetriques comportant une diode semi-conductrice et un autre composant semi-conducteur, et dispositifs realises par ledit procede
FR2368151A1 (fr) 1976-10-15 1978-05-12 Thomson Csf Source d'ondes millimetriques a l'etat solide comportant un aerien directif integre
FR2421478A2 (fr) 1978-03-31 1979-10-26 Thomson Csf Source d'ondes millimetriques a l'etat solide comportant un aerien directif
FR2423088A1 (fr) 1978-04-14 1979-11-09 Thomson Csf Source d'ondes millimetriques comportant un module oscillateur et un module d'accord a capacite variable, et emetteur comportant une telle source
FR2452201A1 (fr) 1979-03-23 1980-10-17 Thomson Csf Melangeur symetrique pour ondes millimetriques et recepteur utilisant un tel melangeur
FR2458819A1 (fr) 1979-06-12 1981-01-02 Thomson Csf Tete hyperfrequence d'emission et de reception simultanees, emetteur-recepteur en ondes millimetriques et radar utilisant une telle tete
US4627565A (en) * 1982-03-18 1986-12-09 Lomerson Robert B Mechanical bonding of surface conductive layers
US4816789A (en) * 1986-05-19 1989-03-28 United Technologies Corporation Solderless, pushdown connectors for RF and DC
JPS6313401A (ja) * 1986-07-03 1988-01-20 Mitsubishi Electric Corp 高周波伝送路の接続回路
US4724409A (en) * 1986-07-31 1988-02-09 Raytheon Company Microwave circuit package connector
FR2628893B1 (fr) 1988-03-18 1990-03-23 Thomson Csf Interrupteur hyperfrequence
FR2663466A1 (fr) 1990-06-15 1991-12-20 Thomson Csf Composant semiconducteur a jonction schottky pour amplification hyperfrequence et circuits logiques rapides, et procede de realisation d'un tel composant.
FR2678112B1 (fr) 1991-06-18 1993-12-03 Thomson Csf Antenne hyperfrequence a balayage optoelectronique.
FR2684804B1 (fr) 1991-12-06 1994-01-28 Thomson Csf Dispositif de montage de circuits integres monolithiques hyperfrequences a tres large bande.
US5977618A (en) * 1992-07-24 1999-11-02 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US5469130A (en) * 1992-11-27 1995-11-21 Murata Mfg. Co., Ltd. High frequency parallel strip line cable comprising connector part and connector provided on substrate for connecting with connector part thereof
FR2704357B1 (fr) 1993-04-20 1995-06-02 Thomson Csf Eléments électroniques intégrés à caractéristiques électriques variables, en particulier pour hyperfréquences.
US5983492A (en) * 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
US5631446A (en) * 1995-06-07 1997-05-20 Hughes Electronics Microstrip flexible printed wiring board interconnect line
US5847356A (en) * 1996-08-30 1998-12-08 Hewlett-Packard Company Laser welded inkjet printhead assembly utilizing a combination laser and fiber optic push connect system
US6169663B1 (en) * 1998-03-12 2001-01-02 Medallion Technology, Llc Integrated circuit connection using an electrically conductive adhesive

Also Published As

Publication number Publication date
DE69811069T2 (de) 2003-11-06
EP0983616B1 (de) 2003-01-29
FR2763746A1 (fr) 1998-11-27
WO1998053518A1 (fr) 1998-11-26
FR2763746B1 (fr) 1999-07-30
AU7773798A (en) 1998-12-11
EP0983616A1 (de) 2000-03-08
US6239400B1 (en) 2001-05-29
CA2290647A1 (fr) 1998-11-26

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