DE69722582D1 - Verfahren und Vorrichtung zur sequentiellen Metallisierung von Polymerfilmen - Google Patents

Verfahren und Vorrichtung zur sequentiellen Metallisierung von Polymerfilmen

Info

Publication number
DE69722582D1
DE69722582D1 DE69722582T DE69722582T DE69722582D1 DE 69722582 D1 DE69722582 D1 DE 69722582D1 DE 69722582 T DE69722582 T DE 69722582T DE 69722582 T DE69722582 T DE 69722582T DE 69722582 D1 DE69722582 D1 DE 69722582D1
Authority
DE
Germany
Prior art keywords
polymer films
metallization
sequential
sequential metallization
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69722582T
Other languages
English (en)
Other versions
DE69722582T2 (de
Inventor
Thomas J Ameen
Robert D Dewitt
Adam G Bay
Peter Peckham
Ronald K Haines
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gould Electronics Inc
Original Assignee
Ga Tek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ga Tek Inc filed Critical Ga Tek Inc
Publication of DE69722582D1 publication Critical patent/DE69722582D1/de
Application granted granted Critical
Publication of DE69722582T2 publication Critical patent/DE69722582T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0635—In radial cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating
    • C25D7/0678—Selective plating using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69722582T 1997-03-26 1997-03-26 Verfahren und Vorrichtung zur sequentiellen Metallisierung von Polymerfilmen Expired - Lifetime DE69722582T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP97302107A EP0867529B1 (de) 1997-03-26 1997-03-26 Verfahren und Vorrichtung zur sequentiellen Metallisierung von Polymerfilmen

Publications (2)

Publication Number Publication Date
DE69722582D1 true DE69722582D1 (de) 2003-07-10
DE69722582T2 DE69722582T2 (de) 2004-06-09

Family

ID=8229266

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69722582T Expired - Lifetime DE69722582T2 (de) 1997-03-26 1997-03-26 Verfahren und Vorrichtung zur sequentiellen Metallisierung von Polymerfilmen

Country Status (2)

Country Link
EP (1) EP0867529B1 (de)
DE (1) DE69722582T2 (de)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU86520A1 (fr) * 1986-07-17 1988-02-02 Delloye Matthieu Procede d'electrozingage en continu d'une tole d'acier par voie electrolytique
US5242562A (en) * 1992-05-27 1993-09-07 Gould Inc. Method and apparatus for forming printed circuits

Also Published As

Publication number Publication date
DE69722582T2 (de) 2004-06-09
EP0867529A1 (de) 1998-09-30
EP0867529B1 (de) 2003-06-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NIKKO MATERIALS USA INC., CHANDLER, ARIZ., US