DE60210556T8 - Bildaufzeichnungsgerät und Lichtquelleneinheit - Google Patents

Bildaufzeichnungsgerät und Lichtquelleneinheit Download PDF

Info

Publication number
DE60210556T8
DE60210556T8 DE60210556T DE60210556T DE60210556T8 DE 60210556 T8 DE60210556 T8 DE 60210556T8 DE 60210556 T DE60210556 T DE 60210556T DE 60210556 T DE60210556 T DE 60210556T DE 60210556 T8 DE60210556 T8 DE 60210556T8
Authority
DE
Germany
Prior art keywords
light source
source unit
image recorder
recorder
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE60210556T
Other languages
English (en)
Other versions
DE60210556D1 (de
DE60210556T2 (de
Inventor
Masahide Kamikyo-ku Okazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Publication of DE60210556D1 publication Critical patent/DE60210556D1/de
Publication of DE60210556T2 publication Critical patent/DE60210556T2/de
Application granted granted Critical
Publication of DE60210556T8 publication Critical patent/DE60210556T8/de
Active legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Semiconductor Lasers (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Facsimile Heads (AREA)
  • Facsimile Scanning Arrangements (AREA)
DE60210556T 2001-09-20 2002-09-17 Bildaufzeichnungsgerät und Lichtquelleneinheit Active DE60210556T8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001286797A JP2003094716A (ja) 2001-09-20 2001-09-20 画像記録装置および光源ユニット
JP2001286797 2001-09-20

Publications (3)

Publication Number Publication Date
DE60210556D1 DE60210556D1 (de) 2006-05-24
DE60210556T2 DE60210556T2 (de) 2007-04-05
DE60210556T8 true DE60210556T8 (de) 2007-07-12

Family

ID=19109707

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60210556T Active DE60210556T8 (de) 2001-09-20 2002-09-17 Bildaufzeichnungsgerät und Lichtquelleneinheit

Country Status (4)

Country Link
US (1) US6975344B2 (de)
EP (1) EP1296316B1 (de)
JP (1) JP2003094716A (de)
DE (1) DE60210556T8 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7369268B2 (en) * 2003-01-14 2008-05-06 Eastman Kodak Company Light source using large area LEDs
US7436422B2 (en) 2003-09-12 2008-10-14 Dainippon Screen Mfg. Co., Ltd. Light source module, optical unit array and pattern writing apparatus
JP4625279B2 (ja) * 2004-07-09 2011-02-02 株式会社リコー 照明装置、画像読取装置及び画像形成装置
US7502042B2 (en) * 2005-05-20 2009-03-10 Datamax Corporation Laser diode thermal transfer printhead
US20070013765A1 (en) * 2005-07-18 2007-01-18 Eastman Kodak Company Flexible organic laser printer
EP2952250B1 (de) * 2013-01-30 2018-10-31 Kyocera Corporation Lichtstrahlungsvorrichtung und druckvorrichtung
DE102013224420A1 (de) 2013-05-13 2014-11-13 Osram Gmbh Laserbauelement und Verfahren zur seiner Herstellung
JP6613957B2 (ja) * 2016-02-26 2019-12-04 株式会社島津製作所 レーザ装置
US11121526B2 (en) * 2018-05-24 2021-09-14 Panasonic Intellectual Property Management Co., Ltd. Exchangeable laser resonator modules with angular adjustment

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743091A (en) 1986-10-30 1988-05-10 Daniel Gelbart Two dimensional laser diode array
KR910004265B1 (ko) * 1987-03-26 1991-06-25 가부시기가이샤 히다찌세이사꾸쇼 반도체 레이저 장치와 그 제조 방법 및 그것을 사용한 광 헤드
US4928122A (en) * 1988-01-21 1990-05-22 Fuji Photo Film Co., Ltd. Exposure head
JPH05113545A (ja) * 1991-10-21 1993-05-07 Rohm Co Ltd 光源ユニツト，その調整方法及び調整装置
US5617441A (en) * 1991-10-21 1997-04-01 Rohm Co. Ltd. Light source unit and its manufacturing method, adjusting method and adjusting apparatus
JPH05129664A (ja) * 1991-11-05 1993-05-25 Rohm Co Ltd 光源ユニツト及びその調整装置
TW289872B (de) * 1992-12-24 1996-11-01 Sharp Kk
JPH09293917A (ja) * 1996-04-26 1997-11-11 Mitsui Petrochem Ind Ltd 半導体レーザ励起固体レーザ装置
US6034712A (en) * 1996-06-26 2000-03-07 Brother Kogyo Kabushiki Kaisha Exposure apparatus and image forming machine including it
TW346687B (en) * 1997-09-15 1998-12-01 Ind Tech Res Inst Package of semiconductor laser diode and compact disk with two-wavelength read/write head
JPH11208020A (ja) * 1998-01-23 1999-08-03 Canon Inc 露光装置
US6146025A (en) * 1998-08-03 2000-11-14 Litton Systems Inc. Laser diode and substrate
JP4646166B2 (ja) * 2000-11-08 2011-03-09 古河電気工業株式会社 レーザダイオードモジュールからなる光源

Also Published As

Publication number Publication date
EP1296316A1 (de) 2003-03-26
DE60210556D1 (de) 2006-05-24
EP1296316B1 (de) 2006-04-12
US20030052960A1 (en) 2003-03-20
DE60210556T2 (de) 2007-04-05
JP2003094716A (ja) 2003-04-03
US6975344B2 (en) 2005-12-13

Similar Documents

Publication Publication Date Title
DE60326089D1 (de) Beleuchtungsvorrichtung und Bildprojektionsvorrichtung
DE60036259D1 (de) Kleines Lichtquellenmodul und Lichtquelleneinheit
DE602004032021D1 (de) Optisches system und abbildungseinrichtung
DE60236395D1 (de) Flache Lichtquelleneinrichtung
DE60314306D1 (de) Kompaktes Beleuchtungssystem und damit versehene Projektionsanzeigevorrichtung
DE60322005D1 (de) Objektiv und Bilderfassungssystem
DE60209400D1 (de) Beleuchtungs- und Bildaufnahmevorrichtung
DE60130520D1 (de) Lichtquelle
DE60018610D1 (de) Lichtquelle für boroskope und endoskope
DE60303328D1 (de) Ringförmige Lichtquelle
PT2298212E (pt) Fonte de iluminação e de laser
DE60216705D1 (de) Einheit und elektrophotografischer Bilderzeugungsapparat
DE69941379D1 (de) Flache Lichtquelleneinheit
DE60331143D1 (de) Beleuchtungsvorrichtung und photographiervorrichtung und diese beleuchtungsvorrichtung verwendende projektorvorrichtung
DE60123884D1 (de) Fluoreszenzlichtbilddarstellungsmethode und dazugehöriges Gerät
DE60144202D1 (de) Fluorezentlicht Bilddarstellungsverfahren und Gerät dafür
DE60332302D1 (de) Bildlesevorrichtung und Bilderzeugungsgerät
DE60237686D1 (de) Lichtprojektor
DE60225867D1 (de) Abbildendes optisches Gerät
DE60323277D1 (de) Abbildungseinrichtung und Zoom-Linse
DE69922906D1 (de) Beleuchtungseinrichtung und Projektions-Anzeigegerät
DE60315097D1 (de) Projektionsobjektiv und Projektor
DE50113389D1 (de) Lichtquelle
DE60321988D1 (de) Optisches Bilderzeugungssystem und damit versehenes Bildlesegerät
DE60232146D1 (de) Bildanzeigeschirm und bildanzeigeeinheit

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8381 Inventor (new situation)

Inventor name: OKAZAKI, MASAHIDE, KAMIKYO-KU, KYOTO, JP