DE69231858T2 - Antifuse structure having a side wall and manufacturing processes - Google Patents

Antifuse structure having a side wall and manufacturing processes

Info

Publication number
DE69231858T2
DE69231858T2 DE1992631858 DE69231858T DE69231858T2 DE 69231858 T2 DE69231858 T2 DE 69231858T2 DE 1992631858 DE1992631858 DE 1992631858 DE 69231858 T DE69231858 T DE 69231858T DE 69231858 T2 DE69231858 T2 DE 69231858T2
Authority
DE
Grant status
Grant
Patent type
Prior art keywords
side wall
manufacturing processes
antifuse structure
antifuse
structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1992631858
Other languages
German (de)
Other versions
DE69231858D1 (en )
Inventor
David Kuan-Yu Liu
Kueing-Long Chen
Bert R Riemenschneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5252Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
DE1992631858 1991-02-19 1992-02-18 Antifuse structure having a side wall and manufacturing processes Expired - Lifetime DE69231858T2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US65770391 true 1991-02-19 1991-02-19

Publications (1)

Publication Number Publication Date
DE69231858T2 true DE69231858T2 (en) 2002-03-28

Family

ID=24638315

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1992631858 Expired - Lifetime DE69231858T2 (en) 1991-02-19 1992-02-18 Antifuse structure having a side wall and manufacturing processes
DE1992631858 Expired - Fee Related DE69231858D1 (en) 1991-02-19 1992-02-18 Antifuse structure having a side wall and manufacturing processes

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1992631858 Expired - Fee Related DE69231858D1 (en) 1991-02-19 1992-02-18 Antifuse structure having a side wall and manufacturing processes

Country Status (2)

Country Link
EP (1) EP0500034B1 (en)
DE (2) DE69231858T2 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780323A (en) 1990-04-12 1998-07-14 Actel Corporation Fabrication method for metal-to-metal antifuses incorporating a tungsten via plug
US5404029A (en) * 1990-04-12 1995-04-04 Actel Corporation Electrically programmable antifuse element
US5272101A (en) * 1990-04-12 1993-12-21 Actel Corporation Electrically programmable antifuse and fabrication processes
US5552627A (en) * 1990-04-12 1996-09-03 Actel Corporation Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayers
US5614756A (en) 1990-04-12 1997-03-25 Actel Corporation Metal-to-metal antifuse with conductive
EP0558176A1 (en) * 1992-02-26 1993-09-01 Actel Corporation Metal-to-metal antifuse with improved diffusion barrier layer
US5475253A (en) * 1992-08-21 1995-12-12 Xilinx, Inc. Antifuse structure with increased breakdown at edges
US5308795A (en) * 1992-11-04 1994-05-03 Actel Corporation Above via metal-to-metal antifuse
US5498895A (en) * 1993-07-07 1996-03-12 Actel Corporation Process ESD protection devices for use with antifuses
US5581111A (en) * 1993-07-07 1996-12-03 Actel Corporation Dielectric-polysilicon-dielectric antifuse for field programmable logic applications
US5369054A (en) 1993-07-07 1994-11-29 Actel Corporation Circuits for ESD protection of metal-to-metal antifuses during processing
US5856234A (en) * 1993-09-14 1999-01-05 Actel Corporation Method of fabricating an antifuse
US5485031A (en) 1993-11-22 1996-01-16 Actel Corporation Antifuse structure suitable for VLSI application
KR0151383B1 (en) * 1994-06-16 1998-10-01 문정환 Programmable semiconductor device with anti-fuse and manufacturing method thereof
DE69533537T2 (en) * 1994-12-29 2006-07-06 Infineon Technologies Ag Melting structure for an integrated circuit arrangement
JPH08222648A (en) * 1995-02-14 1996-08-30 Canon Inc Memory
US5789764A (en) * 1995-04-14 1998-08-04 Actel Corporation Antifuse with improved antifuse material
US5592016A (en) * 1995-04-14 1997-01-07 Actel Corporation Antifuse with improved antifuse material
KR100252447B1 (en) 1995-06-02 2000-04-15 아르므 엠. 무센 Raised tungsten plug antifuse and fabrication process
US5986322A (en) * 1995-06-06 1999-11-16 Mccollum; John L. Reduced leakage antifuse structure
US5741720A (en) * 1995-10-04 1998-04-21 Actel Corporation Method of programming an improved metal-to-metal via-type antifuse
US5726484A (en) * 1996-03-06 1998-03-10 Xilinx, Inc. Multilayer amorphous silicon antifuse
DE10255427B4 (en) * 2002-11-28 2008-01-17 Infineon Technologies Ag A process for producing an antifuse in a substrate and antifuse structure for integration into a substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4823181A (en) * 1986-05-09 1989-04-18 Actel Corporation Programmable low impedance anti-fuse element
US4899205A (en) * 1986-05-09 1990-02-06 Actel Corporation Electrically-programmable low-impedance anti-fuse element
US4914055A (en) * 1989-08-24 1990-04-03 Advanced Micro Devices, Inc. Semiconductor antifuse structure and method

Also Published As

Publication number Publication date Type
DE69231858D1 (en) 2001-07-12 grant
EP0500034B1 (en) 2001-06-06 grant
EP0500034A1 (en) 1992-08-26 application

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