DE69219664D1 - Dreidimensionales Polysilan - Google Patents

Dreidimensionales Polysilan

Info

Publication number
DE69219664D1
DE69219664D1 DE69219664T DE69219664T DE69219664D1 DE 69219664 D1 DE69219664 D1 DE 69219664D1 DE 69219664 T DE69219664 T DE 69219664T DE 69219664 T DE69219664 T DE 69219664T DE 69219664 D1 DE69219664 D1 DE 69219664D1
Authority
DE
Germany
Prior art keywords
polysilane
dimensional
dimensional polysilane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69219664T
Other languages
English (en)
Other versions
DE69219664T2 (de
Inventor
Yoshihiko Nakano
Shuzi Hayase
Shinji Murai
Yukihiro Mikogami
Akira Yoshizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69219664D1 publication Critical patent/DE69219664D1/de
Application granted granted Critical
Publication of DE69219664T2 publication Critical patent/DE69219664T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0754Non-macromolecular compounds containing silicon-to-silicon bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/60Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/16Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
DE69219664T 1991-03-29 1992-03-27 Dreidimensionales Polysilan Expired - Fee Related DE69219664T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9161391 1991-03-29
JP27802891A JP3251614B2 (ja) 1991-03-29 1991-10-24 ポリシラン

Publications (2)

Publication Number Publication Date
DE69219664D1 true DE69219664D1 (de) 1997-06-19
DE69219664T2 DE69219664T2 (de) 1997-10-02

Family

ID=26433063

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69219664T Expired - Fee Related DE69219664T2 (de) 1991-03-29 1992-03-27 Dreidimensionales Polysilan

Country Status (4)

Country Link
US (1) US5336736A (de)
EP (1) EP0506432B1 (de)
JP (1) JP3251614B2 (de)
DE (1) DE69219664T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438113A (en) * 1992-03-30 1995-08-01 Kabushiki Kaisha Toshiba Thermosetting resin composition
JP3469446B2 (ja) * 1996-11-29 2003-11-25 株式会社東芝 樹脂組成物およびこれを用いた樹脂封止型半導体装置の製造方法
WO1998030618A1 (fr) 1997-01-09 1998-07-16 Osaka Gas Company Limited Polysilanes et leur procede de production
US6225238B1 (en) * 1999-06-07 2001-05-01 Allied Signal Inc Low dielectric constant polyorganosilicon coatings generated from polycarbosilanes
US6841256B2 (en) 1999-06-07 2005-01-11 Honeywell International Inc. Low dielectric constant polyorganosilicon materials generated from polycarbosilanes
KR100518533B1 (ko) 2002-06-14 2005-10-04 삼성전자주식회사 에폭시 링을 포함하는 베이스 폴리머와 실리콘 함유가교제로 이루어지는 네가티브형 레지스트 조성물 및 이를이용한 반도체 소자의 패턴 형성 방법
US6890868B2 (en) * 2002-10-17 2005-05-10 Xerox Corporation Process for depositing gelable composition that includes dissolving gelable composition in liquid with agitating to disrupt gelling
JP3869403B2 (ja) * 2003-09-30 2007-01-17 株式会社東芝 ホログラム記録媒体、その製造方法、およびホログラム記録方法
US20050133384A1 (en) * 2003-12-19 2005-06-23 3M Innovative Properties Company Packaged orthodontic assembly with adhesive precoated appliances
US7344811B2 (en) * 2004-10-28 2008-03-18 Samsung Electronic Co., Ltd. Polysilane-based charge transport materials
US7971730B2 (en) 2005-08-10 2011-07-05 The Regents Of The University Of California Collection tubes apparatus, systems and methods
KR101308790B1 (ko) 2005-12-07 2013-09-17 오사까 가스 가부시키가이샤 폴리실란 및 폴리실란을 함유하는 수지 조성물
KR101166015B1 (ko) * 2006-04-26 2012-07-19 삼성에스디아이 주식회사 전자 방출원, 전자 방출원 형성용 조성물, 상기 전자방출원의 제조 방법 및 상기 전자 방출원을 구비한 전자방출 소자
US9669405B2 (en) 2012-10-22 2017-06-06 The Regents Of The University Of California Sterilizable photopolymer serum separator

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4588801A (en) * 1984-04-05 1986-05-13 The United States Of America As Represented By The United States Department Of Energy Polysilane positive photoresist materials and methods for their use
US4822716A (en) * 1985-12-27 1989-04-18 Kabushiki Kaisha Toshiba Polysilanes, Polysiloxanes and silicone resist materials containing these compounds
JPH0684432B2 (ja) * 1986-05-21 1994-10-26 株式会社東芝 ポリシラン及びそれを用いた感光性組成物
JP2507481B2 (ja) * 1987-05-21 1996-06-12 株式会社東芝 ポリシラン及び感光性組成物
FR2616152B1 (fr) * 1987-06-03 1991-08-30 Inst Rech Appliquee Polym Nouveaux polysilanes, polysilanes modifies correspondants, leur preparation et leur application dans des compositions reticulables

Also Published As

Publication number Publication date
EP0506432A1 (de) 1992-09-30
JP3251614B2 (ja) 2002-01-28
EP0506432B1 (de) 1997-05-14
US5336736A (en) 1994-08-09
JPH04363327A (ja) 1992-12-16
DE69219664T2 (de) 1997-10-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee