DE69730395D1 - MICROELECTRONIC SPRING CONTACT ELEMENT - Google Patents

MICROELECTRONIC SPRING CONTACT ELEMENT

Info

Publication number
DE69730395D1
DE69730395D1 DE69730395T DE69730395T DE69730395D1 DE 69730395 D1 DE69730395 D1 DE 69730395D1 DE 69730395 T DE69730395 T DE 69730395T DE 69730395 T DE69730395 T DE 69730395T DE 69730395 D1 DE69730395 D1 DE 69730395D1
Authority
DE
Germany
Prior art keywords
contact element
spring contact
microelectronic spring
microelectronic
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69730395T
Other languages
German (de)
Other versions
DE69730395T2 (en
Inventor
Y Khandros
N Eldridge
L Mathieu
V Pedersen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32931796&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69730395(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from PCT/US1996/008107 external-priority patent/WO1996037332A1/en
Priority claimed from US08/784,862 external-priority patent/US6064213A/en
Priority claimed from US08/788,740 external-priority patent/US5994152A/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Priority claimed from PCT/US1997/008634 external-priority patent/WO1997043654A1/en
Publication of DE69730395D1 publication Critical patent/DE69730395D1/en
Application granted granted Critical
Publication of DE69730395T2 publication Critical patent/DE69730395T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
DE69730395T 1996-05-17 1997-05-15 Microelectronic spring contact element Expired - Fee Related DE69730395T2 (en)

Applications Claiming Priority (21)

Application Number Priority Date Filing Date Title
US518996P 1996-05-17 1996-05-17
US5189P 1996-05-17
PCT/US1996/008107 WO1996037332A1 (en) 1995-05-26 1996-05-24 Fabricating interconnects and tips using sacrificial substrates
WOPCT/US81/00007 1996-05-24
US2086996P 1996-06-27 1996-06-27
US20869P 1996-06-27
US2440596P 1996-08-22 1996-08-22
US24405P 1996-08-22
US2455596P 1996-08-26 1996-08-26
US24555P 1996-08-26
US3069796P 1996-11-13 1996-11-13
US30697P 1996-11-13
US3266696P 1996-12-13 1996-12-13
US32666P 1996-12-13
US3405396P 1996-12-31 1996-12-31
US34053P 1996-12-31
US08/784,862 US6064213A (en) 1993-11-16 1997-01-15 Wafer-level burn-in and test
US788740 1997-01-24
US08/788,740 US5994152A (en) 1996-02-21 1997-01-24 Fabricating interconnects and tips using sacrificial substrates
PCT/US1997/008634 WO1997043654A1 (en) 1996-05-17 1997-05-15 Microelectronic spring contact elements
US784862 2001-02-16

Publications (2)

Publication Number Publication Date
DE69730395D1 true DE69730395D1 (en) 2004-09-30
DE69730395T2 DE69730395T2 (en) 2005-09-01

Family

ID=32931796

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69730395T Expired - Fee Related DE69730395T2 (en) 1996-05-17 1997-05-15 Microelectronic spring contact element
DE69723976T Expired - Fee Related DE69723976T2 (en) 1996-05-17 1997-05-15 BURNING IN AND TESTING A SEMICONDUCTOR WAFER

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69723976T Expired - Fee Related DE69723976T2 (en) 1996-05-17 1997-05-15 BURNING IN AND TESTING A SEMICONDUCTOR WAFER

Country Status (2)

Country Link
KR (1) KR100312872B1 (en)
DE (2) DE69730395T2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100825266B1 (en) * 2008-02-15 2008-04-25 주식회사 파이컴 Micro probe structure
DE102010054782A1 (en) 2010-12-16 2012-06-21 Epcos Ag Housing electrical component

Also Published As

Publication number Publication date
KR100312872B1 (en) 2001-12-12
DE69723976D1 (en) 2003-09-11
DE69723976T2 (en) 2004-06-09
KR19990029047A (en) 1999-04-15
DE69730395T2 (en) 2005-09-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee