DE69300143D1 - Geschichtetes Elektronikmodul. - Google Patents

Geschichtetes Elektronikmodul.

Info

Publication number
DE69300143D1
DE69300143D1 DE69300143T DE69300143T DE69300143D1 DE 69300143 D1 DE69300143 D1 DE 69300143D1 DE 69300143 T DE69300143 T DE 69300143T DE 69300143 T DE69300143 T DE 69300143T DE 69300143 D1 DE69300143 D1 DE 69300143D1
Authority
DE
Germany
Prior art keywords
electronics module
layered
layered electronics
module
electronics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69300143T
Other languages
English (en)
Other versions
DE69300143T2 (de
Inventor
Alfred G Ocken
Michael I Petrites
Nathan A Unterman
Timothy S Fisher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive Systems Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of DE69300143D1 publication Critical patent/DE69300143D1/de
Publication of DE69300143T2 publication Critical patent/DE69300143T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/003—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an integrally preformed housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE69300143T 1992-02-24 1993-02-18 Geschichtetes Elektronikmodul. Expired - Lifetime DE69300143T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/840,247 US5179501A (en) 1992-02-24 1992-02-24 Laminated electronic module assembly

Publications (2)

Publication Number Publication Date
DE69300143D1 true DE69300143D1 (de) 1995-06-14
DE69300143T2 DE69300143T2 (de) 1995-12-07

Family

ID=25281837

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69300143T Expired - Lifetime DE69300143T2 (de) 1992-02-24 1993-02-18 Geschichtetes Elektronikmodul.

Country Status (3)

Country Link
US (1) US5179501A (de)
EP (1) EP0557883B1 (de)
DE (1) DE69300143T2 (de)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216581A (en) * 1990-02-05 1993-06-01 Motorola, Inc. Electronic module assembly and method of forming same
US5831828A (en) * 1993-06-03 1998-11-03 International Business Machines Corporation Flexible circuit board and common heat spreader assembly
US5485672A (en) * 1993-06-21 1996-01-23 Texas Instruments Incorporated Method for encasing a printed wiring board
FR2714250B1 (fr) * 1993-12-21 1996-01-19 Siemens Automotive Sa Procédé de pliage d'un support métallique solidaire d'un circuit imprimé flexible et boîtier électronique comportant un tel support.
US5541368A (en) * 1994-07-15 1996-07-30 Dell Usa, L.P. Laminated multi chip module interconnect apparatus
US5434362A (en) * 1994-09-06 1995-07-18 Motorola, Inc. Flexible circuit board assembly and method
FR2725107B1 (fr) * 1994-09-26 1996-12-13 Siemens Automotive Sa Entretoises et boitier de commande electronique comportant de telles entretoises
USD424528S (en) * 1996-08-19 2000-05-09 Operating Technical Electronics, Inc. Box
US5998738A (en) * 1996-08-30 1999-12-07 Motorola Inc. Electronic control module
US5965848A (en) * 1997-07-22 1999-10-12 Randice-Lisa Altschul Disposable portable electronic devices and method of making
US5926369A (en) * 1998-01-22 1999-07-20 International Business Machines Corporation Vertically integrated multi-chip circuit package with heat-sink support
US6061245A (en) * 1998-01-22 2000-05-09 International Business Machines Corporation Free standing, three dimensional, multi-chip, carrier package with air flow baffle
US6112795A (en) * 1998-03-12 2000-09-05 International Business Machines Corporation Fixture for multi-layered ceramic package assembly
USD426225S (en) * 1998-06-17 2000-06-06 Trimble Navigation Limited Global positioning system receiver enclosure
US6833984B1 (en) 2000-05-03 2004-12-21 Rambus, Inc. Semiconductor module with serial bus connection to multiple dies
DE10051884A1 (de) * 2000-10-19 2002-04-25 Cherry Gmbh Verfahren zur Herstellung von Leiterfolie-Trägergehäuse-Einheiten
GB0029312D0 (en) * 2000-12-01 2001-01-17 Philips Corp Intellectual Pty Flexible electronic device
DE10114572A1 (de) * 2001-03-24 2002-11-07 Marquardt Gmbh Träger für eine elektrische Schaltung, insbesondere für einen elektrischen Schalter
US6483037B1 (en) 2001-11-13 2002-11-19 Motorola, Inc. Multilayer flexible FR4 circuit
US6501661B1 (en) * 2001-12-21 2002-12-31 Motorola, Inc. Electronic control unit
USD483725S1 (en) 2002-04-19 2003-12-16 Circadiant Systems, Inc. Modular housing for electronic and optical components
US7075794B2 (en) * 2003-09-11 2006-07-11 Motorola, Inc. Electronic control unit
US6927344B1 (en) 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly
JP4123175B2 (ja) * 2004-03-23 2008-07-23 株式会社日立製作所 半導体装置
DE102004046251B4 (de) * 2004-04-19 2008-08-21 Lenze Drive Systems Gmbh Verfahren zur biegenden Herstellung eines Geräts der Leistungselektronik
US8139364B2 (en) * 2007-01-31 2012-03-20 Robert Bosch Gmbh Electronic control module assembly
DE102008051547A1 (de) * 2008-10-14 2010-04-15 Continental Automotive Gmbh Elektronisches Gerät mit Bechergehäuse und Verfahren zur Herstellung desselben
USD716304S1 (en) * 2012-02-09 2014-10-28 Hid Global Gmbh RFID reader
USD714729S1 (en) 2012-03-06 2014-10-07 Apple Inc. Adapter
USD684538S1 (en) 2012-06-08 2013-06-18 Apple Inc. Adapter
USD721331S1 (en) 2012-06-10 2015-01-20 Apple Inc. Electronic device
USD684976S1 (en) 2012-09-07 2013-06-25 Jody Akana Adapter
USD699188S1 (en) 2012-09-11 2014-02-11 Apple Inc. Adapter
USD781785S1 (en) 2012-09-11 2017-03-21 Apple Inc. Adapter
US9019710B2 (en) * 2012-10-11 2015-04-28 Apple Inc. Devices having flexible printed circuits with bent stiffeners
USD712382S1 (en) 2013-01-03 2014-09-02 Beats Electronics, Llc Audio listening system
USD707652S1 (en) 2013-01-03 2014-06-24 Beats Electronics, Llc Audio listening system
USD751080S1 (en) * 2013-08-07 2016-03-08 Intelligent Energy Limited End port cover
USD732023S1 (en) * 2013-12-26 2015-06-16 Panasonic Intellectual Property Management Co., Ltd. Wireless receiver
US9769920B2 (en) * 2014-03-26 2017-09-19 Apple Inc. Flexible printed circuits with bend retention structures
USD734744S1 (en) 2014-05-15 2015-07-21 Apple Inc. Audio listening system
USD958776S1 (en) 2014-05-15 2022-07-26 Apple Inc. Earpiece
US20150342069A1 (en) * 2014-05-20 2015-11-26 Freescale Semiconductor, Inc. Housing for electronic devices
USD754131S1 (en) * 2014-09-01 2016-04-19 Samsung Electronics Co., Ltd. Portable solid state disk
USD776634S1 (en) * 2015-02-05 2017-01-17 Lg Electronics Inc. Portable earset case
USD799316S1 (en) 2015-06-09 2017-10-10 Apple Inc. Package with earphones
USD792409S1 (en) * 2015-11-11 2017-07-18 Samsung Electronics Co., Ltd. External solid state drive
USD781263S1 (en) * 2015-12-11 2017-03-14 Razer (Asia-Pacific) Pte. Ltd. Speaker
USD823279S1 (en) * 2016-04-21 2018-07-17 Shenzhen Voxtech Co., Ltd. Bone conduction speaker
USD821357S1 (en) * 2016-07-11 2018-06-26 Porsche Lizenz—und Handelsgesellschaft mbH & Co. KG Loudspeaker
USD837790S1 (en) * 2016-08-03 2019-01-08 Transcend Information, Inc. Mobile storage device
USD797751S1 (en) * 2016-08-22 2017-09-19 Ypb Group Ltd. Portable OTG anti-counterfeit scanner
USD866558S1 (en) * 2016-11-11 2019-11-12 Samsung Electronics Co., Ltd. SSD storage device
USD888000S1 (en) * 2018-08-29 2020-06-23 Samsung Electronics Co., Ltd. Case for a circuit board
USD911960S1 (en) * 2018-12-04 2021-03-02 Luraco, Inc. Portable tool controller
CA190078S (en) 2019-03-25 2021-04-23 Apple Inc Case
USD896200S1 (en) 2019-03-25 2020-09-15 Apple Inc. Earphones
USD905002S1 (en) 2019-05-09 2020-12-15 Apple Inc. Case with earphones
USD904901S1 (en) 2019-03-25 2020-12-15 Apple Inc. Case with earphones
USD897320S1 (en) 2019-03-25 2020-09-29 Apple Inc. Pair of earphones
EP3826153A1 (de) * 2019-11-22 2021-05-26 Siemens Aktiengesellschaft Antrieb mit segmentiertem umrichtergehäuse
USD901381S1 (en) * 2019-12-03 2020-11-10 Spigen Korea Co., Ltd. Charger for mobile device
USD909967S1 (en) * 2020-03-30 2021-02-09 Ampere LLC Power bank
USD966119S1 (en) * 2020-06-01 2022-10-11 Geotab Inc. Telematics device
USD1027852S1 (en) * 2022-04-14 2024-05-21 Hewlett-Packard Development Company, L.P. Wireless charging case

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1519246A (fr) * 1966-04-15 1968-03-29 Philips Nv Procédé de réalisation d'un câblage auto-porteur et câblage réalisé suivant ce procédé
US3676746A (en) * 1970-12-23 1972-07-11 Honeywell Inf Systems Compatible modular circuit board connector
US3721746A (en) * 1971-10-01 1973-03-20 Motorola Inc Shielding techniques for r.f. circuitry
US3766439A (en) * 1972-01-12 1973-10-16 Gen Electric Electronic module using flexible printed circuit board with heat sink means
US3971127A (en) * 1975-09-10 1976-07-27 Bell Telephone Laboratories, Incorporated Method of fabricating a printed wiring board assembly
US4152671A (en) * 1977-07-25 1979-05-01 Atari, Inc. Oscillator-modulator apparatus and method therefor
US4394707A (en) * 1981-02-26 1983-07-19 Bell Telephone Laboratories, Incorporated Electrical circuit package
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
US4528748A (en) * 1982-11-29 1985-07-16 General Electric Company Method for fabricating a printed circuit board of desired shape
JPS59175785A (ja) * 1983-03-26 1984-10-04 ソニー株式会社 配線基板
DE3414480C2 (de) * 1984-04-17 1993-02-25 Ifm Electronic Gmbh, 4300 Essen Elektrisches, insbesondere elektronisches, berührungslos arbeitendes Schaltgerät
WO1985005756A1 (en) * 1984-05-25 1985-12-19 Motorola, Inc. Multiple planar heat sink
US4703984A (en) * 1985-10-28 1987-11-03 Burroughs Corporation Flexible access connector with miniature slotted pads
US4858073A (en) * 1986-12-10 1989-08-15 Akzo America Inc. Metal substrated printed circuit
US4843520A (en) * 1987-02-03 1989-06-27 Matsushita Electric Industrial Co. Ltd. Electronic circuit module
JPS6466990A (en) * 1987-09-08 1989-03-13 Furukawa Electric Co Ltd Molded circuit board
US4811165A (en) * 1987-12-07 1989-03-07 Motorola, Inc. Assembly for circuit modules
EP0366141B1 (de) * 1988-10-27 1995-10-18 Mazda Motor Corporation Integrierte Schaltung für Fahrzeug
US4922059A (en) * 1988-12-29 1990-05-01 Motorola, Inc. Origami composite EMI/TEMPEST proof electronics module
US5103375A (en) * 1990-02-05 1992-04-07 Motorola, Inc. Electronic module assembly and method of manufacture

Also Published As

Publication number Publication date
DE69300143T2 (de) 1995-12-07
EP0557883A1 (de) 1993-09-01
US5179501A (en) 1993-01-12
EP0557883B1 (de) 1995-05-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: TEMIC AUTOMOTIVE OF NORTH AMERICA,INC.,, DEER , US

R071 Expiry of right

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