DE69113723D1 - Elektroplattierungsvorrichtung der Horizontaltransportart. - Google Patents

Elektroplattierungsvorrichtung der Horizontaltransportart.

Info

Publication number
DE69113723D1
DE69113723D1 DE69113723T DE69113723T DE69113723D1 DE 69113723 D1 DE69113723 D1 DE 69113723D1 DE 69113723 T DE69113723 T DE 69113723T DE 69113723 T DE69113723 T DE 69113723T DE 69113723 D1 DE69113723 D1 DE 69113723D1
Authority
DE
Germany
Prior art keywords
horizontal transport
electroplating device
transport type
type electroplating
horizontal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69113723T
Other languages
English (en)
Other versions
DE69113723T2 (de
Inventor
Hitoshi Usuda
Ryoei Yamakawa
Kenichi Ueno
Kazuhiro Hirao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Almex Inc
De Nora Permelec Ltd
Original Assignee
Permelec Electrode Ltd
Almex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Permelec Electrode Ltd, Almex Inc filed Critical Permelec Electrode Ltd
Application granted granted Critical
Publication of DE69113723D1 publication Critical patent/DE69113723D1/de
Publication of DE69113723T2 publication Critical patent/DE69113723T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
DE69113723T 1990-08-15 1991-08-15 Elektroplattierungsvorrichtung der Horizontaltransportart. Expired - Fee Related DE69113723T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2215638A JPH086198B2 (ja) 1990-08-15 1990-08-15 水平搬送型メッキ装置

Publications (2)

Publication Number Publication Date
DE69113723D1 true DE69113723D1 (de) 1995-11-16
DE69113723T2 DE69113723T2 (de) 1996-04-04

Family

ID=16675721

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69113723T Expired - Fee Related DE69113723T2 (de) 1990-08-15 1991-08-15 Elektroplattierungsvorrichtung der Horizontaltransportart.

Country Status (4)

Country Link
US (1) US5102521A (de)
EP (1) EP0471577B1 (de)
JP (1) JPH086198B2 (de)
DE (1) DE69113723T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06228791A (ja) * 1992-12-07 1994-08-16 Ebara Yuujiraito Kk 電気めっき装置
US5980711A (en) * 1996-06-10 1999-11-09 Honda Giken Kogyo Kabushiki Kaisha Electrolytic test machine
EP1541720A3 (de) 1998-05-20 2006-05-31 Process Automation International Limited Vorrichtung zur Elektroplattierung
US6261425B1 (en) 1998-08-28 2001-07-17 Process Automation International, Ltd. Electroplating machine
WO2000014308A1 (fr) * 1998-09-08 2000-03-16 Ebara Corporation Dispositif de plaquage de substrats
US6113759A (en) * 1998-12-18 2000-09-05 International Business Machines Corporation Anode design for semiconductor deposition having novel electrical contact assembly
CN1665592A (zh) * 2002-05-02 2005-09-07 密科理股份有限公司 增加液－固扩散边界层处的质量输送的设备和方法
DE10248556B4 (de) * 2002-10-18 2015-07-09 Volkswagen Ag Verfahren zur Behandlung eines Substrats zwecks Korrosionsschutz und Anlage zur Entgasung des dabei verwendeten flüssigen Prozessmediums
DE10261493A1 (de) 2002-12-23 2004-07-08 METAKEM Gesellschaft für Schichtchemie der Metalle mbH Anode zur Galvanisierung
EP1712660A1 (de) 2005-04-12 2006-10-18 Enthone Inc. Unlösliche Anode
DE102005051632B4 (de) 2005-10-28 2009-02-19 Enthone Inc., West Haven Verfahren zum Beizen von nicht leitenden Substratoberflächen und zur Metallisierung von Kunststoffoberflächen
US8177945B2 (en) * 2007-01-26 2012-05-15 International Business Machines Corporation Multi-anode system for uniform plating of alloys
US9005409B2 (en) 2011-04-14 2015-04-14 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US9017528B2 (en) 2011-04-14 2015-04-28 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
JP6129497B2 (ja) * 2011-09-29 2017-05-17 アルメックスＰｅ株式会社 連続メッキ装置
JP5805055B2 (ja) * 2012-11-24 2015-11-04 丸仲工業株式会社 水平搬送式電解メッキ装置
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
JP7016995B1 (ja) * 2021-06-17 2022-02-07 株式会社荏原製作所 めっき装置及びめっき方法
CN115094500B (zh) * 2022-06-16 2024-01-23 昆山沪利微电有限公司 一种水平电镀铜的装置及方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
EP0276725B1 (de) * 1987-01-26 1991-09-04 Siemens Aktiengesellschaft Galvanisierungseinrichtung für plattenförmige Werkstücke, insbesondere Leiterplatten
JPH0679922B2 (ja) * 1988-09-30 1994-10-12 松下冷機株式会社 厨芥収納庫
US4871435A (en) * 1988-10-14 1989-10-03 Charles Denofrio Electroplating apparatus

Also Published As

Publication number Publication date
EP0471577A1 (de) 1992-02-19
EP0471577B1 (de) 1995-10-11
DE69113723T2 (de) 1996-04-04
US5102521A (en) 1992-04-07
JPH0499897A (ja) 1992-03-31
JPH086198B2 (ja) 1996-01-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee