DE69219664D1 - Dreidimensionales Polysilan - Google Patents
Dreidimensionales PolysilanInfo
- Publication number
- DE69219664D1 DE69219664D1 DE69219664T DE69219664T DE69219664D1 DE 69219664 D1 DE69219664 D1 DE 69219664D1 DE 69219664 T DE69219664 T DE 69219664T DE 69219664 T DE69219664 T DE 69219664T DE 69219664 D1 DE69219664 D1 DE 69219664D1
- Authority
- DE
- Germany
- Prior art keywords
- polysilane
- dimensional
- dimensional polysilane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0754—Non-macromolecular compounds containing silicon-to-silicon bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/16—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9161391 | 1991-03-29 | ||
JP27802891A JP3251614B2 (ja) | 1991-03-29 | 1991-10-24 | ポリシラン |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69219664D1 true DE69219664D1 (de) | 1997-06-19 |
DE69219664T2 DE69219664T2 (de) | 1997-10-02 |
Family
ID=26433063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69219664T Expired - Fee Related DE69219664T2 (de) | 1991-03-29 | 1992-03-27 | Dreidimensionales Polysilan |
Country Status (4)
Country | Link |
---|---|
US (1) | US5336736A (de) |
EP (1) | EP0506432B1 (de) |
JP (1) | JP3251614B2 (de) |
DE (1) | DE69219664T2 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5438113A (en) * | 1992-03-30 | 1995-08-01 | Kabushiki Kaisha Toshiba | Thermosetting resin composition |
JP3469446B2 (ja) * | 1996-11-29 | 2003-11-25 | 株式会社東芝 | 樹脂組成物およびこれを用いた樹脂封止型半導体装置の製造方法 |
WO1998030618A1 (fr) | 1997-01-09 | 1998-07-16 | Osaka Gas Company Limited | Polysilanes et leur procede de production |
US6225238B1 (en) * | 1999-06-07 | 2001-05-01 | Allied Signal Inc | Low dielectric constant polyorganosilicon coatings generated from polycarbosilanes |
US6841256B2 (en) | 1999-06-07 | 2005-01-11 | Honeywell International Inc. | Low dielectric constant polyorganosilicon materials generated from polycarbosilanes |
KR100518533B1 (ko) | 2002-06-14 | 2005-10-04 | 삼성전자주식회사 | 에폭시 링을 포함하는 베이스 폴리머와 실리콘 함유가교제로 이루어지는 네가티브형 레지스트 조성물 및 이를이용한 반도체 소자의 패턴 형성 방법 |
US6890868B2 (en) * | 2002-10-17 | 2005-05-10 | Xerox Corporation | Process for depositing gelable composition that includes dissolving gelable composition in liquid with agitating to disrupt gelling |
JP3869403B2 (ja) * | 2003-09-30 | 2007-01-17 | 株式会社東芝 | ホログラム記録媒体、その製造方法、およびホログラム記録方法 |
US20050133384A1 (en) * | 2003-12-19 | 2005-06-23 | 3M Innovative Properties Company | Packaged orthodontic assembly with adhesive precoated appliances |
US7344811B2 (en) * | 2004-10-28 | 2008-03-18 | Samsung Electronic Co., Ltd. | Polysilane-based charge transport materials |
US7971730B2 (en) | 2005-08-10 | 2011-07-05 | The Regents Of The University Of California | Collection tubes apparatus, systems and methods |
KR101308790B1 (ko) | 2005-12-07 | 2013-09-17 | 오사까 가스 가부시키가이샤 | 폴리실란 및 폴리실란을 함유하는 수지 조성물 |
KR101166015B1 (ko) * | 2006-04-26 | 2012-07-19 | 삼성에스디아이 주식회사 | 전자 방출원, 전자 방출원 형성용 조성물, 상기 전자방출원의 제조 방법 및 상기 전자 방출원을 구비한 전자방출 소자 |
US9669405B2 (en) | 2012-10-22 | 2017-06-06 | The Regents Of The University Of California | Sterilizable photopolymer serum separator |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4588801A (en) * | 1984-04-05 | 1986-05-13 | The United States Of America As Represented By The United States Department Of Energy | Polysilane positive photoresist materials and methods for their use |
US4822716A (en) * | 1985-12-27 | 1989-04-18 | Kabushiki Kaisha Toshiba | Polysilanes, Polysiloxanes and silicone resist materials containing these compounds |
JPH0684432B2 (ja) * | 1986-05-21 | 1994-10-26 | 株式会社東芝 | ポリシラン及びそれを用いた感光性組成物 |
JP2507481B2 (ja) * | 1987-05-21 | 1996-06-12 | 株式会社東芝 | ポリシラン及び感光性組成物 |
FR2616152B1 (fr) * | 1987-06-03 | 1991-08-30 | Inst Rech Appliquee Polym | Nouveaux polysilanes, polysilanes modifies correspondants, leur preparation et leur application dans des compositions reticulables |
-
1991
- 1991-10-24 JP JP27802891A patent/JP3251614B2/ja not_active Expired - Fee Related
-
1992
- 1992-03-27 DE DE69219664T patent/DE69219664T2/de not_active Expired - Fee Related
- 1992-03-27 EP EP92302672A patent/EP0506432B1/de not_active Expired - Lifetime
-
1993
- 1993-04-29 US US08/053,810 patent/US5336736A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0506432A1 (de) | 1992-09-30 |
JP3251614B2 (ja) | 2002-01-28 |
EP0506432B1 (de) | 1997-05-14 |
US5336736A (en) | 1994-08-09 |
JPH04363327A (ja) | 1992-12-16 |
DE69219664T2 (de) | 1997-10-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |