DE69404681T2 - Verfahren zum Ausstatten von haftenden Metallbeschichtungen auf Oberflächen von Cyanatesterpolymer - Google Patents

Verfahren zum Ausstatten von haftenden Metallbeschichtungen auf Oberflächen von Cyanatesterpolymer

Info

Publication number
DE69404681T2
DE69404681T2 DE69404681T DE69404681T DE69404681T2 DE 69404681 T2 DE69404681 T2 DE 69404681T2 DE 69404681 T DE69404681 T DE 69404681T DE 69404681 T DE69404681 T DE 69404681T DE 69404681 T2 DE69404681 T2 DE 69404681T2
Authority
DE
Germany
Prior art keywords
cyanate ester
ester polymer
metal coatings
adhesive metal
providing adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69404681T
Other languages
English (en)
Other versions
DE69404681D1 (de
Inventor
Bradley Ross Karas
Herbert Shin-I Chao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE69404681D1 publication Critical patent/DE69404681D1/de
Publication of DE69404681T2 publication Critical patent/DE69404681T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
DE69404681T 1993-01-13 1994-01-11 Verfahren zum Ausstatten von haftenden Metallbeschichtungen auf Oberflächen von Cyanatesterpolymer Expired - Fee Related DE69404681T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/003,916 US5286530A (en) 1993-01-13 1993-01-13 Method for providing adherent metal coatings on cyanate ester polymer surfaces

Publications (2)

Publication Number Publication Date
DE69404681D1 DE69404681D1 (de) 1997-09-11
DE69404681T2 true DE69404681T2 (de) 1998-02-26

Family

ID=21708203

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69404681T Expired - Fee Related DE69404681T2 (de) 1993-01-13 1994-01-11 Verfahren zum Ausstatten von haftenden Metallbeschichtungen auf Oberflächen von Cyanatesterpolymer

Country Status (4)

Country Link
US (1) US5286530A (de)
EP (1) EP0607014B1 (de)
JP (1) JPH06280032A (de)
DE (1) DE69404681T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5569493A (en) * 1994-11-14 1996-10-29 Hughes Aircraft Company Preparation of cured cyanate ester resins and composites for metal plating
US5739268A (en) * 1994-11-14 1998-04-14 Hughes Aircraft Preparation of cyanate ester polymers and composites for metal plating
EP0759329B1 (de) * 1995-07-26 2006-03-08 Hughes Electronics Corporation Cyanatesterfilm, der die Plattierungshaftung auf Oberflächen von Cyanatester-Graphitzusammensetzungen fördert
US5780581A (en) * 1995-10-27 1998-07-14 Hughes Aircraft Company Plateable structural adhesive for cyanate ester composites
CA2188345C (en) * 1995-10-27 2003-08-05 Brian M. Punsly Metal-filled, plateable structural adhesives for cyanate ester composites
DE10023862B4 (de) * 2000-05-16 2005-06-16 König, Klaus-Peter Beschichtetes Substrat mit metallischem Oberflächeneindruck, Verfahren zur haftfesten Beschichtung von Substraten mit korrodierbaren Metallschichten sowie Verwendung der beschichteten Substrate und der Produkte aus Verfahren zur haftfesten Beschichtung mit korrodierbaren Metallschichten
JP5978624B2 (ja) * 2011-01-31 2016-08-24 東洋紡株式会社 光導波路形成用樹脂組成物、ドライフィルム、およびこれらを用いてなる光導波路
EP2639332A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639334A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
CN103305818B (zh) * 2013-06-08 2015-08-05 西北工业大学 碳纤维增强氰酸酯基板材化学镀的表面粗化的蚀刻液及粗化方法
CN110344033A (zh) * 2014-07-10 2019-10-18 奥野制药工业株式会社 树脂镀敷方法以及树脂镀敷用蚀刻浴的管理方法
IT201900022026A1 (it) 2019-11-25 2021-05-25 Torino Politecnico Processo di attacco acido della superficie di compositi a matrice polimerica senza interrompere la continuità delle fibre, al fine di migliorare la resistenza meccanica di una giunzione

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4157360A (en) * 1978-04-26 1979-06-05 Allied Chemical Corporation Thermoformable compositions comprising a crosslinked polycyanurate polymer and a thermoplastic polymer
US4217438A (en) * 1978-12-15 1980-08-12 General Electric Company Polycarbonate transesterification process
US4335164A (en) * 1978-12-19 1982-06-15 Crown City Plating Co. Conditioning of polyamides for electroless plating
JPS5939307B2 (ja) * 1980-06-18 1984-09-21 三菱瓦斯化学株式会社 プラスチツク物品
US4629636A (en) * 1984-06-07 1986-12-16 Enthone, Incorporated Process for treating plastics with alkaline permanganate solutions
US4601783A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. High concentration sodium permanganate etch batch and its use in desmearing and/or etching printed circuit boards
US4764327A (en) * 1986-01-14 1988-08-16 Mitsubishi Gas Chemical Company, Inc. Process of producing plastic-molded printed circuit boards
DE3708214A1 (de) * 1987-03-12 1988-09-22 Schering Ag Verfahren zur haftfesten metallisierung von kunststoffen
MY104191A (en) * 1988-09-06 1994-02-28 Mitsubishi Gas Chemical Co Process for producing multilayer printed wiring board
US5160600A (en) * 1990-03-05 1992-11-03 Patel Gordhanbai N Chromic acid free etching of polymers for electroless plating
DE4113654A1 (de) * 1991-04-26 1992-10-29 Blasberg Oberflaechentech Mittel zur selektiven ausbildung einer duennen oxidierenden schicht

Also Published As

Publication number Publication date
EP0607014A2 (de) 1994-07-20
EP0607014A3 (en) 1995-11-29
EP0607014B1 (de) 1997-08-06
DE69404681D1 (de) 1997-09-11
JPH06280032A (ja) 1994-10-04
US5286530A (en) 1994-02-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee