DE69500438D1 - Formierung von einer schicht - Google Patents

Formierung von einer schicht

Info

Publication number
DE69500438D1
DE69500438D1 DE69500438T DE69500438T DE69500438D1 DE 69500438 D1 DE69500438 D1 DE 69500438D1 DE 69500438 T DE69500438 T DE 69500438T DE 69500438 T DE69500438 T DE 69500438T DE 69500438 D1 DE69500438 D1 DE 69500438D1
Authority
DE
Germany
Prior art keywords
workpiece
liquid
chamber
pulse
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69500438T
Other languages
English (en)
Other versions
DE69500438T2 (de
Inventor
Christopher Dobson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aviza Europe Ltd
Original Assignee
Electrotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrotech Ltd filed Critical Electrotech Ltd
Publication of DE69500438D1 publication Critical patent/DE69500438D1/de
Application granted granted Critical
Publication of DE69500438T2 publication Critical patent/DE69500438T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/021—Isostatic pressure welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Laminated Bodies (AREA)
  • Weting (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Magnetic Heads (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
DE69500438T 1994-02-09 1995-02-09 Formierung von einer schicht Expired - Lifetime DE69500438T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9402486A GB9402486D0 (en) 1994-02-09 1994-02-09 Forming a layer
PCT/GB1995/000259 WO1995022170A1 (en) 1994-02-09 1995-02-09 Forming a layer

Publications (2)

Publication Number Publication Date
DE69500438D1 true DE69500438D1 (de) 1997-08-21
DE69500438T2 DE69500438T2 (de) 1998-04-02

Family

ID=10750112

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69500438T Expired - Lifetime DE69500438T2 (de) 1994-02-09 1995-02-09 Formierung von einer schicht

Country Status (8)

Country Link
US (2) US5843535A (de)
EP (1) EP0693221B1 (de)
JP (1) JPH08508854A (de)
KR (1) KR100330376B1 (de)
AT (1) ATE155611T1 (de)
DE (1) DE69500438T2 (de)
GB (1) GB9402486D0 (de)
WO (1) WO1995022170A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9402486D0 (en) * 1994-02-09 1994-03-30 Electrotech Ltd Forming a layer
US6701941B1 (en) * 1997-05-09 2004-03-09 Semitool, Inc. Method for treating the surface of a workpiece
GB9714531D0 (en) * 1997-07-11 1997-09-17 Trikon Equip Ltd Forming a layer
US6413583B1 (en) 1998-02-11 2002-07-02 Applied Materials, Inc. Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound
US6340435B1 (en) 1998-02-11 2002-01-22 Applied Materials, Inc. Integrated low K dielectrics and etch stops
US6800571B2 (en) 1998-09-29 2004-10-05 Applied Materials Inc. CVD plasma assisted low dielectric constant films
US7510625B2 (en) * 1999-03-23 2009-03-31 Dynawave Corporation Device and method of using explosive forces in a contained environment
US6176970B1 (en) * 1999-03-23 2001-01-23 Dynawave Corporation Device and method of using explosive forces in a contained liquid environment
US6395647B1 (en) 1999-09-02 2002-05-28 Micron Technology, Inc. Chemical treatment of semiconductor substrates
US20040006164A1 (en) * 2002-01-23 2004-01-08 Abu-Isa Ismat A. Intumescent fire retardant polymeric composition
TW587582U (en) * 2003-06-11 2004-05-11 Razor Usa Llc Driving structure for manpower vehicle
DE102006030364A1 (de) * 2006-06-27 2008-01-03 Siemens Ag Verfahren zum Entfernen einer Schutzbeschichtung von einem Bauteil

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3995581A (en) * 1974-08-27 1976-12-07 Smejda Richard K Patterning and blending with lateral distribution channels and crosswise feeder systems
GB2196566B (en) * 1986-06-27 1990-03-07 Ex Cell O Corp Method of forming articles
EP0516344B1 (de) * 1991-05-28 2003-10-01 Trikon Technologies Limited Verfahren zum Füllen eines Hohraumes in einem Substrat
EP0526889B1 (de) * 1991-08-06 1997-05-07 Nec Corporation Verfahren zum Aufbringen einer Metall- oder Passivierenschicht mit hoher Haftung über einem isolierten Halbleitersubstrat
US5474796A (en) * 1991-09-04 1995-12-12 Protogene Laboratories, Inc. Method and apparatus for conducting an array of chemical reactions on a support surface
US5279316A (en) * 1992-08-18 1994-01-18 P.C.T. Systems, Inc. Multiprocessing sonic bath system for semiconductor wafers
GB9402486D0 (en) * 1994-02-09 1994-03-30 Electrotech Ltd Forming a layer
US5620524A (en) * 1995-02-27 1997-04-15 Fan; Chiko Apparatus for fluid delivery in chemical vapor deposition systems

Also Published As

Publication number Publication date
EP0693221A1 (de) 1996-01-24
US6019847A (en) 2000-02-01
JPH08508854A (ja) 1996-09-17
ATE155611T1 (de) 1997-08-15
EP0693221B1 (de) 1997-07-16
DE69500438T2 (de) 1998-04-02
GB9402486D0 (en) 1994-03-30
WO1995022170A1 (en) 1995-08-17
KR100330376B1 (ko) 2002-11-21
US5843535A (en) 1998-12-01
KR960702170A (ko) 1996-03-28

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: TRIKON TECHNOLOGIES LTD., THORNBURY, BRISTOL, GB

8328 Change in the person/name/address of the agent

Free format text: SCHNEIDERS * BEHRENDT * FINKENER * ERNESTI, RECHTSANWAELTE * PATENTANWAELTE, EUROPEAN PATENT ATTORNEYS, 44787 BOCHUM

8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8364 No opposition during term of opposition