DE69810713T2 - System und Verfahren zum Neutralisieren eines Ionenstrahls mit Wasserdampf - Google Patents

System und Verfahren zum Neutralisieren eines Ionenstrahls mit Wasserdampf

Info

Publication number
DE69810713T2
DE69810713T2 DE69810713T DE69810713T DE69810713T2 DE 69810713 T2 DE69810713 T2 DE 69810713T2 DE 69810713 T DE69810713 T DE 69810713T DE 69810713 T DE69810713 T DE 69810713T DE 69810713 T2 DE69810713 T2 DE 69810713T2
Authority
DE
Germany
Prior art keywords
neutralizing
water vapor
ion beam
ion
vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69810713T
Other languages
English (en)
Other versions
DE69810713D1 (de
Inventor
Victor Maurice Benveniste
Frank Sinclair
Jiong Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Axcelis Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Application granted granted Critical
Publication of DE69810713D1 publication Critical patent/DE69810713D1/de
Publication of DE69810713T2 publication Critical patent/DE69810713T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/026—Means for avoiding or neutralising unwanted electrical charges on tube components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Particle Accelerators (AREA)
  • Electron Sources, Ion Sources (AREA)
DE69810713T 1997-07-11 1998-07-02 System und Verfahren zum Neutralisieren eines Ionenstrahls mit Wasserdampf Expired - Fee Related DE69810713T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/891,688 US5814819A (en) 1997-07-11 1997-07-11 System and method for neutralizing an ion beam using water vapor

Publications (2)

Publication Number Publication Date
DE69810713D1 DE69810713D1 (de) 2003-02-20
DE69810713T2 true DE69810713T2 (de) 2003-11-27

Family

ID=25398651

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69810713T Expired - Fee Related DE69810713T2 (de) 1997-07-11 1998-07-02 System und Verfahren zum Neutralisieren eines Ionenstrahls mit Wasserdampf

Country Status (7)

Country Link
US (1) US5814819A (de)
EP (1) EP0893944B1 (de)
JP (1) JP3932522B2 (de)
KR (1) KR100350615B1 (de)
CN (1) CN1117390C (de)
DE (1) DE69810713T2 (de)
TW (1) TW396407B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6452338B1 (en) * 1999-12-13 2002-09-17 Semequip, Inc. Electron beam ion source with integral low-temperature vaporizer
JP3869680B2 (ja) 2001-05-29 2007-01-17 株式会社 Ｓｅｎ−Ｓｈｉ・アクセリス カンパニー イオン注入装置
US6891173B2 (en) * 2001-10-26 2005-05-10 Varian Semiconductor Equipment Associates, Inc. Ion implantation systems and methods utilizing a downstream gas source
JP3840108B2 (ja) 2001-12-27 2006-11-01 株式会社 Ｓｅｎ−Ｓｈｉ・アクセリス カンパニー イオンビーム処理方法及び処理装置
JP2005101573A (ja) * 2003-08-29 2005-04-14 Semiconductor Energy Lab Co Ltd イオン注入方法及び半導体装置の作製方法
US6995079B2 (en) * 2003-08-29 2006-02-07 Semiconductor Energy Laboratory Co., Ltd. Ion implantation method and method for manufacturing semiconductor device
US7038223B2 (en) * 2004-04-05 2006-05-02 Burle Technologies, Inc. Controlled charge neutralization of ion-implanted articles
US7413596B2 (en) * 2004-11-05 2008-08-19 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for the production of purified liquids and vapors
US7414249B2 (en) * 2004-11-30 2008-08-19 Purser Kenneth H Broad energy-range ribbon ion beam collimation using a variable-gradient dipole
WO2007146985A2 (en) * 2006-06-13 2007-12-21 Semequip, Inc. Magnetic analyzer apparatus and method for ion implantation
JP5210304B2 (ja) * 2006-06-13 2013-06-12 セムイクウィップ・インコーポレーテッド イオンビーム装置およびイオン注入方法
KR20110025775A (ko) * 2008-05-30 2011-03-11 액셀리스 테크놀러지스, 인크. 수소화 붕소 임플란트 시 반도체 웨이퍼 상 입자 제어
US8003956B2 (en) * 2008-10-03 2011-08-23 Varian Semiconductor Equipment Associates, Inc. Method and apparatus for controlling beam current uniformity in an ion implanter
US8263944B2 (en) * 2008-12-22 2012-09-11 Varian Semiconductor Equipment Associates, Inc. Directional gas injection for an ion source cathode assembly
RU2696268C2 (ru) * 2014-11-19 2019-08-01 Таэ Текнолоджиз, Инк. Фотонный нейтрализатор для инжекторов пучков нейтральных частиц
JP6752449B2 (ja) 2018-08-09 2020-09-09 日新イオン機器株式会社 イオンビーム中和方法と装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4361762A (en) * 1980-07-30 1982-11-30 Rca Corporation Apparatus and method for neutralizing the beam in an ion implanter
US4680474A (en) * 1985-05-22 1987-07-14 Varian Associates, Inc. Method and apparatus for improved ion dose accuracy
JPH0715839B2 (ja) * 1989-11-22 1995-02-22 株式会社荏原製作所 高速原子線放射装置
US5164599A (en) * 1991-07-19 1992-11-17 Eaton Corporation Ion beam neutralization means generating diffuse secondary emission electron shower
JPH05129096A (ja) * 1991-11-05 1993-05-25 Hitachi Ltd イオンビームの電荷中和方法および装置ならびにドライプロセス装置および表面計測装置
US5466929A (en) * 1992-02-21 1995-11-14 Hitachi, Ltd. Apparatus and method for suppressing electrification of sample in charged beam irradiation apparatus
JPH06216060A (ja) * 1993-01-12 1994-08-05 Tokyo Electron Ltd 真空処理方法
JPH07169746A (ja) * 1993-12-14 1995-07-04 Ebara Corp 低エネルギー中性粒子線を用いた微細加工装置
US5531420A (en) * 1994-07-01 1996-07-02 Eaton Corporation Ion beam electron neutralizer
JP3123909B2 (ja) * 1995-11-27 2001-01-15 日本電気株式会社 電荷変換装置

Also Published As

Publication number Publication date
KR19990013624A (ko) 1999-02-25
EP0893944B1 (de) 2003-01-15
EP0893944A1 (de) 1999-01-27
TW396407B (en) 2000-07-01
CN1211819A (zh) 1999-03-24
KR100350615B1 (ko) 2002-11-18
JPH1196961A (ja) 1999-04-09
US5814819A (en) 1998-09-29
DE69810713D1 (de) 2003-02-20
CN1117390C (zh) 2003-08-06
JP3932522B2 (ja) 2007-06-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee