DE69734104D1 - CLUTCH ASSEMBLY FOR THE CLOSED TRANSMISSION FROM A FLAT SUBSTRATE FROM A CLOSED CONTAINER TO A TREATMENT DEVICE - Google Patents

CLUTCH ASSEMBLY FOR THE CLOSED TRANSMISSION FROM A FLAT SUBSTRATE FROM A CLOSED CONTAINER TO A TREATMENT DEVICE

Info

Publication number
DE69734104D1
DE69734104D1 DE69734104T DE69734104T DE69734104D1 DE 69734104 D1 DE69734104 D1 DE 69734104D1 DE 69734104 T DE69734104 T DE 69734104T DE 69734104 T DE69734104 T DE 69734104T DE 69734104 D1 DE69734104 D1 DE 69734104D1
Authority
DE
Germany
Prior art keywords
closed
treatment device
clutch assembly
flat substrate
transmission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69734104T
Other languages
German (de)
Other versions
DE69734104T2 (en
Inventor
Claude Doche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Application granted granted Critical
Publication of DE69734104D1 publication Critical patent/DE69734104D1/en
Publication of DE69734104T2 publication Critical patent/DE69734104T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69734104T 1996-04-03 1997-04-02 CLUTCH ASSEMBLY FOR THE CLOSED TRANSMISSION FROM A FLAT SUBSTRATE FROM A CLOSED CONTAINER TO A TREATMENT DEVICE Expired - Fee Related DE69734104T2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9604170 1996-04-03
FR9604170A FR2747111B1 (en) 1996-04-03 1996-04-03 COUPLING SYSTEM FOR CONFINED TRANSFER OF A FLAT OBJECT FROM A CONTAINMENT BOX TO AN OBJECT PROCESSING UNIT
PCT/FR1997/000588 WO1997038440A1 (en) 1996-04-03 1997-04-02 Coupling system for the transfer of a confined planar object from a containment pod to an object processing unit

Publications (2)

Publication Number Publication Date
DE69734104D1 true DE69734104D1 (en) 2005-10-06
DE69734104T2 DE69734104T2 (en) 2006-06-29

Family

ID=9490858

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69734104T Expired - Fee Related DE69734104T2 (en) 1996-04-03 1997-04-02 CLUTCH ASSEMBLY FOR THE CLOSED TRANSMISSION FROM A FLAT SUBSTRATE FROM A CLOSED CONTAINER TO A TREATMENT DEVICE

Country Status (6)

Country Link
US (1) US6273664B1 (en)
EP (1) EP0891629B1 (en)
JP (1) JP2001515655A (en)
DE (1) DE69734104T2 (en)
FR (1) FR2747111B1 (en)
WO (1) WO1997038440A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2779421B1 (en) * 1998-06-08 2000-08-18 Incam Solutions ADAPTER DEVICE FOR CONTAINMENT BOXES OF AT LEAST ONE FLAT OBJECT UNDER ULTRA-CLEAN ATMOSPHERE
JP2000286319A (en) * 1999-03-31 2000-10-13 Canon Inc Substrate transferring method and semiconductor manufacturing apparatus
JP4628530B2 (en) * 2000-08-25 2011-02-09 株式会社ライト製作所 Transport container lid attaching / detaching device
JP3581310B2 (en) * 2000-08-31 2004-10-27 Ｔｄｋ株式会社 Semiconductor wafer processing equipment with dustproof function
US6793766B2 (en) * 2001-01-04 2004-09-21 Applied Materials Inc. Apparatus having platforms positioned for precise centering of semiconductor wafers during processing
CN101044074B (en) * 2004-08-19 2014-04-02 布鲁克斯自动化公司 Reduced capacity carrier and method of use
US7771150B2 (en) 2005-08-26 2010-08-10 Jusung Engineering Co., Ltd. Gate valve and substrate-treating apparatus including the same
DE102005040741B4 (en) * 2005-08-26 2007-06-14 Asys Automatic Systems Gmbh & Co. Kg Machining plant of modular construction for flat substrates
US8097084B2 (en) * 2006-01-24 2012-01-17 Vat Holding Ag Vacuum chamber system for semiconductor processing
JP2008060513A (en) * 2006-09-04 2008-03-13 Tokyo Electron Ltd Treating device and treating method
JP4343241B2 (en) * 2007-07-30 2009-10-14 Ｔｄｋ株式会社 Storage container lid opening / closing system and substrate processing method using the system
JP4438966B2 (en) * 2007-11-29 2010-03-24 Ｔｄｋ株式会社 Storage container lid opening / closing system and substrate processing method using the system
JP4488255B2 (en) * 2008-05-27 2010-06-23 Ｔｄｋ株式会社 Closed container lid opening / closing system, container insertion / removal system including the lid opening / closing system, and substrate processing method using the lid opening / closing system
CN101685788B (en) * 2008-09-23 2012-05-09 家登精密工业股份有限公司 Front open type wafer box with latch and airtight structure
JP4523661B1 (en) * 2009-03-10 2010-08-11 三井造船株式会社 Atomic layer deposition apparatus and thin film forming method
JP5279576B2 (en) * 2009-03-27 2013-09-04 大日本スクリーン製造株式会社 Substrate processing equipment
WO2011151041A1 (en) * 2010-06-04 2011-12-08 Oc Oerlikon Balzers Ag Vacuum processing device
JP5729148B2 (en) * 2011-06-07 2015-06-03 東京エレクトロン株式会社 Opening / closing device for substrate transfer container, opening / closing device for lid and semiconductor manufacturing device
JP6063716B2 (en) * 2012-11-14 2017-01-18 東京エレクトロン株式会社 Substrate processing apparatus and substrate transfer method
DE102013104030A1 (en) 2013-04-22 2014-10-23 Aixtron Se Transport module for a semiconductor manufacturing facility
US20150118012A1 (en) * 2013-10-31 2015-04-30 Lam Research Corporation Wafer entry port with gas concentration attenuators
DE102017123231A1 (en) 2017-10-06 2019-04-11 Aixtron Se Closure element for closing a loading opening of an inner housing of a CVD reactor
KR102496315B1 (en) * 2021-06-15 2023-02-08 주식회사 테크엑스 Load port module

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5884439A (en) * 1981-11-16 1983-05-20 Hitachi Ltd Semiconductor manufacturing device
JP2525284B2 (en) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 Clean transfer method and device
ES2079829T3 (en) * 1992-08-04 1996-01-16 Ibm PRESSURE LINK APPARATUS TO TRANSFER A SEMICONDUCTIVE SLICE BETWEEN A SEALABLE PRESSURE TRANSPORTABLE CONTAINER AND A TREATMENT EQUIPMENT.
US5291923A (en) * 1992-09-24 1994-03-08 Internatinal Business Machines Corporation Door opening system and method
EP1179611B1 (en) * 1992-10-06 2004-09-15 Unaxis Balzers Aktiengesellschaft Chamber for transport of substrates
FR2697000B1 (en) * 1992-10-16 1994-11-25 Commissariat Energie Atomique Flat box for confining a flat object under a special atmosphere.
ES2229247T3 (en) * 1995-03-28 2005-04-16 Brooks Automation Gmbh CHARGING AND DISCHARGE STATION FOR SEMICONDUCTOR TREATMENT FACILITIES.
US5961269A (en) * 1996-11-18 1999-10-05 Applied Materials, Inc. Three chamber load lock apparatus

Also Published As

Publication number Publication date
US6273664B1 (en) 2001-08-14
FR2747111A1 (en) 1997-10-10
EP0891629A1 (en) 1999-01-20
DE69734104T2 (en) 2006-06-29
FR2747111B1 (en) 1998-04-30
JP2001515655A (en) 2001-09-18
WO1997038440A1 (en) 1997-10-16
EP0891629B1 (en) 2005-08-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee