DE69023504D1 - Thermoplastische Klebschicht zur Halbleiterbefestigung. - Google Patents

Thermoplastische Klebschicht zur Halbleiterbefestigung.

Info

Publication number
DE69023504D1
DE69023504D1 DE69023504T DE69023504T DE69023504D1 DE 69023504 D1 DE69023504 D1 DE 69023504D1 DE 69023504 T DE69023504 T DE 69023504T DE 69023504 T DE69023504 T DE 69023504T DE 69023504 D1 DE69023504 D1 DE 69023504D1
Authority
DE
Germany
Prior art keywords
adhesive layer
thermoplastic adhesive
semiconductor mounting
semiconductor
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69023504T
Other languages
English (en)
Other versions
DE69023504T2 (de
Inventor
Robert Edelman
Victor D Papanu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Starch and Chemical Investment Holding Corp
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Publication of DE69023504D1 publication Critical patent/DE69023504D1/de
Application granted granted Critical
Publication of DE69023504T2 publication Critical patent/DE69023504T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE69023504T 1989-03-09 1990-11-22 Thermoplastische Klebschicht zur Halbleiterbefestigung. Expired - Fee Related DE69023504T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/321,472 US4994207A (en) 1989-03-09 1989-03-09 Thermoplastic film die attach adhesives

Publications (2)

Publication Number Publication Date
DE69023504D1 true DE69023504D1 (de) 1995-12-14
DE69023504T2 DE69023504T2 (de) 1996-04-04

Family

ID=23250731

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69023504T Expired - Fee Related DE69023504T2 (de) 1989-03-09 1990-11-22 Thermoplastische Klebschicht zur Halbleiterbefestigung.

Country Status (4)

Country Link
US (1) US4994207A (de)
EP (1) EP0486724B1 (de)
DE (1) DE69023504T2 (de)
DK (1) DK0486724T3 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994207A (en) * 1989-03-09 1991-02-19 National Starch And Chemical Investment Holding Corporation Thermoplastic film die attach adhesives
US5204399A (en) * 1989-03-09 1993-04-20 National Starch And Chemical Investment Holding Corporation Thermoplastic film die attach adhesives
US5043102A (en) * 1989-11-29 1991-08-27 Advanced Products, Inc. Conductive adhesive useful for bonding a semiconductor die to a conductive support base
DE4028556C1 (de) * 1990-09-08 1992-04-02 Robert Bosch Gmbh, 7000 Stuttgart, De
JPH0565456A (ja) * 1991-09-09 1993-03-19 Sumitomo Bakelite Co Ltd 気密封止用樹脂ペースト
US5300627A (en) * 1991-10-17 1994-04-05 Chisso Corporation Adhesive polyimide film
US5406124A (en) * 1992-12-04 1995-04-11 Mitsui Toatsu Chemicals, Inc. Insulating adhesive tape, and lead frame and semiconductor device employing the tape
US6624225B1 (en) * 1996-06-03 2003-09-23 Liburdi Engineering Limited Wide-gap filler material
CN1117133C (zh) * 1999-09-21 2003-08-06 中国科学院化学研究所 一种可溶性聚酰亚胺涂层胶及其制备方法和用途
WO2006037757A1 (en) * 2004-10-04 2006-04-13 Solvay Advanced Polymers, L.L.C. Overmolded plastic articles, uses thereof, method of making
WO2016033522A1 (en) * 2014-08-29 2016-03-03 Materion Corporation Conductive bond foils

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4395527A (en) * 1978-05-17 1983-07-26 M & T Chemicals Inc. Siloxane-containing polymers
US4518735A (en) * 1981-10-29 1985-05-21 National Semiconductor Corporation High temperature stable adhesive for semiconductor device packages, low-cost semiconductor device package and process
US4519941A (en) * 1983-08-09 1985-05-28 National Starch And Chemical Corporation Metal-filled polyimide/polyepoxide blends of improved electrical conductivity
US4557860A (en) * 1984-07-06 1985-12-10 Stauffer Chemical Company Solventless, polyimide-modified epoxy composition
US4604230A (en) * 1984-10-15 1986-08-05 Stauffer Chemical Company Thermally stable adhesive
CA1257038A (en) * 1984-10-24 1989-07-04 Robert Edelman Siloxane-containing polymers
US4652398A (en) * 1985-09-12 1987-03-24 Stauffer Chemical Company Rapid curing, thermally stable adhesive composition comprising epoxy resin, polyimide, reactive solvent, and crosslinker
EP0309190A3 (de) * 1987-09-22 1990-10-17 National Starch And Chemical Investment Holding Corporation Polyimid-Überzugszusammensetzungen
US4994207A (en) * 1989-03-09 1991-02-19 National Starch And Chemical Investment Holding Corporation Thermoplastic film die attach adhesives

Also Published As

Publication number Publication date
EP0486724A1 (de) 1992-05-27
DK0486724T3 (da) 1996-03-11
US4994207A (en) 1991-02-19
EP0486724B1 (de) 1995-11-08
DE69023504T2 (de) 1996-04-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee