DE69021822T2 - Herstellung zum Zusammensetzen von kleineren Abtast- oder Druckeinheiten, so dass eine längere Matrix produziert wird. - Google Patents
Herstellung zum Zusammensetzen von kleineren Abtast- oder Druckeinheiten, so dass eine längere Matrix produziert wird.Info
- Publication number
- DE69021822T2 DE69021822T2 DE69021822T DE69021822T DE69021822T2 DE 69021822 T2 DE69021822 T2 DE 69021822T2 DE 69021822 T DE69021822 T DE 69021822T DE 69021822 T DE69021822 T DE 69021822T DE 69021822 T2 DE69021822 T2 DE 69021822T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- produced
- printing units
- smaller scanning
- longer matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011159 matrix material Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
- H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N2201/00—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof
- H04N2201/024—Indexing scheme relating to scanning, transmission or reproduction of documents or the like, and to details thereof deleted
- H04N2201/02402—Arrangements for positioning heads, e.g. with respect to other elements of the apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Electromagnetism (AREA)
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/421,919 US4976802A (en) | 1989-10-16 | 1989-10-16 | Process for assembling smaller scanning or printing arrays together to form a longer array |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69021822D1 DE69021822D1 (de) | 1995-09-28 |
DE69021822T2 true DE69021822T2 (de) | 1996-05-02 |
Family
ID=23672631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69021822T Expired - Fee Related DE69021822T2 (de) | 1989-10-16 | 1990-10-15 | Herstellung zum Zusammensetzen von kleineren Abtast- oder Druckeinheiten, so dass eine längere Matrix produziert wird. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4976802A (de) |
EP (1) | EP0424062B1 (de) |
JP (1) | JPH07121045B2 (de) |
DE (1) | DE69021822T2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5034083A (en) * | 1989-10-16 | 1991-07-23 | Xerox Corporation | Process and apparatus for assembling smaller scanning or printing arrays together to form an extended array |
JP2772443B2 (ja) * | 1990-06-18 | 1998-07-02 | シャープ株式会社 | 半導体パッケージの封止方法及び封止装置 |
EP0568312A3 (en) * | 1992-04-27 | 1993-12-29 | Seiko Instr Inc | Semiconductor device with driver chip and methods of manufacture |
US5221397A (en) * | 1992-11-02 | 1993-06-22 | Xerox Corporation | Fabrication of reading or writing bar arrays assembled from subunits |
US5272113A (en) * | 1992-11-12 | 1993-12-21 | Xerox Corporation | Method for minimizing stress between semiconductor chips having a coefficient of thermal expansion different from that of a mounting substrate |
US5545913A (en) * | 1994-10-17 | 1996-08-13 | Xerox Corporation | Assembly for mounting semiconductor chips in a full-width-array image scanner |
US6252780B1 (en) | 1998-07-31 | 2001-06-26 | Xerox Corporation | Construction of scanning or imaging arrays suitable for large documents |
US6747259B1 (en) | 2000-10-03 | 2004-06-08 | Xerox Corporation | Assembly of imaging arrays for large format documents |
FR2829290B1 (fr) * | 2001-08-31 | 2004-09-17 | Atmel Grenoble Sa | Capteur d'image couleur sur substrat transparent et procede de fabrication |
JP5960325B1 (ja) * | 2015-06-03 | 2016-08-02 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
US10051199B2 (en) * | 2015-07-22 | 2018-08-14 | Dell Products, Lp | Apparatus and method for precision immobilization of multiple cameras in a multi-camera system |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4321747A (en) * | 1978-05-30 | 1982-03-30 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of manufacturing a solid-state image sensing device |
US4383018A (en) * | 1979-09-04 | 1983-05-10 | Eastman Kodak Company | Color imaging devices having integral color filter arrays |
US4523102A (en) * | 1980-03-17 | 1985-06-11 | Matsushita Electric Industrial Co., Ltd. | Solid-state color-image sensor and process for fabricating the same |
US4388128A (en) * | 1980-03-17 | 1983-06-14 | Matsushita Electric Industrial Co., Ltd. | Solid-state color-image sensor and process for fabricating the same |
US4467342A (en) * | 1982-07-15 | 1984-08-21 | Rca Corporation | Multi-chip imager |
GB2130789B (en) * | 1982-10-20 | 1986-05-14 | Canon Kk | Bonding colour separation filters |
US4735671A (en) * | 1983-01-31 | 1988-04-05 | Xerox Corporation | Method for fabricating full width scanning arrays |
US4698113A (en) * | 1983-08-11 | 1987-10-06 | Matsushita Electric | Method of curing photocurable and heat-curable compositions and a method of adhering members to each other by using them |
US4814296A (en) * | 1987-08-28 | 1989-03-21 | Xerox Corporation | Method of fabricating image sensor dies for use in assembling arrays |
-
1989
- 1989-10-16 US US07/421,919 patent/US4976802A/en not_active Expired - Lifetime
-
1990
- 1990-10-09 JP JP2272049A patent/JPH07121045B2/ja not_active Expired - Fee Related
- 1990-10-15 EP EP90311250A patent/EP0424062B1/de not_active Expired - Lifetime
- 1990-10-15 DE DE69021822T patent/DE69021822T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07121045B2 (ja) | 1995-12-20 |
JPH03167957A (ja) | 1991-07-19 |
US4976802A (en) | 1990-12-11 |
DE69021822D1 (de) | 1995-09-28 |
EP0424062B1 (de) | 1995-08-23 |
EP0424062A2 (de) | 1991-04-24 |
EP0424062A3 (en) | 1991-11-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |