DE69013953T2 - Silikondichtungsmasse mit neutraler Härtung. - Google Patents

Silikondichtungsmasse mit neutraler Härtung.

Info

Publication number
DE69013953T2
DE69013953T2 DE69013953T DE69013953T DE69013953T2 DE 69013953 T2 DE69013953 T2 DE 69013953T2 DE 69013953 T DE69013953 T DE 69013953T DE 69013953 T DE69013953 T DE 69013953T DE 69013953 T2 DE69013953 T2 DE 69013953T2
Authority
DE
Germany
Prior art keywords
silicone sealant
neutral hardening
hardening
neutral
sealant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69013953T
Other languages
English (en)
Other versions
DE69013953D1 (de
Inventor
Hsien-Kun Chu
Russell Peter Kamis
Jerome Melvin Klosowski
Loren Dale Lower
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp filed Critical Dow Corning Corp
Publication of DE69013953D1 publication Critical patent/DE69013953D1/de
Application granted granted Critical
Publication of DE69013953T2 publication Critical patent/DE69013953T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/32—Compounds containing nitrogen bound to oxygen
    • C08K5/33—Oximes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5465—Silicon-containing compounds containing nitrogen containing at least one C=N bond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S528/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S528/901—Room temperature curable silicon-containing polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
DE69013953T 1989-03-22 1990-03-20 Silikondichtungsmasse mit neutraler Härtung. Expired - Fee Related DE69013953T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/327,209 US4956435A (en) 1989-03-22 1989-03-22 Neutral cure silicone sealants

Publications (2)

Publication Number Publication Date
DE69013953D1 DE69013953D1 (de) 1994-12-15
DE69013953T2 true DE69013953T2 (de) 1995-06-08

Family

ID=23275593

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69013953T Expired - Fee Related DE69013953T2 (de) 1989-03-22 1990-03-20 Silikondichtungsmasse mit neutraler Härtung.

Country Status (7)

Country Link
US (1) US4956435A (de)
EP (1) EP0389235B1 (de)
JP (1) JP2859362B2 (de)
KR (1) KR0163048B1 (de)
AU (1) AU632316B2 (de)
CA (1) CA2011363C (de)
DE (1) DE69013953T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3725178B2 (ja) * 1991-03-22 2005-12-07 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
DE69213076T2 (de) * 1991-04-10 1997-01-16 Shinetsu Chemical Co Schimmelbeständige, bei Umgebungstemperatur härtbare Organopolysiloxan-Zusammensetzung
US5492728A (en) * 1994-07-01 1996-02-20 Dow Corning Corporation Method of reducing the bubble formation when curing a room temperature vulcanizable silicone sealant composition with silicon-bonded alkoxy crosslinker on a hot porous surface
EP0798338A3 (de) * 1996-03-26 1998-03-04 Dow Corning Corporation Oximosiliciummodifizierte Silicondichtmassenzusammensetzungen
EP0802222A1 (de) 1996-04-18 1997-10-22 Dow Corning Corporation Verfahren zur Verbesserung der Haftung von Silikonzusammensetzungen
US6437090B1 (en) * 1998-06-17 2002-08-20 Kabushiki Kaisha Toshiba Curing catalyst, resin composition, resin-sealed semiconductor device and coating material
US6265518B1 (en) 1998-12-21 2001-07-24 Dow Corning Corporation Organosilicon endcapper having one silicon-bonded hydrogen atom
US6235832B1 (en) 1998-12-21 2001-05-22 Dow Corning Corporation RTV silicone compositions with rapid development of green strength
US6127502A (en) * 1998-12-21 2000-10-03 Dow Corning Corporation Polyorganosiloxanes having at least one organofunctional group with multiple hydrolyzable groups
US6013753A (en) * 1998-12-21 2000-01-11 Dow Corning Corporation Organosilicon endcapper having one aliphatic unsaturation
US6160150A (en) * 1998-12-21 2000-12-12 Dow Corning Corporation Cyclic organosilicon endcapper having one silicon-bonded hydrogen atom
US6303811B1 (en) 1998-12-21 2001-10-16 Dow Corning Corporation Cyclic organosilicon endcapper having one aliphatic unsaturation
JP3900267B2 (ja) * 2002-05-09 2007-04-04 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP2014509683A (ja) * 2011-03-31 2014-04-21 ダウ コーニング コーポレーション リン酸塩触媒を含有する組成物、並びに、この組成物の調製及び使用方法
EP3233973B1 (de) * 2014-12-19 2019-06-12 Dow Silicones Corporation Verfahren zur herstellung von kondensationsvernetzten partikeln
FR3052457B1 (fr) 2016-06-14 2018-06-22 Bostik Sa Compositions adhesives a base de polymeres silyles reticulables
US10883028B2 (en) 2017-12-26 2021-01-05 Nano And Advanced Materials Institute Limited Room temperature curable polyoranopolysloxane silicone sealant composition, the silicone sealant and method for preparing thereof
FR3079238B1 (fr) * 2018-03-21 2020-05-15 Bostik Sa Composition catalytique pour composition adhesive a base de polymere silyle reticulable

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5695923A (en) * 1979-11-30 1981-08-03 Shin Etsu Chem Co Ltd Cold curing organopolysloxane composition
FR2531095B1 (fr) * 1982-07-30 1987-08-14 Rhone Poulenc Spec Chim Compositions organopolysiloxaniques monocomposantes comportant en tant que reticulants des silanes a groupements acyloxyle ou cetoniminoxyle et catalysees par des derives organiques du titane
US4743474A (en) * 1983-08-05 1988-05-10 Dow Corning Corporation Coating process and moisture-curable organopolysiloxane compositions therefor
DE3345560C2 (de) * 1983-12-16 1986-01-02 Goetze Ag, 5093 Burscheid Imprägniermittelzusammensetzung zum Imprägnieren von vorzugsweise Flachdichtungsmaterial
US4652624A (en) * 1986-03-03 1987-03-24 Dow Corning Corporation Room-temperature-curing silicone sealants
US4772675A (en) * 1986-03-03 1988-09-20 Dow Corning Corporation Methods of improving shelf life of silicone elastomeric sealant

Also Published As

Publication number Publication date
DE69013953D1 (de) 1994-12-15
AU5201190A (en) 1990-09-27
JP2859362B2 (ja) 1999-02-17
US4956435A (en) 1990-09-11
JPH02284984A (ja) 1990-11-22
AU632316B2 (en) 1992-12-24
CA2011363A1 (en) 1990-09-22
KR900014526A (ko) 1990-10-24
EP0389235A3 (de) 1991-10-09
EP0389235A2 (de) 1990-09-26
KR0163048B1 (ko) 1999-01-15
CA2011363C (en) 1999-10-05
EP0389235B1 (de) 1994-11-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee