DE602006000249D1 - Device and method for determining the position accuracy - Google Patents

Device and method for determining the position accuracy

Info

Publication number
DE602006000249D1
DE602006000249D1 DE602006000249T DE602006000249T DE602006000249D1 DE 602006000249 D1 DE602006000249 D1 DE 602006000249D1 DE 602006000249 T DE602006000249 T DE 602006000249T DE 602006000249 T DE602006000249 T DE 602006000249T DE 602006000249 D1 DE602006000249 D1 DE 602006000249D1
Authority
DE
Germany
Prior art keywords
determining
position accuracy
accuracy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006000249T
Other languages
German (de)
Other versions
DE602006000249T2 (en
Inventor
Yutaka Unno
Taiji Kiku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of DE602006000249D1 publication Critical patent/DE602006000249D1/en
Application granted granted Critical
Publication of DE602006000249T2 publication Critical patent/DE602006000249T2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
DE602006000249T 2005-03-17 2006-03-17 Device and method for determining the position accuracy Active DE602006000249T2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005077929 2005-03-17
JP2005077929A JP4728021B2 (en) 2005-03-17 2005-03-17 Heat uniformity evaluation method and heat uniformity evaluation apparatus

Publications (2)

Publication Number Publication Date
DE602006000249D1 true DE602006000249D1 (en) 2008-01-03
DE602006000249T2 DE602006000249T2 (en) 2008-10-02

Family

ID=36645689

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006000249T Active DE602006000249T2 (en) 2005-03-17 2006-03-17 Device and method for determining the position accuracy

Country Status (6)

Country Link
US (1) US7948516B2 (en)
EP (1) EP1703777B1 (en)
JP (1) JP4728021B2 (en)
KR (1) KR100733444B1 (en)
DE (1) DE602006000249T2 (en)
TW (1) TWI315161B (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6267404A (en) * 1985-09-20 1987-03-27 Seiko Epson Corp Optical out-of-roundness measuring apparatus
JPH0510718A (en) * 1991-07-05 1993-01-19 Nippon Densan Corp Concentricity degree measuring apparatus
JP2001091244A (en) * 1999-09-24 2001-04-06 Tokyo Seimitsu Co Ltd Roundness measuring method and device
WO2002007195A1 (en) * 2000-07-19 2002-01-24 Ibiden Co., Ltd. Semiconductor manufacturing/testing ceramic heater, production method for the ceramic heater and production system for the ceramic heater
JP2002054917A (en) * 2000-08-08 2002-02-20 M H Center:Kk Concentricity measuring method in concentricity measuring device
KR100431655B1 (en) * 2001-08-28 2004-05-17 삼성전자주식회사 Heater assembly for heating a wafer
JP3754340B2 (en) * 2001-10-15 2006-03-08 株式会社デンソーウェーブ Position detection device
JP3833974B2 (en) * 2002-08-21 2006-10-18 日本碍子株式会社 Manufacturing method of heating device
DE10307246A1 (en) * 2003-02-17 2004-08-26 E.G.O. Elektrogerätebau GmbH Heating device with two areas
JP2004328096A (en) * 2003-04-22 2004-11-18 Sony Corp Image processing apparatus and method, recording medium, and program
US7025893B2 (en) * 2003-08-12 2006-04-11 Thermo Stone Usa, Llc Structure and method to compensate for thermal edge loss in thin film heaters

Also Published As

Publication number Publication date
EP1703777B1 (en) 2007-11-21
TW200644707A (en) 2006-12-16
US20060207987A1 (en) 2006-09-21
EP1703777A1 (en) 2006-09-20
TWI315161B (en) 2009-09-21
JP2006258665A (en) 2006-09-28
KR100733444B1 (en) 2007-06-29
KR20060101260A (en) 2006-09-22
JP4728021B2 (en) 2011-07-20
US7948516B2 (en) 2011-05-24
DE602006000249T2 (en) 2008-10-02

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: KIKU, TAIJI, MIZUHO-KU NAGOYA CITY AICHI-KEN 4, JP

Inventor name: UNNO, YUTAKA, MIZUHO-KU NAGOYA CITY AICHI-KEN , JP

8364 No opposition during term of opposition