DE69310438T2 - Verfahren zum Herstellen von engbenachbarten gleichlaufenden Nuten auf einer dünnen Wand und damit hergestelltes Produkt - Google Patents

Verfahren zum Herstellen von engbenachbarten gleichlaufenden Nuten auf einer dünnen Wand und damit hergestelltes Produkt

Info

Publication number
DE69310438T2
DE69310438T2 DE69310438T DE69310438T DE69310438T2 DE 69310438 T2 DE69310438 T2 DE 69310438T2 DE 69310438 T DE69310438 T DE 69310438T DE 69310438 T DE69310438 T DE 69310438T DE 69310438 T2 DE69310438 T2 DE 69310438T2
Authority
DE
Germany
Prior art keywords
trough
block
rod
thin wall
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69310438T
Other languages
English (en)
Other versions
DE69310438D1 (de
Inventor
David A Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnstech International Corp
Original Assignee
Johnstech International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnstech International Corp filed Critical Johnstech International Corp
Publication of DE69310438D1 publication Critical patent/DE69310438D1/de
Application granted granted Critical
Publication of DE69310438T2 publication Critical patent/DE69310438T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical & Material Sciences (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69310438T 1992-06-02 1993-05-27 Verfahren zum Herstellen von engbenachbarten gleichlaufenden Nuten auf einer dünnen Wand und damit hergestelltes Produkt Expired - Fee Related DE69310438T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/892,233 US5254834A (en) 1992-06-02 1992-06-02 Method of forming closely-spaced, generally parallel slots through a thin wall and product formed thereby

Publications (2)

Publication Number Publication Date
DE69310438D1 DE69310438D1 (de) 1997-06-12
DE69310438T2 true DE69310438T2 (de) 1997-10-23

Family

ID=25399606

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69310438T Expired - Fee Related DE69310438T2 (de) 1992-06-02 1993-05-27 Verfahren zum Herstellen von engbenachbarten gleichlaufenden Nuten auf einer dünnen Wand und damit hergestelltes Produkt

Country Status (10)

Country Link
US (1) US5254834A (de)
EP (1) EP0573331B1 (de)
JP (1) JPH07115219B2 (de)
KR (1) KR970005524B1 (de)
AT (1) ATE152862T1 (de)
CA (1) CA2096562C (de)
DE (1) DE69310438T2 (de)
ES (1) ES2102618T3 (de)
MX (1) MX9303276A (de)
TW (1) TW242202B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11548099B2 (en) 2018-12-03 2023-01-10 Mitsubishi Electric Corporation Laser processing method and laser processing apparatus

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5645433A (en) * 1994-05-09 1997-07-08 Johnstech International Corporation Contacting system for electrical devices
US5888075A (en) * 1997-02-10 1999-03-30 Kabushiki Kaisha Nihon Micronics Auxiliary apparatus for testing device
US6064218A (en) * 1997-03-11 2000-05-16 Primeyield Systems, Inc. Peripherally leaded package test contactor
SG88739A1 (en) * 1997-05-15 2002-05-21 Nihon Micronics Kk Auxiliary apparatus for testing device
US6666927B2 (en) * 2001-04-30 2003-12-23 Intel Corporation Vacuum debris removal system for an integrated circuit manufacturing device
DE10261666A1 (de) * 2002-12-23 2004-07-01 Maschinenfabrik Spaichingen Gmbh Verfahren und Vorrichtung zum Laserschneiden
JP4795377B2 (ja) * 2008-03-27 2011-10-19 日立ビアメカニクス株式会社 レーザ加工装置
JP5029969B2 (ja) * 2008-11-12 2012-09-19 山一電機株式会社 電気接続装置
US10987759B2 (en) * 2017-05-31 2021-04-27 Zhaoli Hu Advanced back-strike protection process and related devices for water jet guided laser process
KR102376434B1 (ko) * 2018-01-17 2022-03-22 삼성디스플레이 주식회사 레이저 장치
KR102532733B1 (ko) * 2018-02-14 2023-05-16 삼성디스플레이 주식회사 분진 제거 장치 및 이를 포함하는 레이저 커팅 장치
EP3856448A4 (de) 2018-09-28 2022-06-22 Synfuel Americas Corporation Laserschneidsystem zum schneiden von artikeln und zur formung von filtrationsrohren

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4025143A (en) * 1975-06-10 1977-05-24 Rozmus John J Electrical contacts
US4343358A (en) * 1980-02-07 1982-08-10 Uop Inc. Laser slotted plastic well screen
US4487993A (en) * 1981-04-01 1984-12-11 General Electric Company High density electronic circuits having very narrow conductors
JPH033974Y2 (de) * 1985-06-13 1991-01-31
JPH03501948A (ja) * 1988-09-01 1991-05-09 インスティテュト　フィジキ　アカデミイ　ナウク　リトフスコイ　エスエスエル レーザー処理によるフィルターの製造法及びその装置
JPH0719347B2 (ja) * 1988-09-24 1995-03-06 日本碍子株式会社 固定磁気ディスク装置用コアスライダの製造法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11548099B2 (en) 2018-12-03 2023-01-10 Mitsubishi Electric Corporation Laser processing method and laser processing apparatus
US11697177B2 (en) 2018-12-03 2023-07-11 Mitsubishi Electric Corporation Laser processing method and laser processing apparatus

Also Published As

Publication number Publication date
DE69310438D1 (de) 1997-06-12
MX9303276A (es) 1994-07-29
KR970005524B1 (ko) 1997-04-17
JPH0679480A (ja) 1994-03-22
CA2096562A1 (en) 1993-12-03
ES2102618T3 (es) 1997-08-01
TW242202B (de) 1995-03-01
EP0573331A1 (de) 1993-12-08
ATE152862T1 (de) 1997-05-15
KR940000238A (ko) 1994-01-03
CA2096562C (en) 2001-07-17
EP0573331B1 (de) 1997-05-07
JPH07115219B2 (ja) 1995-12-13
US5254834A (en) 1993-10-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: EISENFUEHR, SPEISER & PARTNER, 10178 BERLIN

8339 Ceased/non-payment of the annual fee