DE69216730D1 - Starre-flexible Leiterplatten mit Erhöhungen als IC-Prüfspitzen - Google Patents

Starre-flexible Leiterplatten mit Erhöhungen als IC-Prüfspitzen

Info

Publication number
DE69216730D1
DE69216730D1 DE69216730T DE69216730T DE69216730D1 DE 69216730 D1 DE69216730 D1 DE 69216730D1 DE 69216730 T DE69216730 T DE 69216730T DE 69216730 T DE69216730 T DE 69216730T DE 69216730 D1 DE69216730 D1 DE 69216730D1
Authority
DE
Germany
Prior art keywords
elevations
rigid
printed circuit
circuit boards
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69216730T
Other languages
English (en)
Other versions
DE69216730T2 (de
Inventor
Blake F Woith
William R Crumly
Jacques F Linder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/752,422 external-priority patent/US5264787A/en
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of DE69216730D1 publication Critical patent/DE69216730D1/de
Publication of DE69216730T2 publication Critical patent/DE69216730T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE1992616730 1991-08-26 1992-08-20 Starre-flexible Leiterplatten mit Erhöhungen als IC-Prüfspitzen Expired - Fee Related DE69216730T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74977091A 1991-08-26 1991-08-26
US07/752,422 US5264787A (en) 1991-08-30 1991-08-30 Rigid-flex circuits with raised features as IC test probes

Publications (2)

Publication Number Publication Date
DE69216730D1 true DE69216730D1 (de) 1997-02-27
DE69216730T2 DE69216730T2 (de) 1997-08-07

Family

ID=27115170

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1992616965 Expired - Fee Related DE69216965T2 (de) 1991-08-26 1992-08-20 Elektrische Schaltung mit einem elastischen Dichtungsring zur Verbindung eines erhöhten Kontaktes
DE1992616730 Expired - Fee Related DE69216730T2 (de) 1991-08-26 1992-08-20 Starre-flexible Leiterplatten mit Erhöhungen als IC-Prüfspitzen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE1992616965 Expired - Fee Related DE69216965T2 (de) 1991-08-26 1992-08-20 Elektrische Schaltung mit einem elastischen Dichtungsring zur Verbindung eines erhöhten Kontaktes

Country Status (2)

Country Link
EP (2) EP0532926B1 (de)
DE (2) DE69216965T2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6164982A (en) * 1998-07-09 2000-12-26 Advantest Corporation IC socket for holding IC having multiple parallel pins

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4116517A (en) * 1976-04-15 1978-09-26 International Telephone And Telegraph Corporation Flexible printed circuit and electrical connection therefor
US4645280A (en) * 1985-08-08 1987-02-24 Rogers Corporation Solderless connection technique between data/servo flex circuits and magnetic disc heads
KR870006645A (ko) * 1985-12-23 1987-07-13 로버트 에스 헐스 집적회로의 멀티플리드 프로브장치
EP0259163A3 (de) * 1986-09-05 1989-07-12 Tektronix, Inc. Sonde für Halbleiterwafer
US4912399A (en) * 1987-06-09 1990-03-27 Tektronix, Inc. Multiple lead probe for integrated circuits in wafer form
FR2617290B1 (fr) * 1987-06-26 1989-12-29 Labo Electronique Physique Dispositif de test de circuit integre
EP0304868A3 (de) * 1987-08-28 1990-10-10 Tektronix Inc. Vielfachsonde für integrierte Schaltungen in Scheibenform
DE68909811D1 (de) * 1988-03-01 1993-11-18 Hewlett Packard Co IC-Testsonde auf Membranbasis mit präzise positionierten Kontakten.
JPH055657Y2 (de) * 1988-05-10 1993-02-15
US4972143A (en) * 1988-11-30 1990-11-20 Hughes Aircraft Company Diaphragm test probe
US5148103A (en) * 1990-10-31 1992-09-15 Hughes Aircraft Company Apparatus for testing integrated circuits

Also Published As

Publication number Publication date
EP0532925A1 (de) 1993-03-24
EP0532926A1 (de) 1993-03-24
EP0532926B1 (de) 1997-01-22
DE69216730T2 (de) 1997-08-07
EP0532925B1 (de) 1997-01-15
DE69216965D1 (de) 1997-03-06
DE69216965T2 (de) 1997-08-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee