DE69201126T2 - Elektronischer Baugruppenträger mit niedrigem thermischem Widerstand. - Google Patents

Elektronischer Baugruppenträger mit niedrigem thermischem Widerstand.

Info

Publication number
DE69201126T2
DE69201126T2 DE69201126T DE69201126T DE69201126T2 DE 69201126 T2 DE69201126 T2 DE 69201126T2 DE 69201126 T DE69201126 T DE 69201126T DE 69201126 T DE69201126 T DE 69201126T DE 69201126 T2 DE69201126 T2 DE 69201126T2
Authority
DE
Germany
Prior art keywords
electronic
subrack
thermal resistance
low thermal
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69201126T
Other languages
English (en)
Other versions
DE69201126D1 (de
Inventor
Michel Lebailly
Jean-Claude Taverdet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Transcal
Original Assignee
Transcal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Transcal filed Critical Transcal
Publication of DE69201126D1 publication Critical patent/DE69201126D1/de
Application granted granted Critical
Publication of DE69201126T2 publication Critical patent/DE69201126T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
DE69201126T 1991-10-24 1992-10-22 Elektronischer Baugruppenträger mit niedrigem thermischem Widerstand. Expired - Fee Related DE69201126T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9113361A FR2683115A1 (fr) 1991-10-24 1991-10-24 Support de carte de composants electroniques a faible resistance thermique.

Publications (2)

Publication Number Publication Date
DE69201126D1 DE69201126D1 (de) 1995-02-16
DE69201126T2 true DE69201126T2 (de) 1995-05-24

Family

ID=9418438

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69201126T Expired - Fee Related DE69201126T2 (de) 1991-10-24 1992-10-22 Elektronischer Baugruppenträger mit niedrigem thermischem Widerstand.

Country Status (6)

Country Link
EP (1) EP0541456B1 (de)
JP (1) JPH05218672A (de)
AT (1) ATE116790T1 (de)
DE (1) DE69201126T2 (de)
DK (1) DK0541456T3 (de)
FR (1) FR2683115A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560423A (en) * 1994-07-28 1996-10-01 Aavid Laboratories, Inc. Flexible heat pipe for integrated circuit cooling apparatus
EP0732743A3 (de) * 1995-03-17 1998-05-13 Texas Instruments Incorporated Wärmesenken
US7069975B1 (en) 1999-09-16 2006-07-04 Raytheon Company Method and apparatus for cooling with a phase change material and heat pipes

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847731A (en) * 1988-07-05 1989-07-11 The United States Of America As Represented By The Secretary Of The Navy Liquid cooled high density packaging for high speed circuits
DE3913161A1 (de) * 1989-04-21 1990-10-31 Schulz Harder Juergen Aus kupfer- und keramikschichten bestehendes mehrschichtiges substrat fuer leiterplatten elektrischer schaltungen

Also Published As

Publication number Publication date
DE69201126D1 (de) 1995-02-16
DK0541456T3 (da) 1995-03-13
EP0541456A1 (de) 1993-05-12
FR2683115A1 (fr) 1993-04-30
ATE116790T1 (de) 1995-01-15
EP0541456B1 (de) 1995-01-04
JPH05218672A (ja) 1993-08-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee