DE6608558U - FUSION FUSE WITH FUSIBLE SOLDER FOR ELECTRICAL SYSTEM COMPONENTS IN PARTICULAR SEMICONDUCTOR ELEMENTS - Google Patents

FUSION FUSE WITH FUSIBLE SOLDER FOR ELECTRICAL SYSTEM COMPONENTS IN PARTICULAR SEMICONDUCTOR ELEMENTS

Info

Publication number
DE6608558U
DE6608558U DE1968@@6608558U DE6608558U DE6608558U DE 6608558 U DE6608558 U DE 6608558U DE 6608558 U DE6608558 U DE 6608558U DE 6608558 U DE6608558 U DE 6608558U
Authority
DE
Germany
Prior art keywords
system components
electrical system
semiconductor elements
particular semiconductor
fusible solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1968@@6608558U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC AG
Original Assignee
BBC AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC AG filed Critical BBC AG
Publication of DE6608558U publication Critical patent/DE6608558U/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/767—Normally open
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fuses (AREA)
  • Emergency Protection Circuit Devices (AREA)
DE1968@@6608558U 1967-12-04 1968-01-15 FUSION FUSE WITH FUSIBLE SOLDER FOR ELECTRICAL SYSTEM COMPONENTS IN PARTICULAR SEMICONDUCTOR ELEMENTS Expired DE6608558U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1692367A CH466427A (en) 1967-12-04 1967-12-04 Fuses with fusible links for electrical devices, in particular semiconductor elements

Publications (1)

Publication Number Publication Date
DE6608558U true DE6608558U (en) 1971-09-16

Family

ID=4421383

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1968@@6608558U Expired DE6608558U (en) 1967-12-04 1968-01-15 FUSION FUSE WITH FUSIBLE SOLDER FOR ELECTRICAL SYSTEM COMPONENTS IN PARTICULAR SEMICONDUCTOR ELEMENTS
DE19681613968 Pending DE1613968A1 (en) 1967-12-04 1968-01-15 Fuse with fusible link for electrical system parts, especially semiconductor elements

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19681613968 Pending DE1613968A1 (en) 1967-12-04 1968-01-15 Fuse with fusible link for electrical system parts, especially semiconductor elements

Country Status (2)

Country Link
CH (1) CH466427A (en)
DE (2) DE6608558U (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4774558A (en) * 1984-03-05 1988-09-27 Hughes Aircraft Company Thermally-activated, shorting diode switch having non-operationally-alterable junction path
DE3426200C2 (en) * 1984-07-17 1994-02-10 Asea Brown Boveri Bridging element
DE3426199C2 (en) * 1984-07-17 1994-02-03 Asea Brown Boveri Bridging element
US4709253A (en) * 1986-05-02 1987-11-24 Amp Incorporated Surface mountable diode
FR2737605B1 (en) * 1995-08-03 1997-10-03 Europ Agence Spatiale THERMALLY ACTIVE SHORT CIRCUIT SWITCH FOR A BATTERY CELL
US8743525B2 (en) 2012-06-19 2014-06-03 Raycap Intellectual Property, Ltd Overvoltage protection devices including wafer of varistor material
US9906017B2 (en) 2014-06-03 2018-02-27 Ripd Research And Ip Development Ltd. Modular overvoltage protection units
DE102015222939A1 (en) * 2015-11-20 2017-05-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Electrical bridging device for bridging electrical components, in particular an energy source or an energy consumer
US10319545B2 (en) 2016-11-30 2019-06-11 Iskra Za{hacek over (s)}{hacek over (c)}ite d.o.o. Surge protective device modules and DIN rail device systems including same
US10707678B2 (en) 2016-12-23 2020-07-07 Ripd Research And Ip Development Ltd. Overvoltage protection device including multiple varistor wafers
US10447026B2 (en) 2016-12-23 2019-10-15 Ripd Ip Development Ltd Devices for active overvoltage protection
US10340110B2 (en) 2017-05-12 2019-07-02 Raycap IP Development Ltd Surge protective device modules including integral thermal disconnect mechanisms and methods including same
US10685767B2 (en) 2017-09-14 2020-06-16 Raycap IP Development Ltd Surge protective device modules and systems including same
DE102017218906A1 (en) * 2017-10-24 2019-04-25 Robert Bosch Gmbh Electrical bridging element, electrical energy storage and device
US11223200B2 (en) 2018-07-26 2022-01-11 Ripd Ip Development Ltd Surge protective devices, circuits, modules and systems including same
US11862967B2 (en) 2021-09-13 2024-01-02 Raycap, S.A. Surge protective device assembly modules
US11723145B2 (en) 2021-09-20 2023-08-08 Raycap IP Development Ltd PCB-mountable surge protective device modules and SPD circuit systems and methods including same
US11990745B2 (en) 2022-01-12 2024-05-21 Raycap IP Development Ltd Methods and systems for remote monitoring of surge protective devices

Also Published As

Publication number Publication date
DE1613968A1 (en) 1971-06-03
CH466427A (en) 1968-12-15

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