DE602007007629D1 - Prüfstand zum Prüfen des Kriechstroms durch das Isoliergehäuse von leistungselektronischen Bauteilen und entsprechendes Verfahren - Google Patents

Prüfstand zum Prüfen des Kriechstroms durch das Isoliergehäuse von leistungselektronischen Bauteilen und entsprechendes Verfahren

Info

Publication number
DE602007007629D1
DE602007007629D1 DE602007007629T DE602007007629T DE602007007629D1 DE 602007007629 D1 DE602007007629 D1 DE 602007007629D1 DE 602007007629 T DE602007007629 T DE 602007007629T DE 602007007629 T DE602007007629 T DE 602007007629T DE 602007007629 D1 DE602007007629 D1 DE 602007007629D1
Authority
DE
Germany
Prior art keywords
electronic components
power electronic
testing
insulating housing
test bench
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007007629T
Other languages
English (en)
Inventor
Michel Charpie
Davy Cretenet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ismeca Semiconductor Holding SA
Original Assignee
Ismeca Semiconductor Holding SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding SA filed Critical Ismeca Semiconductor Holding SA
Publication of DE602007007629D1 publication Critical patent/DE602007007629D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • G01R31/1227Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
    • G01R31/1263Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
    • G01R31/129Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation of components or parts made of semiconducting materials; of LV components or parts
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52Testing for short-circuits, leakage current or ground faults
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor
    • G01R31/263Circuits therefor for testing thyristors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2642Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2896Testing of IC packages; Test features related to IC packages

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
DE602007007629T 2007-10-30 2007-10-30 Prüfstand zum Prüfen des Kriechstroms durch das Isoliergehäuse von leistungselektronischen Bauteilen und entsprechendes Verfahren Active DE602007007629D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07119668A EP2056117B1 (de) 2007-10-30 2007-10-30 Prüfstand zum Prüfen des Kriechstroms durch das Isoliergehäuse von leistungselektronischen Bauteilen und entsprechendes Verfahren

Publications (1)

Publication Number Publication Date
DE602007007629D1 true DE602007007629D1 (de) 2010-08-19

Family

ID=39149226

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007007629T Active DE602007007629D1 (de) 2007-10-30 2007-10-30 Prüfstand zum Prüfen des Kriechstroms durch das Isoliergehäuse von leistungselektronischen Bauteilen und entsprechendes Verfahren

Country Status (8)

Country Link
EP (1) EP2056117B1 (de)
CN (1) CN101868732A (de)
AT (1) ATE473451T1 (de)
DE (1) DE602007007629D1 (de)
MA (1) MA31786B1 (de)
MY (1) MY152349A (de)
TW (1) TW200928388A (de)
WO (1) WO2009056610A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011018650B4 (de) 2010-04-22 2015-05-07 Elowerk Gmbh & Co.Kg Verfahren zum Testen eines elektrischen Bauelementes und Verwendung
JP5817361B2 (ja) * 2011-09-08 2015-11-18 富士電機株式会社 半導体素子の特性試験装置およびその装置を用いた半導体素子の特性試験方法
CN103163361B (zh) * 2011-12-13 2015-10-21 英业达股份有限公司 电子元件与检测系统的组合与电子元件的检测方法
KR101979713B1 (ko) * 2012-11-12 2019-05-17 삼성전자 주식회사 반도체 장치의 테스트 방법 및 반도체 테스트 장비
CN104502823A (zh) * 2015-01-04 2015-04-08 无锡罗姆半导体科技有限公司 双台面结构双向可控硅封装的测试方法
KR102228290B1 (ko) * 2017-03-09 2021-03-17 이스메카 세미컨덕터 홀딩 에스.아. 전기부품을 테스트하기 위한 테스트 어셈블리 및 방법
CN109116208A (zh) * 2018-06-28 2019-01-01 武汉钢铁有限公司 一种电力模块的快速检测装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6073375A (ja) * 1983-09-30 1985-04-25 Oki Electric Ind Co Ltd 半導体装置の試験方法
US4806857A (en) * 1986-04-11 1989-02-21 Oki Electric Industry Co., Ltd. Apparatus for testing semiconductor devices
JPH0769385B2 (ja) * 1986-05-09 1995-07-31 沖電気工業株式会社 半導体装置の試験方法及びその装置

Also Published As

Publication number Publication date
CN101868732A (zh) 2010-10-20
EP2056117A1 (de) 2009-05-06
MY152349A (en) 2014-09-15
MA31786B1 (fr) 2010-10-01
ATE473451T1 (de) 2010-07-15
TW200928388A (en) 2009-07-01
EP2056117B1 (de) 2010-07-07
WO2009056610A1 (en) 2009-05-07

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