DE69301390D1 - Klebmittelzusammensetzung mit funktionalen Füllstoff - Google Patents

Klebmittelzusammensetzung mit funktionalen Füllstoff

Info

Publication number
DE69301390D1
DE69301390D1 DE69301390T DE69301390T DE69301390D1 DE 69301390 D1 DE69301390 D1 DE 69301390D1 DE 69301390 T DE69301390 T DE 69301390T DE 69301390 T DE69301390 T DE 69301390T DE 69301390 D1 DE69301390 D1 DE 69301390D1
Authority
DE
Germany
Prior art keywords
adhesive composition
functional filler
filler
functional
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69301390T
Other languages
English (en)
Other versions
DE69301390T2 (de
Inventor
Yueh-Ling Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69301390D1 publication Critical patent/DE69301390D1/de
Publication of DE69301390T2 publication Critical patent/DE69301390T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/18—Homopolymers or copolymers of nitriles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C08L2666/32—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/18—Homopolymers or copolymers of nitriles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2631—Coating or impregnation provides heat or fire protection
    • Y10T442/2713—Halogen containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2738—Coating or impregnation intended to function as an adhesive to solid surfaces subsequently associated therewith

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
DE1993601390 1992-10-26 1993-10-04 Klebmittelzusammensetzung mit funktionalen Füllstoff Expired - Lifetime DE69301390T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/966,256 US5331040A (en) 1992-10-26 1992-10-26 Adhesive composition with functional filler

Publications (2)

Publication Number Publication Date
DE69301390D1 true DE69301390D1 (de) 1996-03-07
DE69301390T2 DE69301390T2 (de) 1996-05-30

Family

ID=25511120

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1993601390 Expired - Lifetime DE69301390T2 (de) 1992-10-26 1993-10-04 Klebmittelzusammensetzung mit funktionalen Füllstoff

Country Status (4)

Country Link
US (1) US5331040A (de)
EP (1) EP0595068B1 (de)
JP (1) JP2691128B2 (de)
DE (1) DE69301390T2 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5942581A (en) * 1995-12-13 1999-08-24 Mitsubishi Rayon Co., Ltd. Lubricant for a thermoplastic resin and a thermoplastic resin composition comprising thereof
US6114426A (en) * 1997-11-20 2000-09-05 Lucent Technologies, Inc. Pressure-sensitive flame retardant adhesive
US6303680B1 (en) 1998-10-05 2001-10-16 E.I. Du Pont De Nemours And Company Flame retardant adhesive composition and laminates
KR100711423B1 (ko) * 2000-03-14 2007-05-02 린텍 가부시키가이샤 점착제 조성물, 그것을 사용한 점착시트 및 점착성 광학부재
TW554025B (en) * 2000-04-13 2003-09-21 Lintec Corp Adhesive compositions and adhesive optical elements using thereof
US7151134B2 (en) * 2003-06-17 2006-12-19 Freudenberg-Nok General Partnership Dynamic vulcanization of polyurethane elastomeric material in the presence of thermoplastics
US7022769B2 (en) * 2003-07-15 2006-04-04 Freudenberg-Nok General Partnership Dynamic vulcanization of fluorocarbon elastomers
US20050155690A1 (en) * 2004-01-16 2005-07-21 Park Edward H. Bonding of dynamic vulcanizates of fluorocarbon elastomers
US7351769B2 (en) * 2004-01-26 2008-04-01 Freudenberg-Nok General Partnership Dynamic vulcanization of elastomers with in-situ polymerization
US20050167928A1 (en) 2004-02-04 2005-08-04 Park Edward H. Dynamic seal using vulcanization of fluorocarbon elastomers
US7153908B2 (en) * 2004-02-04 2006-12-26 Freudenberg-Nok General Partnership Peroxide cured fluorocarbon elastomer compositions
JP2005239830A (ja) * 2004-02-25 2005-09-08 Nitto Denko Corp 熱硬化型粘接着剤組成物および熱硬化型粘接着テープ又はシート
US7413697B2 (en) * 2004-06-21 2008-08-19 Freudenberg-Nok General Partnership Pre-molding heat treatment of dynamic vulcanizates of fluorocarbon elastomers
US20060004126A1 (en) * 2004-06-30 2006-01-05 Park Edward H Thermoplastic vulcanizate with functional fillers
US7169644B2 (en) * 2004-08-19 2007-01-30 Ferrari R Keith Method of making multifunction electrode
US7392096B2 (en) * 2004-08-19 2008-06-24 Ferrari R Keith Multifunction electrode and method of making same
JP2006124651A (ja) * 2004-09-29 2006-05-18 Shin Etsu Chem Co Ltd アクリル系難燃性接着剤組成物およびアクリル系難燃性接着剤シート
US20060124693A1 (en) * 2004-12-15 2006-06-15 Meloni Paul A Thermally conductive polyimide film composites having high mechanical elongation useful as a heat conducting portion of an electronic device
US7449523B2 (en) * 2004-12-27 2008-11-11 Freudenberg-Nok General Partnership Fluorocarbon elastomer compositions containing wear reducing additives
US7294427B2 (en) * 2004-12-27 2007-11-13 Fuelcell Energy, Inc. Manifold gasket accommodating differential movement of fuel cell stack
US20060142491A1 (en) * 2004-12-27 2006-06-29 Freudenberg-Nok General Partnership Thermoplastic vulcanizate with high temperature processing aid
US7449524B2 (en) 2005-01-05 2008-11-11 Freudenberg-Nok General Partnership Dynamic vulcanization with fluorocarbon processing aids
US7658387B2 (en) * 2005-06-27 2010-02-09 Freudenberg-Nok General Partnership Reinforced elastomeric seal
US20070004865A1 (en) 2005-06-29 2007-01-04 Freudenberg-Nok General Partnership Dynamic vulcanization of fluorocarbon elastomers containing peroxide cure sites
US7718736B2 (en) * 2005-06-30 2010-05-18 Freudenberg-Nok General Partnership Base resistant FKM-TPV elastomers
US20070093035A1 (en) * 2005-10-19 2007-04-26 Daigle Robert C Circuit board materials with improved bond to conductive metals and methods of the manufacture thereof
US20070167574A1 (en) * 2006-01-13 2007-07-19 Freudenberg-Nok General Partnership Fluorocarbon rubber with enhanced low temperature properties
US7794832B2 (en) * 2006-05-18 2010-09-14 Neenah Paper, Inc. Self-releasing lint tape
US20090317264A1 (en) * 2008-06-18 2009-12-24 Schlumberger Technology Corporation Esp motor windings for high temperature environments
US20120154974A1 (en) * 2010-12-16 2012-06-21 Applied Materials, Inc. High efficiency electrostatic chuck assembly for semiconductor wafer processing
US8821626B2 (en) * 2011-03-18 2014-09-02 Nichias Corporation Adhesive for inorganic fiber

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE530633A (de) * 1953-07-23 1900-01-01
US3179634A (en) * 1962-01-26 1965-04-20 Du Pont Aromatic polyimides and the process for preparing them
US3728150A (en) * 1971-07-12 1973-04-17 Du Pont Bondable adhesive coated polyimide film
US3821016A (en) * 1972-05-19 1974-06-28 Western Electric Co Method of forming an adherent metallic pattern on a polyimide surface
US3900662A (en) * 1973-01-17 1975-08-19 Du Pont Bondable adhesive coated polyimide film and laminates
US3891591A (en) * 1973-08-13 1975-06-24 Du Pont Coating compositions
US4061826A (en) * 1975-01-29 1977-12-06 Minnesota Mining And Manufacturing Company Flame-retardant pressure-sensitive adhesive composition
GB1516802A (en) * 1976-03-02 1978-07-05 Scm Corp Latex paint containing plastic pigment
US4426253A (en) * 1981-12-03 1984-01-17 E. I. Du Pont De Nemours & Co. High speed etching of polyimide film
US4725504A (en) * 1987-02-24 1988-02-16 Polyonics Corporation Metal coated laminate products made from textured polyimide film
CA2030145A1 (en) * 1989-11-20 1991-05-21 Thomas E. Dueber Flame retardant adhesive composition and laminates

Also Published As

Publication number Publication date
US5331040A (en) 1994-07-19
DE69301390T2 (de) 1996-05-30
JP2691128B2 (ja) 1997-12-17
JPH06192635A (ja) 1994-07-12
EP0595068B1 (de) 1996-01-24
EP0595068A1 (de) 1994-05-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition