DE69627980D1 - SUCTION HEAD FOR MOUNTING DEVICE FOR ELECTRONIC COMPONENTS - Google Patents

SUCTION HEAD FOR MOUNTING DEVICE FOR ELECTRONIC COMPONENTS

Info

Publication number
DE69627980D1
DE69627980D1 DE69627980T DE69627980T DE69627980D1 DE 69627980 D1 DE69627980 D1 DE 69627980D1 DE 69627980 T DE69627980 T DE 69627980T DE 69627980 T DE69627980 T DE 69627980T DE 69627980 D1 DE69627980 D1 DE 69627980D1
Authority
DE
Germany
Prior art keywords
electronic components
mounting device
suction head
suction
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69627980T
Other languages
German (de)
Other versions
DE69627980T2 (en
Inventor
Kanji Uchida
Takashi Azuma
Osamu Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69627980D1 publication Critical patent/DE69627980D1/en
Application granted granted Critical
Publication of DE69627980T2 publication Critical patent/DE69627980T2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manipulator (AREA)
DE69627980T 1995-09-13 1996-09-12 SUCTION HEAD FOR MOUNTING DEVICE FOR ELECTRONIC COMPONENTS Expired - Lifetime DE69627980T2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7235206A JPH0983193A (en) 1995-09-13 1995-09-13 Component suction head for electronic-component mounting machine
PCT/JP1996/002603 WO1997010696A1 (en) 1995-09-13 1996-09-12 Suction head of electronic part mounting machine

Publications (2)

Publication Number Publication Date
DE69627980D1 true DE69627980D1 (en) 2003-06-12
DE69627980T2 DE69627980T2 (en) 2003-11-27

Family

ID=16982659

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69627980T Expired - Lifetime DE69627980T2 (en) 1995-09-13 1996-09-12 SUCTION HEAD FOR MOUNTING DEVICE FOR ELECTRONIC COMPONENTS

Country Status (5)

Country Link
US (1) US6000122A (en)
EP (1) EP0792097B1 (en)
JP (1) JPH0983193A (en)
DE (1) DE69627980T2 (en)
WO (1) WO1997010696A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3727355B2 (en) * 1996-12-25 2005-12-14 松下電器産業株式会社 Component holding head, component mounting apparatus, and component holding method
JP2000117676A (en) * 1998-10-13 2000-04-25 Ando Electric Co Ltd Suction mechanism for ic and horizontal carry type autohandler
US6364386B1 (en) 1999-10-27 2002-04-02 Agilent Technologies, Inc. Apparatus and method for handling an integrated circuit
CN1202700C (en) * 2000-02-22 2005-05-18 松下电器产业株式会社 Suction nozzle for holding component by suction
KR100344905B1 (en) * 2000-09-09 2002-07-20 미래산업 주식회사 Part Adsorbing Apparatus of Module Head in Surface Mount Device
US20030084564A1 (en) * 2001-11-02 2003-05-08 Mike Carlomagno Retractable vacuum tube for positioning electronic components on printed circuit boards
DE10161946A1 (en) * 2001-12-17 2003-06-18 Naiss Automatisierungs Und Inf Freeze gripping device and method for securing miniature components to the freezing gripping device
JP2004351527A (en) * 2003-05-27 2004-12-16 Koganei Corp Suction detecting method and suction detecting device
US20060000084A1 (en) * 2004-06-30 2006-01-05 Inventec Corporation Nozzle of surface mount device
JP4635717B2 (en) * 2005-05-24 2011-02-23 株式会社デンソー Work holding method and holding device
US20070048120A1 (en) * 2005-08-15 2007-03-01 Texas Instruments Incorporated Vacuum shroud for a die attach tool
US7895974B2 (en) * 2006-12-27 2011-03-01 Joanne Brickell Livestock feeder
JP2009038147A (en) * 2007-07-31 2009-02-19 Hitachi High-Tech Instruments Co Ltd Electronic component mounting equipment
TW201221453A (en) * 2010-11-16 2012-06-01 Hon Hai Prec Ind Co Ltd Surface mounting machine nozzle
US9108319B2 (en) * 2011-02-01 2015-08-18 Delaware Capital Formation, Inc. Electric suction cup
US9003644B2 (en) * 2012-10-15 2015-04-14 Stmicroelectronics Pte Ltd PNP apparatus and PNP tool head with direct bonding pressure pick-up tip
CN104416577A (en) * 2013-08-22 2015-03-18 深圳富泰宏精密工业有限公司 Sucker mechanism
JP2015053418A (en) * 2013-09-09 2015-03-19 株式会社東芝 Semiconductor manufacturing apparatus
US9894819B2 (en) * 2014-01-22 2018-02-13 Fuji Machine Mfg. Co., Ltd. Suction nozzle for mounting electronic components
KR20160044975A (en) * 2014-10-16 2016-04-26 삼성전자주식회사 Semiconductor package test blade and semiconductor package test apparatus comprising the same
US10099387B2 (en) * 2017-01-24 2018-10-16 Jabil Inc. Apparatus, system and method for providing a vacuum ejector for an end effector
US10493638B1 (en) * 2018-09-11 2019-12-03 Jabil Inc. Apparatus, system and method for providing a vacuum ejector for an end effector
JP7090224B2 (en) * 2018-03-19 2022-06-24 パナソニックＩｐマネジメント株式会社 Suction nozzle for holding parts
US11084175B2 (en) 2018-12-13 2021-08-10 Amazon Technologies, Inc. End-of-arm tool having concentric suction cups, and related systems and methods
DE102019127292B4 (en) * 2019-10-10 2023-01-19 Asm Assembly Systems Gmbh & Co. Kg Device and method for precise assembly with assembly elements
US11351678B1 (en) * 2020-03-10 2022-06-07 Amazon Technologies, Inc. Dynamically adjustable suction cups

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59197143A (en) * 1983-04-22 1984-11-08 Tokyo Sokuhan Kk Mounting device for parts
GB8714175D0 (en) * 1987-06-17 1987-07-22 Dynapert Precima Ltd Suction pick-up apparatus
US4815779A (en) * 1987-08-21 1989-03-28 American Telephone And Telegraph Co. Method and apparatus for part pickup
JPH01281745A (en) * 1988-05-07 1989-11-13 Mitsubishi Electric Corp Sticking device for electronic element
US5113578A (en) * 1990-11-29 1992-05-19 Emhart Inc. Tool tip assembly for surface mount machine
US5317803A (en) * 1991-05-30 1994-06-07 Sierra Research And Technology, Inc. Method of soldering an integrated circuit
JPH05235594A (en) * 1992-02-19 1993-09-10 Fujitsu Ltd Attracting head for electronic component
JP2543652B2 (en) * 1993-01-18 1996-10-16 株式会社テンリュウテクニックス Parts suction fixing device
DE4430381C2 (en) * 1993-08-31 1997-02-27 Smc Kk Suction pipette
US5755471A (en) * 1996-02-16 1998-05-26 Micron Electronics, Inc. Actuator stem and actuator design having a D-shaped cross-section

Also Published As

Publication number Publication date
WO1997010696A1 (en) 1997-03-20
EP0792097A4 (en) 1999-11-03
EP0792097B1 (en) 2003-05-07
JPH0983193A (en) 1997-03-28
DE69627980T2 (en) 2003-11-27
EP0792097A1 (en) 1997-08-27
US6000122A (en) 1999-12-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)