DE69424377T2 - Rechner für die diskrete Cosinus-Transformation - Google Patents

Rechner für die diskrete Cosinus-Transformation

Info

Publication number
DE69424377T2
DE69424377T2 DE1994624377 DE69424377T DE69424377T2 DE 69424377 T2 DE69424377 T2 DE 69424377T2 DE 1994624377 DE1994624377 DE 1994624377 DE 69424377 T DE69424377 T DE 69424377T DE 69424377 T2 DE69424377 T2 DE 69424377T2
Authority
DE
Germany
Prior art keywords
calculator
discrete cosine
cosine transformation
transformation
discrete
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1994624377
Other languages
English (en)
Other versions
DE69424377D1 (de
Inventor
Lee-Sup Kim
Tetsu Nagamatsu
Takayasu Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69424377D1 publication Critical patent/DE69424377D1/de
Publication of DE69424377T2 publication Critical patent/DE69424377T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/14—Fourier, Walsh or analogous domain transformations, e.g. Laplace, Hilbert, Karhunen-Loeve, transforms
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/14—Fourier, Walsh or analogous domain transformations, e.g. Laplace, Hilbert, Karhunen-Loeve, transforms
    • G06F17/147—Discrete orthonormal transforms, e.g. discrete cosine transform, discrete sine transform, and variations therefrom, e.g. modified discrete cosine transform, integer transforms approximating the discrete cosine transform
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T9/00—Image coding
    • G06T9/007—Transform coding, e.g. discrete cosine transform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Computational Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Data Mining & Analysis (AREA)
  • Discrete Mathematics (AREA)
  • Databases & Information Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Algebra (AREA)
  • Multimedia (AREA)
  • Complex Calculations (AREA)
  • Compression Or Coding Systems Of Tv Signals (AREA)
  • Compression Of Band Width Or Redundancy In Fax (AREA)
  • Image Processing (AREA)
DE1994624377 1993-11-30 1994-11-30 Rechner für die diskrete Cosinus-Transformation Expired - Lifetime DE69424377T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30037593A JPH07152730A (ja) 1993-11-30 1993-11-30 離散コサイン変換装置

Publications (2)

Publication Number Publication Date
DE69424377D1 DE69424377D1 (de) 2000-06-15
DE69424377T2 true DE69424377T2 (de) 2000-10-12

Family

ID=17884030

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1994624377 Expired - Lifetime DE69424377T2 (de) 1993-11-30 1994-11-30 Rechner für die diskrete Cosinus-Transformation

Country Status (5)

Country Link
US (1) US5673214A (de)
EP (1) EP0655694B1 (de)
JP (1) JPH07152730A (de)
KR (1) KR0139699B1 (de)
DE (1) DE69424377T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100230251B1 (ko) * 1995-12-13 1999-11-15 윤종용 동영상 부호화장치에 있어서 신호처리방법 및 회로
JPH1064078A (ja) * 1996-08-20 1998-03-06 Mitsubishi Electric Corp 光ヘッド
JP3916277B2 (ja) * 1996-12-26 2007-05-16 シャープ株式会社 読み出し専用メモリ及び演算装置
TW364269B (en) * 1998-01-02 1999-07-11 Winbond Electronic Corp Discreet cosine transform/inverse discreet cosine transform circuit
JP2001318910A (ja) * 2000-02-29 2001-11-16 Sony Corp 逆離散コサイン変換装置
JP3860545B2 (ja) * 2003-02-07 2006-12-20 誠 小川 画像処理装置及び画像処理方法
NO327346B1 (no) * 2004-08-16 2009-06-15 Norsk Hydro As Fremgangsmate og anordning for bearbeiding av karbonlegemer
KR101601864B1 (ko) * 2014-02-25 2016-03-10 숭실대학교산학협력단 동영상 코덱의 역변환 방법 및 그 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4791598A (en) * 1987-03-24 1988-12-13 Bell Communications Research, Inc. Two-dimensional discrete cosine transform processor
JP2646778B2 (ja) * 1990-01-17 1997-08-27 日本電気株式会社 ディジタル信号処理装置
US5319724A (en) * 1990-04-19 1994-06-07 Ricoh Corporation Apparatus and method for compressing still images
JP2866754B2 (ja) * 1991-03-27 1999-03-08 三菱電機株式会社 演算処理装置
FR2681962B1 (fr) * 1991-09-30 1993-12-24 Sgs Thomson Microelectronics Sa Procede et circuit de traitement de donnees par transformee cosinus.
US5361220A (en) * 1991-11-29 1994-11-01 Fuji Photo Film Co., Ltd. Discrete cosine transformation with reduced components

Also Published As

Publication number Publication date
KR950016004A (ko) 1995-06-17
EP0655694A3 (de) 1995-11-02
DE69424377D1 (de) 2000-06-15
US5673214A (en) 1997-09-30
JPH07152730A (ja) 1995-06-16
KR0139699B1 (ko) 1998-07-01
EP0655694A2 (de) 1995-05-31
EP0655694B1 (de) 2000-05-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition