DE69023504D1 - Thermoplastische Klebschicht zur Halbleiterbefestigung. - Google Patents
Thermoplastische Klebschicht zur Halbleiterbefestigung.Info
- Publication number
- DE69023504D1 DE69023504D1 DE69023504T DE69023504T DE69023504D1 DE 69023504 D1 DE69023504 D1 DE 69023504D1 DE 69023504 T DE69023504 T DE 69023504T DE 69023504 T DE69023504 T DE 69023504T DE 69023504 D1 DE69023504 D1 DE 69023504D1
- Authority
- DE
- Germany
- Prior art keywords
- adhesive layer
- thermoplastic adhesive
- semiconductor mounting
- semiconductor
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
- H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/321,472 US4994207A (en) | 1989-03-09 | 1989-03-09 | Thermoplastic film die attach adhesives |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69023504D1 true DE69023504D1 (de) | 1995-12-14 |
DE69023504T2 DE69023504T2 (de) | 1996-04-04 |
Family
ID=23250731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69023504T Expired - Fee Related DE69023504T2 (de) | 1989-03-09 | 1990-11-22 | Thermoplastische Klebschicht zur Halbleiterbefestigung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4994207A (de) |
EP (1) | EP0486724B1 (de) |
DE (1) | DE69023504T2 (de) |
DK (1) | DK0486724T3 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5204399A (en) * | 1989-03-09 | 1993-04-20 | National Starch And Chemical Investment Holding Corporation | Thermoplastic film die attach adhesives |
US4994207A (en) * | 1989-03-09 | 1991-02-19 | National Starch And Chemical Investment Holding Corporation | Thermoplastic film die attach adhesives |
US5043102A (en) * | 1989-11-29 | 1991-08-27 | Advanced Products, Inc. | Conductive adhesive useful for bonding a semiconductor die to a conductive support base |
DE4028556C1 (de) * | 1990-09-08 | 1992-04-02 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
JPH0565456A (ja) * | 1991-09-09 | 1993-03-19 | Sumitomo Bakelite Co Ltd | 気密封止用樹脂ペースト |
US5300627A (en) * | 1991-10-17 | 1994-04-05 | Chisso Corporation | Adhesive polyimide film |
US5406124A (en) * | 1992-12-04 | 1995-04-11 | Mitsui Toatsu Chemicals, Inc. | Insulating adhesive tape, and lead frame and semiconductor device employing the tape |
US6624225B1 (en) | 1996-06-03 | 2003-09-23 | Liburdi Engineering Limited | Wide-gap filler material |
CN1117133C (zh) * | 1999-09-21 | 2003-08-06 | 中国科学院化学研究所 | 一种可溶性聚酰亚胺涂层胶及其制备方法和用途 |
EP1805251A1 (de) * | 2004-10-04 | 2007-07-11 | Solvay Advanced Polymers, L.L.C. | Mit kunststoff überformte gegenstände, verwendung davon und herstellungsverfahren dafür |
US20160059535A1 (en) * | 2014-08-29 | 2016-03-03 | Materion Corporation | Conductive bond foils |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4395527A (en) * | 1978-05-17 | 1983-07-26 | M & T Chemicals Inc. | Siloxane-containing polymers |
US4518735A (en) * | 1981-10-29 | 1985-05-21 | National Semiconductor Corporation | High temperature stable adhesive for semiconductor device packages, low-cost semiconductor device package and process |
US4519941A (en) * | 1983-08-09 | 1985-05-28 | National Starch And Chemical Corporation | Metal-filled polyimide/polyepoxide blends of improved electrical conductivity |
US4557860A (en) * | 1984-07-06 | 1985-12-10 | Stauffer Chemical Company | Solventless, polyimide-modified epoxy composition |
US4604230A (en) * | 1984-10-15 | 1986-08-05 | Stauffer Chemical Company | Thermally stable adhesive |
CA1257038A (en) * | 1984-10-24 | 1989-07-04 | Robert Edelman | Siloxane-containing polymers |
US4652398A (en) * | 1985-09-12 | 1987-03-24 | Stauffer Chemical Company | Rapid curing, thermally stable adhesive composition comprising epoxy resin, polyimide, reactive solvent, and crosslinker |
EP0309190A3 (de) * | 1987-09-22 | 1990-10-17 | National Starch And Chemical Investment Holding Corporation | Polyimid-Überzugszusammensetzungen |
US4994207A (en) * | 1989-03-09 | 1991-02-19 | National Starch And Chemical Investment Holding Corporation | Thermoplastic film die attach adhesives |
-
1989
- 1989-03-09 US US07/321,472 patent/US4994207A/en not_active Expired - Fee Related
-
1990
- 1990-11-22 EP EP90122346A patent/EP0486724B1/de not_active Expired - Lifetime
- 1990-11-22 DE DE69023504T patent/DE69023504T2/de not_active Expired - Fee Related
- 1990-11-22 DK DK90122346.1T patent/DK0486724T3/da active
Also Published As
Publication number | Publication date |
---|---|
DK0486724T3 (da) | 1996-03-11 |
EP0486724A1 (de) | 1992-05-27 |
EP0486724B1 (de) | 1995-11-08 |
US4994207A (en) | 1991-02-19 |
DE69023504T2 (de) | 1996-04-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |