DE60328682D1 - Ltcc-schicht-zusammensetzung - Google Patents

Ltcc-schicht-zusammensetzung

Info

Publication number
DE60328682D1
DE60328682D1 DE60328682T DE60328682T DE60328682D1 DE 60328682 D1 DE60328682 D1 DE 60328682D1 DE 60328682 T DE60328682 T DE 60328682T DE 60328682 T DE60328682 T DE 60328682T DE 60328682 D1 DE60328682 D1 DE 60328682D1
Authority
DE
Germany
Prior art keywords
layer composition
ltcc layer
ltcc
composition
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60328682T
Other languages
English (en)
Inventor
Yong Cho
Joseph Richard Rellick
Kenneth Warren Hang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/336,439 external-priority patent/US6776861B2/en
Priority claimed from US10/430,081 external-priority patent/US6827800B2/en
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE60328682D1 publication Critical patent/DE60328682D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00—Other methods of shaping glass
    • C03B19/06—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Glass Compositions (AREA)
DE60328682T 2002-06-04 2003-06-03 Ltcc-schicht-zusammensetzung Expired - Lifetime DE60328682D1 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38569702P 2002-06-04 2002-06-04
US10/336,439 US6776861B2 (en) 2002-06-04 2003-01-02 Tape composition and process for internally constrained sintering of low temperature co-fired ceramic
US44378503P 2003-01-30 2003-01-30
US10/430,081 US6827800B2 (en) 2003-01-30 2003-05-06 Process for the constrained sintering of asymmetrically configured dielectric layers
PCT/US2003/017255 WO2003101902A1 (en) 2002-06-04 2003-06-03 Ltcc tape composition

Publications (1)

Publication Number Publication Date
DE60328682D1 true DE60328682D1 (de) 2009-09-17

Family

ID=29716284

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60328682T Expired - Lifetime DE60328682D1 (de) 2002-06-04 2003-06-03 Ltcc-schicht-zusammensetzung

Country Status (4)

Country Link
EP (1) EP1509479B1 (de)
AU (1) AU2003273209A1 (de)
DE (1) DE60328682D1 (de)
WO (1) WO2003101902A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5874304B2 (ja) * 2010-11-02 2016-03-02 日本電気硝子株式会社 無アルカリガラス
CN109836141B (zh) * 2019-03-29 2021-07-27 电子科技大学 一种高热导率低温共烧陶瓷材料及其制备方法
CN113979737B (zh) * 2021-10-13 2023-02-03 清华大学深圳国际研究生院 一种低温共烧玻璃陶瓷材料及其制备方法和应用
CN116102340A (zh) * 2023-01-03 2023-05-12 北京航天微电科技有限公司 一种低温共烧生瓷、制备方法及陶瓷基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468428B1 (en) * 1996-02-28 2002-10-22 Hoya Corporation Glass material for carrying a photocatalyst, filter device using the same and light irradiating method
DE10016108C2 (de) * 2000-03-31 2002-09-26 Schott Glas Heißformgebungsverfahren und Vorrichtung zur Herstellung eines Glaskörpers sowie dessen Verwendung
US6630417B2 (en) * 2000-05-30 2003-10-07 Kyocera Corporation Porcelain composition, porcelain and method of producing the same, and wiring board and method of producing the same

Also Published As

Publication number Publication date
EP1509479A1 (de) 2005-03-02
AU2003273209A1 (en) 2003-12-19
WO2003101902A1 (en) 2003-12-11
EP1509479B1 (de) 2009-08-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition