DE69322491D1 - GRINDING DEVICE AND METHOD FOR USE THEREOF - Google Patents

GRINDING DEVICE AND METHOD FOR USE THEREOF

Info

Publication number
DE69322491D1
DE69322491D1 DE69322491T DE69322491T DE69322491D1 DE 69322491 D1 DE69322491 D1 DE 69322491D1 DE 69322491 T DE69322491 T DE 69322491T DE 69322491 T DE69322491 T DE 69322491T DE 69322491 D1 DE69322491 D1 DE 69322491D1
Authority
DE
Germany
Prior art keywords
grinding device
grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69322491T
Other languages
German (de)
Other versions
DE69322491T2 (en
Inventor
Toshiyasu Beppu
Junji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP05023035A external-priority patent/JP3024417B2/en
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Publication of DE69322491D1 publication Critical patent/DE69322491D1/en
Application granted granted Critical
Publication of DE69322491T2 publication Critical patent/DE69322491T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE69322491T 1992-02-12 1993-02-12 GRINDING DEVICE AND METHOD FOR USE THEREOF Expired - Fee Related DE69322491T2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP5929292 1992-02-12
JP05023035A JP3024417B2 (en) 1992-02-12 1993-02-10 Polishing equipment
PCT/JP1993/000173 WO1993015878A1 (en) 1992-02-12 1993-02-12 Abrading device and abrading method employing the same

Publications (2)

Publication Number Publication Date
DE69322491D1 true DE69322491D1 (en) 1999-01-21
DE69322491T2 DE69322491T2 (en) 1999-08-26

Family

ID=26360327

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69322491T Expired - Fee Related DE69322491T2 (en) 1992-02-12 1993-02-12 GRINDING DEVICE AND METHOD FOR USE THEREOF

Country Status (3)

Country Link
EP (1) EP0607441B1 (en)
DE (1) DE69322491T2 (en)
WO (1) WO1993015878A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3708167B2 (en) * 1995-05-17 2005-10-19 株式会社荏原製作所 Polishing cloth and polishing apparatus provided with the polishing cloth
JPH10235552A (en) 1997-02-24 1998-09-08 Ebara Corp Polishing device
JP2918883B1 (en) * 1998-07-15 1999-07-12 日本ピラー工業株式会社 Polishing pad
US6439968B1 (en) 1999-06-30 2002-08-27 Agere Systems Guardian Corp. Polishing pad having a water-repellant film theron and a method of manufacture therefor
DE10303407A1 (en) 2003-01-27 2004-08-19 Friedrich-Schiller-Universität Jena Method and device for high-precision processing of the surface of an object, in particular for polishing and lapping semiconductor substrates
CN109277933A (en) * 2018-10-18 2019-01-29 浙江晶盛机电股份有限公司 A kind of silicon wafer outer round surface burnishing device and polishing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5590263A (en) * 1978-12-26 1980-07-08 Nippon Telegr & Teleph Corp <Ntt> Device for flatly and accurately polishing crystal substrate without causing irregularity
US4979337A (en) * 1986-10-03 1990-12-25 Duppstadt Arthur G Polishing tool for contact lenses and associated method
JPS63200966A (en) * 1987-02-14 1988-08-19 Yoshiaki Nagaura Duplex polishing method
EP0465868B1 (en) * 1990-06-29 1996-10-02 National Semiconductor Corporation Controlled compliance polishing pad

Also Published As

Publication number Publication date
WO1993015878A1 (en) 1993-08-19
EP0607441A1 (en) 1994-07-27
EP0607441B1 (en) 1998-12-09
EP0607441A4 (en) 1994-08-24
DE69322491T2 (en) 1999-08-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee