DE69514325T2 - Mehrschichtige lichtemittierende Vorrichtung - Google Patents
Mehrschichtige lichtemittierende VorrichtungInfo
- Publication number
- DE69514325T2 DE69514325T2 DE69514325T DE69514325T DE69514325T2 DE 69514325 T2 DE69514325 T2 DE 69514325T2 DE 69514325 T DE69514325 T DE 69514325T DE 69514325 T DE69514325 T DE 69514325T DE 69514325 T2 DE69514325 T2 DE 69514325T2
- Authority
- DE
- Germany
- Prior art keywords
- light emitting
- emitting device
- layer light
- layer
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP95104395A EP0734077B1 (de) | 1995-03-23 | 1995-03-24 | Mehrschichtige lichtemittierende Vorrichtung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69514325D1 DE69514325D1 (de) | 2000-02-10 |
DE69514325T2 true DE69514325T2 (de) | 2000-08-24 |
Family
ID=8219115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69514325T Expired - Lifetime DE69514325T2 (de) | 1995-03-24 | 1995-03-24 | Mehrschichtige lichtemittierende Vorrichtung |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE69514325T2 (de) |
-
1995
- 1995-03-24 DE DE69514325T patent/DE69514325T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69514325D1 (de) | 2000-02-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69704190D1 (de) | Lichtemittierende Vorrichtung | |
DE69613093D1 (de) | Elektrolumineszente vorrichtung | |
DE69617016T2 (de) | Durchsichtiges Mehrschichtgerät | |
DE69033837T2 (de) | Lichtemittierende Vorrichtung | |
DE69605526T2 (de) | Elektrolumineszente vorrichtung | |
DE69129218T2 (de) | Lichtemittierende Vorrichtung | |
DE69532615D1 (de) | Licht-emittierende Vorrichtung | |
DE69723776D1 (de) | Leuchtemittierende Vorrichtung | |
DE69207974D1 (de) | Lichtemittierende Vorrichtung | |
DE69313033D1 (de) | Lichtemittierende Vorrichtung | |
DE69205898D1 (de) | Lichtemittierende Vorrichtung. | |
DE69613318T2 (de) | Elektrolumineszente Vorrichtung | |
DE69514304D1 (de) | Lichtemittierende Vorrichtung | |
DE69610963T2 (de) | Bauelement mit enthaltender Lichtquelle | |
DE69623847D1 (de) | Beleuchtungsvorrichtung | |
DE69631319D1 (de) | Lichtemittierende/-empfangende Vorrichtung und optisches System | |
DE69528037T2 (de) | Beleuchtungseinrichtung | |
DE69514325D1 (de) | Mehrschichtige lichtemittierende Vorrichtung | |
KR960006396U (ko) | 경광 확산 발광장치 | |
KR960038311U (ko) | 면광원장치 | |
KR960024166U (ko) | 조준용 발광장치 | |
KR980005516U (ko) | 전자제품 발광장치 | |
KR970011712U (ko) | 발광 다이오드 램핑 장치 | |
NO963974D0 (no) | Lysemitterende innretning | |
KR950031280U (ko) | 발광소자 표시기 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |