DE69122910D1 - Copper electroplating process - Google Patents

Copper electroplating process

Info

Publication number
DE69122910D1
DE69122910D1 DE69122910T DE69122910T DE69122910D1 DE 69122910 D1 DE69122910 D1 DE 69122910D1 DE 69122910 T DE69122910 T DE 69122910T DE 69122910 T DE69122910 T DE 69122910T DE 69122910 D1 DE69122910 D1 DE 69122910D1
Authority
DE
Germany
Prior art keywords
electroplating process
copper electroplating
copper
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69122910T
Other languages
German (de)
Other versions
DE69122910T2 (en
Inventor
Kenichi Ueno
Kazuhiro Hirao
Genzo Yamane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
De Nora Permelec Ltd
Original Assignee
Permelec Electrode Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Permelec Electrode Ltd filed Critical Permelec Electrode Ltd
Publication of DE69122910D1 publication Critical patent/DE69122910D1/en
Application granted granted Critical
Publication of DE69122910T2 publication Critical patent/DE69122910T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
DE69122910T 1990-06-20 1991-06-12 Copper electroplating process Expired - Fee Related DE69122910T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2162192A JPH0452296A (en) 1990-06-20 1990-06-20 Copper plating method

Publications (2)

Publication Number Publication Date
DE69122910D1 true DE69122910D1 (en) 1996-12-05
DE69122910T2 DE69122910T2 (en) 1997-05-07

Family

ID=15749751

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69122910T Expired - Fee Related DE69122910T2 (en) 1990-06-20 1991-06-12 Copper electroplating process

Country Status (6)

Country Link
US (1) US5143593A (en)
EP (1) EP0462943B1 (en)
JP (1) JPH0452296A (en)
KR (1) KR920000974A (en)
DE (1) DE69122910T2 (en)
MY (1) MY129999A (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08501827A (en) * 1992-09-15 1996-02-27 エイティアール ワイアー アンド ケーブル カンパニー，インコーポレイテッド Copper electroplating method and apparatus
US5908540A (en) * 1997-08-07 1999-06-01 International Business Machines Corporation Copper anode assembly for stabilizing organic additives in electroplating of copper
US6024856A (en) * 1997-10-10 2000-02-15 Enthone-Omi, Inc. Copper metallization of silicon wafers using insoluble anodes
DE19834353C2 (en) 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkaline zinc-nickel bath
JP2000256896A (en) * 1999-03-11 2000-09-19 Ebara Corp Plating device
JP2000256898A (en) * 1999-03-03 2000-09-19 Permelec Electrode Ltd Copper plating method of wafer
TW539652B (en) * 2000-09-04 2003-07-01 Tsurumi Soda Kk Material for copper electroplating, method for manufacturing same and copper electroplating method
CN1469940A (en) * 2000-10-10 2004-01-21 日本利罗纳尔株式会社 Copper electroplating using insoluble anode
US6451375B1 (en) * 2001-01-05 2002-09-17 International Business Machines Corporation Process for depositing a film on a nanometer structure
US6784104B2 (en) * 2001-07-27 2004-08-31 Texas Instruments Incorporated Method for improved cu electroplating in integrated circuit fabrication
JP2005524522A (en) * 2002-05-02 2005-08-18 マイクロリス・コーポレイシヨン Devices and methods for increasing mass transport in a liquid-solid diffusion boundary layer
DE10261493A1 (en) * 2002-12-23 2004-07-08 METAKEM Gesellschaft für Schichtchemie der Metalle mbH Anode for electroplating
US7100954B2 (en) 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
JP2007046092A (en) * 2005-08-09 2007-02-22 Hyomen Shori System:Kk Apparatus and method for plating copper on sheet-shaped workpiece
JP4957906B2 (en) * 2007-07-27 2012-06-20 上村工業株式会社 Continuous electrolytic copper plating method
JP5110269B2 (en) * 2007-08-09 2012-12-26 上村工業株式会社 Electro copper plating method
CN101275252B (en) * 2007-12-26 2011-02-16 梧州三和新材料科技有限公司 Device for continuous plating and use thereof
TWI384925B (en) * 2009-03-17 2013-02-01 Advanced Semiconductor Eng Structure of embedded-trace substrate and method of manufacturing the same
US9068272B2 (en) * 2012-11-30 2015-06-30 Applied Materials, Inc. Electroplating processor with thin membrane support
KR101451483B1 (en) * 2012-12-28 2014-10-15 삼성전기주식회사 Electro Plating Device
CN103388172B (en) * 2013-07-22 2016-06-22 苏州昕皓新材料科技有限公司 A kind of method of quick judgement electroplating additive performance
CN109056002B (en) * 2017-07-19 2022-04-15 叶旖婷 Acid copper electroplating process and device adopting through hole isolation method
CN111074307A (en) * 2020-01-04 2020-04-28 安徽工业大学 Process for stabilizing copper plating solution by diaphragm electrolysis method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769179A (en) * 1972-01-19 1973-10-30 Kewanee Oil Co Copper plating process for printed circuits
IL43733A (en) * 1973-12-03 1976-06-30 Yeda Res & Dev Method of electrodeposition of metals using catalyzed hydrogen
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
JPS6063987A (en) * 1983-09-17 1985-04-12 沖電気工業株式会社 Method of producing printed circuit board
JPH0679922B2 (en) * 1988-09-30 1994-10-12 松下冷機株式会社 Kitchen storage

Also Published As

Publication number Publication date
MY129999A (en) 2007-05-31
KR920000974A (en) 1992-01-29
EP0462943B1 (en) 1996-10-30
DE69122910T2 (en) 1997-05-07
US5143593A (en) 1992-09-01
EP0462943A1 (en) 1991-12-27
JPH0452296A (en) 1992-02-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee