DE69201300D1 - WäRMELEITUNGSUMSETZER UND VERFAHREN FUR SCHALTPLATINENANORDNUNG. - Google Patents

WäRMELEITUNGSUMSETZER UND VERFAHREN FUR SCHALTPLATINENANORDNUNG.

Info

Publication number
DE69201300D1
DE69201300D1 DE69201300T DE69201300T DE69201300D1 DE 69201300 D1 DE69201300 D1 DE 69201300D1 DE 69201300 T DE69201300 T DE 69201300T DE 69201300 T DE69201300 T DE 69201300T DE 69201300 D1 DE69201300 D1 DE 69201300D1
Authority
DE
Germany
Prior art keywords
heat converter
switchboard arrangement
switchboard
arrangement
converter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69201300T
Other languages
English (en)
Other versions
DE69201300T2 (de
Inventor
William Smith
Eugene Brodie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of DE69201300D1 publication Critical patent/DE69201300D1/de
Publication of DE69201300T2 publication Critical patent/DE69201300T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Credit Cards Or The Like (AREA)
DE69201300T 1991-07-02 1992-07-01 WäRMELEITUNGSUMSETZER UND VERFAHREN FUR SCHALTPLATINENANORDNUNG. Expired - Lifetime DE69201300T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/724,695 US5161092A (en) 1991-07-02 1991-07-02 Circuit card assembly conduction converter
PCT/US1992/005567 WO1993001701A1 (en) 1991-07-02 1992-07-01 Circuit card assembly conduction converter and method

Publications (2)

Publication Number Publication Date
DE69201300D1 true DE69201300D1 (de) 1995-03-09
DE69201300T2 DE69201300T2 (de) 1995-05-24

Family

ID=24911491

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69201300T Expired - Lifetime DE69201300T2 (de) 1991-07-02 1992-07-01 WäRMELEITUNGSUMSETZER UND VERFAHREN FUR SCHALTPLATINENANORDNUNG.

Country Status (6)

Country Link
US (1) US5161092A (de)
EP (1) EP0546172B1 (de)
JP (1) JPH0773159B2 (de)
AU (1) AU654042B2 (de)
DE (1) DE69201300T2 (de)
WO (1) WO1993001701A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416403C2 (de) * 1994-05-09 2000-07-13 Schweizer Electronic Ag Kühlvorrichtung für eine Leiterplatte und Verfahren zum Herstellen einer solchen Kühlvorrichtung
US5784256A (en) * 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
DE59913345D1 (de) * 1998-09-09 2006-05-24 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Wärmeleitende Einlegematte für elektrische und elektronische Geräte
DE19929209A1 (de) * 1999-06-25 2001-01-18 Siemens Ag Elektronisches Steuergerät mit Kühlkörper und Herstellungsverfahren
FR2803166B1 (fr) * 1999-12-28 2002-05-31 Thomson Csf Sextant Module electronique a haut pouvoir de refroidissement
SE529673C2 (sv) * 2004-09-20 2007-10-16 Danaher Motion Stockholm Ab Kretsarrangemang för kylning av ytmonterade halvledare
WO2011033294A1 (en) * 2009-09-15 2011-03-24 Bae Systems Plc An electronic device
DE102012204004A1 (de) * 2012-03-14 2013-09-19 Zf Friedrichshafen Ag Abdeckvorrichtung für einen Kontaktierungsabschnitt einer Leiterplatte, Steuersystem für ein Mechatronikmodul und Verfahren zum Zusammenfügen eines Steuersystems
US10923786B2 (en) 2018-08-31 2021-02-16 Dana Automotive Systems Group, Llc Housing assembly for one or more electro chemical cells

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3764856A (en) * 1972-05-17 1973-10-09 Massachusetts Inst Technology Heat transfer in electronic equipment
US4277816A (en) * 1979-05-29 1981-07-07 International Business Machines Corporation Electronic circuit module cooling
US4366526A (en) * 1980-10-03 1982-12-28 Grumman Aerospace Corporation Heat-pipe cooled electronic circuit card
DE3477101D1 (en) * 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts
US4838347A (en) * 1987-07-02 1989-06-13 American Telephone And Telegraph Company At&T Bell Laboratories Thermal conductor assembly
US4811165A (en) * 1987-12-07 1989-03-07 Motorola, Inc. Assembly for circuit modules
US4899256A (en) * 1988-06-01 1990-02-06 Chrysler Motors Corporation Power module
US4965699A (en) * 1989-04-18 1990-10-23 Magnavox Government And Industrial Electronics Company Circuit card assembly cold plate
US4979074A (en) * 1989-06-12 1990-12-18 Flavors Technology Printed circuit board heat sink

Also Published As

Publication number Publication date
AU2322992A (en) 1993-02-11
JPH0773159B2 (ja) 1995-08-02
AU654042B2 (en) 1994-10-20
EP0546172B1 (de) 1995-01-25
WO1993001701A1 (en) 1993-01-21
EP0546172A1 (de) 1993-06-16
US5161092A (en) 1992-11-03
DE69201300T2 (de) 1995-05-24
JPH05506547A (ja) 1993-09-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: RAYTHEON CO. (N.D.GES.D. STAATES DELAWARE), LEXING

8328 Change in the person/name/address of the agent

Representative=s name: WITTE, WELLER & PARTNER, 70178 STUTTGART

R071 Expiry of right

Ref document number: 546172

Country of ref document: EP