DE60222589D1 - Mit nuten versehene rollen für ein lineares cmp-system - Google Patents
Mit nuten versehene rollen für ein lineares cmp-systemInfo
- Publication number
- DE60222589D1 DE60222589D1 DE60222589T DE60222589T DE60222589D1 DE 60222589 D1 DE60222589 D1 DE 60222589D1 DE 60222589 T DE60222589 T DE 60222589T DE 60222589 T DE60222589 T DE 60222589T DE 60222589 D1 DE60222589 D1 DE 60222589D1
- Authority
- DE
- Germany
- Prior art keywords
- grooved rollers
- cmp system
- linear cmp
- linear
- grooved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/18—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Rolls And Other Rotary Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/040,501 US6620035B2 (en) | 2001-12-28 | 2001-12-28 | Grooved rollers for a linear chemical mechanical planarization system |
PCT/US2002/040941 WO2003057405A1 (en) | 2001-12-28 | 2002-12-20 | Grooved rollers for a linear chemical mechanical planarization system |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60222589D1 true DE60222589D1 (de) | 2007-10-31 |
Family
ID=21911298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60222589T Expired - Lifetime DE60222589D1 (de) | 2001-12-28 | 2002-12-20 | Mit nuten versehene rollen für ein lineares cmp-system |
Country Status (9)
Country | Link |
---|---|
US (1) | US6620035B2 (de) |
EP (1) | EP1469971B1 (de) |
JP (1) | JP2005514215A (de) |
KR (1) | KR20040068357A (de) |
CN (1) | CN1607992A (de) |
AU (1) | AU2002358256A1 (de) |
DE (1) | DE60222589D1 (de) |
TW (1) | TWI223618B (de) |
WO (1) | WO2003057405A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6752898B1 (en) * | 2002-12-20 | 2004-06-22 | Lam Research Corporation | Method and apparatus for an air bearing platen with raised topography |
US20070251832A1 (en) * | 2006-04-27 | 2007-11-01 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical polishing of cu with higher liner velocity for better surface finish and higher removal rate during clearance |
US8148266B2 (en) * | 2009-11-30 | 2012-04-03 | Corning Incorporated | Method and apparatus for conformable polishing |
CN102756323A (zh) * | 2011-04-27 | 2012-10-31 | 中国科学院微电子研究所 | 化学机械抛光设备及化学机械抛光方法 |
US8684791B2 (en) * | 2011-11-09 | 2014-04-01 | Alvin Gabriel Stern | Linear, automated apparatus and method for clean, high purity, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials |
CN103612182A (zh) * | 2013-11-27 | 2014-03-05 | 苏州道众机械制造有限公司 | 平面带式磨床 |
KR20170001652U (ko) | 2015-11-03 | 2017-05-12 | 김기호 | 조명 램프 장치 |
EP3571009A4 (de) | 2017-01-20 | 2021-01-20 | Applied Materials, Inc. | Dünner kunststoffpolierartikel für cmp-anwendungen |
US11213932B2 (en) * | 2017-08-04 | 2022-01-04 | Bly Ip Inc. | Diamond bodies and tools for gripping drill rods |
US11717936B2 (en) | 2018-09-14 | 2023-08-08 | Applied Materials, Inc. | Methods for a web-based CMP system |
CN111941221A (zh) * | 2020-08-12 | 2020-11-17 | 赣州市业润自动化设备有限公司 | 一种带状式化学机械研磨装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR660361A (fr) * | 1927-12-27 | 1929-07-10 | Perfectionnements aux machines à polir, dresser, ébarber | |
US2725691A (en) * | 1953-02-12 | 1955-12-06 | Sommer & Maca Glass Machinery | Platen and support for abrading apparatus |
US3000149A (en) * | 1955-04-11 | 1961-09-19 | Minnesota Mining & Mfg | Contact wheel for abrasive belts |
US3668753A (en) * | 1970-09-14 | 1972-06-13 | Meinan Machinery Works | Contact roller in a sanding device |
US5339570A (en) * | 1992-08-17 | 1994-08-23 | Minnesota Mining And Manufacturing Company | Contact wheel |
-
2001
- 2001-12-28 US US10/040,501 patent/US6620035B2/en not_active Expired - Fee Related
-
2002
- 2002-12-18 TW TW091136603A patent/TWI223618B/zh not_active IP Right Cessation
- 2002-12-20 EP EP02792494A patent/EP1469971B1/de not_active Expired - Lifetime
- 2002-12-20 CN CNA028262328A patent/CN1607992A/zh active Pending
- 2002-12-20 KR KR10-2004-7010162A patent/KR20040068357A/ko not_active Application Discontinuation
- 2002-12-20 AU AU2002358256A patent/AU2002358256A1/en not_active Abandoned
- 2002-12-20 DE DE60222589T patent/DE60222589D1/de not_active Expired - Lifetime
- 2002-12-20 JP JP2003557748A patent/JP2005514215A/ja active Pending
- 2002-12-20 WO PCT/US2002/040941 patent/WO2003057405A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1469971A4 (de) | 2005-01-12 |
US6620035B2 (en) | 2003-09-16 |
US20030139124A1 (en) | 2003-07-24 |
KR20040068357A (ko) | 2004-07-30 |
WO2003057405A1 (en) | 2003-07-17 |
TWI223618B (en) | 2004-11-11 |
EP1469971A2 (de) | 2004-10-27 |
EP1469971B1 (de) | 2007-09-19 |
WO2003057405A8 (en) | 2003-10-30 |
AU2002358256A1 (en) | 2003-07-24 |
JP2005514215A (ja) | 2005-05-19 |
TW200301179A (en) | 2003-07-01 |
CN1607992A (zh) | 2005-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |