DE60235218D1 - Eingekapseltes elektronisches Bauelement mit elektronischer Leitungsvorrichtung und Herstellungsverfahren - Google Patents

Eingekapseltes elektronisches Bauelement mit elektronischer Leitungsvorrichtung und Herstellungsverfahren

Info

Publication number
DE60235218D1
DE60235218D1 DE60235218T DE60235218T DE60235218D1 DE 60235218 D1 DE60235218 D1 DE 60235218D1 DE 60235218 T DE60235218 T DE 60235218T DE 60235218 T DE60235218 T DE 60235218T DE 60235218 D1 DE60235218 D1 DE 60235218D1
Authority
DE
Germany
Prior art keywords
manufacturing process
electronic
wiring
encapsulated
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60235218T
Other languages
English (en)
Inventor
Didier Floriot
Nicole Caillas
Sylvain Delage
Jean-Claude Jacquet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Application granted granted Critical
Publication of DE60235218D1 publication Critical patent/DE60235218D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73—Bipolar junction transistors
    • H01L29/737—Hetero-junction transistors
    • H01L29/7371—Vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
DE60235218T 2001-07-13 2002-07-05 Eingekapseltes elektronisches Bauelement mit elektronischer Leitungsvorrichtung und Herstellungsverfahren Expired - Lifetime DE60235218D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0109407A FR2827424B1 (fr) 2001-07-13 2001-07-13 Composant electronique encapsule comportant un dispositif electronique de puissance et procede de fabrication

Publications (1)

Publication Number Publication Date
DE60235218D1 true DE60235218D1 (de) 2010-03-18

Family

ID=8865514

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60235218T Expired - Lifetime DE60235218D1 (de) 2001-07-13 2002-07-05 Eingekapseltes elektronisches Bauelement mit elektronischer Leitungsvorrichtung und Herstellungsverfahren

Country Status (3)

Country Link
EP (1) EP1276149B1 (de)
DE (1) DE60235218D1 (de)
FR (1) FR2827424B1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7581585B2 (en) 2004-10-29 2009-09-01 3M Innovative Properties Company Variable position cooling apparatus
FR3069704B1 (fr) 2017-07-27 2019-09-20 Thales Transistor a base metallique et comprenant des materiaux iii-v

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2659494B1 (fr) * 1990-03-09 1996-12-06 Thomson Composants Microondes Composant semiconducteur de puissance, dont la puce est montee a l'envers.
JPH05102262A (ja) * 1991-10-03 1993-04-23 Hitachi Ltd 半導体装置及びそれを実装した実装装置
US6028348A (en) * 1993-11-30 2000-02-22 Texas Instruments Incorporated Low thermal impedance integrated circuit
US5734193A (en) * 1994-01-24 1998-03-31 The United States Of America As Represented By The Secretary Of The Air Force Termal shunt stabilization of multiple part heterojunction bipolar transistors
DE19734509C2 (de) * 1997-08-08 2002-11-07 Infineon Technologies Ag Leistungstransistorzelle
DE19735531A1 (de) * 1997-08-16 1999-02-18 Abb Research Ltd Leistungshalbleitermodul mit in Submodulen integrierten Kühlern
FR2793953B1 (fr) * 1999-05-21 2002-08-09 Thomson Csf Capacite thermique pour composant electronique fonctionnant en impulsions longues

Also Published As

Publication number Publication date
FR2827424A1 (fr) 2003-01-17
EP1276149A2 (de) 2003-01-15
FR2827424B1 (fr) 2005-02-18
EP1276149B1 (de) 2010-01-27
EP1276149A3 (de) 2007-05-30

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