DE69527851T2 - Chemisch gepfropfte elektrische vorrichtungen - Google Patents

Chemisch gepfropfte elektrische vorrichtungen

Info

Publication number
DE69527851T2
DE69527851T2 DE69527851T DE69527851T DE69527851T2 DE 69527851 T2 DE69527851 T2 DE 69527851T2 DE 69527851 T DE69527851 T DE 69527851T DE 69527851 T DE69527851 T DE 69527851T DE 69527851 T2 DE69527851 T2 DE 69527851T2
Authority
DE
Germany
Prior art keywords
electrical devices
chemical
grafted electrical
chemical grafted
grafted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69527851T
Other languages
English (en)
Other versions
DE69527851D1 (de
Inventor
R Crotzer
G Hanrahan
S Pickles
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Solutions GmbH
Original Assignee
Tyco Electronics Logistics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics AG filed Critical Tyco Electronics Logistics AG
Publication of DE69527851D1 publication Critical patent/DE69527851D1/de
Application granted granted Critical
Publication of DE69527851T2 publication Critical patent/DE69527851T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1168—Graft-polymerization

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE69527851T 1994-12-02 1995-11-30 Chemisch gepfropfte elektrische vorrichtungen Expired - Fee Related DE69527851T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/348,574 US5600099A (en) 1994-12-02 1994-12-02 Chemically grafted electrical devices
PCT/US1995/015509 WO1996017501A1 (en) 1994-12-02 1995-11-30 Chemically grafted electrical devices

Publications (2)

Publication Number Publication Date
DE69527851D1 DE69527851D1 (de) 2002-09-26
DE69527851T2 true DE69527851T2 (de) 2003-04-24

Family

ID=23368606

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69527851T Expired - Fee Related DE69527851T2 (de) 1994-12-02 1995-11-30 Chemisch gepfropfte elektrische vorrichtungen

Country Status (8)

Country Link
US (1) US5600099A (de)
EP (1) EP0795262B1 (de)
JP (1) JP3691518B2 (de)
CN (1) CN1085035C (de)
CA (1) CA2206643C (de)
DE (1) DE69527851T2 (de)
TW (1) TW346736B (de)
WO (1) WO1996017501A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011101805A1 (de) * 2011-05-17 2012-11-22 Fela Holding Gmbh Schaltungsträger

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US6271482B1 (en) 1994-08-23 2001-08-07 Thomas & Betts International, Inc. Conductive elastomer interconnect
US5909012A (en) * 1996-10-21 1999-06-01 Ford Motor Company Method of making a three-dimensional part with buried conductors
CA2245413C (en) * 1997-09-16 2001-09-18 Thomas & Betts International, Inc. Conductive elastomer for grafting to an elastic substrate
DE19753082C1 (de) * 1997-11-29 1999-03-04 Preh Elektro Feinmechanik Drehschalter oder -widerstand
US6524115B1 (en) 1999-08-20 2003-02-25 3M Innovative Properties Company Compliant interconnect assembly
US7477120B2 (en) 2001-08-13 2009-01-13 Bose Corporation Transformer shielding
US6574114B1 (en) 2002-05-02 2003-06-03 3M Innovative Properties Company Low contact force, dual fraction particulate interconnect
US7367116B2 (en) * 2003-07-16 2008-05-06 Matsushita Electric Industrial Co., Ltd. Multi-layer printed circuit board, and method for fabricating the same
US7592796B2 (en) * 2004-05-18 2009-09-22 Circuit Check Plate with an indicator for discerning among pre-identified probe holes in the plate
KR20080039830A (ko) 2005-08-25 2008-05-07 스미토모덴키고교가부시키가이샤 이방성 도전시트, 그 제조방법, 접속방법 및 검사방법
US7825512B2 (en) * 2005-09-12 2010-11-02 Hewlett-Packard Development Company, L.P. Electronic package with compliant electrically-conductive ball interconnect
US7624500B2 (en) * 2006-08-16 2009-12-01 Lexmark International, Inc. Printing of multi-layer circuits
EP1983623A1 (de) * 2007-04-18 2008-10-22 Eaton Electric B.V. Kühlanordnung für eine Leitung in einer Elektroinstallation
US8440012B2 (en) * 2010-10-13 2013-05-14 Rf Micro Devices, Inc. Atomic layer deposition encapsulation for acoustic wave devices
JP5781289B2 (ja) * 2010-10-15 2015-09-16 矢崎総業株式会社 ワイヤハーネス配索構造
TWI449136B (zh) * 2011-04-20 2014-08-11 Cyntec Co Ltd 金屬芯印刷電路板及電子封裝結構
CN103457022A (zh) * 2012-06-05 2013-12-18 深圳富泰宏精密工业有限公司 天线及其制造方法
US9459285B2 (en) * 2013-07-10 2016-10-04 Globalfoundries Inc. Test probe coated with conductive elastomer for testing of backdrilled plated through holes in printed circuit board assembly
DE102013224765A1 (de) * 2013-12-03 2015-06-03 Robert Bosch Gmbh Verfahren zur Via-Stift-Verfüllung
JP6447475B2 (ja) * 2015-11-30 2019-01-09 オムロン株式会社 接点部材、摺動接点、電気機器、および接点部材の製造方法
US10609967B2 (en) * 2017-12-20 2020-04-07 Romed Fasteners, Inc. Magnetic fasteners providing an electrical connection
US11172717B2 (en) 2017-12-20 2021-11-16 Romed Fasteners, Inc. Magnetic fastener providing electrical connection and having female member with solid cover
US11509080B2 (en) 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11128072B1 (en) 2020-07-22 2021-09-21 TE Connectivity Services Gmbh Electrical connector assembly having variable height contacts
US11509084B2 (en) 2020-07-24 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11894629B2 (en) 2021-03-09 2024-02-06 Tyco Electronics Japan G.K. Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes

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US3203083A (en) * 1961-02-08 1965-08-31 Texas Instruments Inc Method of manufacturing a hermetically sealed semiconductor capsule
US3482726A (en) * 1967-02-13 1969-12-09 Arthur Henry Schroeder Jr Pressure weld seal for a composite glass body and method of forming said seal
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011101805A1 (de) * 2011-05-17 2012-11-22 Fela Holding Gmbh Schaltungsträger
DE102011101805B4 (de) * 2011-05-17 2016-08-25 Fela Holding Gmbh Schaltungsträger

Also Published As

Publication number Publication date
JPH10510094A (ja) 1998-09-29
US5600099A (en) 1997-02-04
DE69527851D1 (de) 2002-09-26
CN1167563A (zh) 1997-12-10
CA2206643C (en) 2001-05-22
WO1996017501A1 (en) 1996-06-06
CA2206643A1 (en) 1996-06-06
EP0795262B1 (de) 2002-08-21
EP0795262A1 (de) 1997-09-17
EP0795262A4 (de) 1999-11-17
CN1085035C (zh) 2002-05-15
JP3691518B2 (ja) 2005-09-07
TW346736B (en) 1998-12-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee