DE602005019930D1 - Addition for plating bath - Google Patents

Addition for plating bath

Info

Publication number
DE602005019930D1
DE602005019930D1 DE602005019930T DE602005019930T DE602005019930D1 DE 602005019930 D1 DE602005019930 D1 DE 602005019930D1 DE 602005019930 T DE602005019930 T DE 602005019930T DE 602005019930 T DE602005019930 T DE 602005019930T DE 602005019930 D1 DE602005019930 D1 DE 602005019930D1
Authority
DE
Germany
Prior art keywords
addition
plating bath
plating
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005019930T
Other languages
German (de)
Inventor
Hiromitsu Kobayashi
Hirohisa Nito
Hiromasa Kawamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of DE602005019930D1 publication Critical patent/DE602005019930D1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
DE602005019930T 2004-01-16 2005-01-14 Addition for plating bath Active DE602005019930D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004009284A JP2005200714A (en) 2004-01-16 2004-01-16 Additive for plating bath

Publications (1)

Publication Number Publication Date
DE602005019930D1 true DE602005019930D1 (en) 2010-04-29

Family

ID=34616913

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005019930T Active DE602005019930D1 (en) 2004-01-16 2005-01-14 Addition for plating bath

Country Status (7)

Country Link
US (1) US20050155514A1 (en)
EP (1) EP1555335B1 (en)
JP (1) JP2005200714A (en)
KR (1) KR20050075692A (en)
CN (1) CN1670259A (en)
DE (1) DE602005019930D1 (en)
TW (1) TW200536955A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4858907B2 (en) * 2006-05-29 2012-01-18 奥野製薬工業株式会社 Activation composition for pretreatment of displacement deposition type gold plating
JP5120533B2 (en) * 2007-02-28 2013-01-16 栗田工業株式会社 Cation removal device for plating solution additive and method for treating plating solution additive
WO2010055917A1 (en) * 2008-11-14 2010-05-20 ユケン工業株式会社 Acidic zinc plating bath

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4132610A (en) * 1976-05-18 1979-01-02 Hyogo Prefectural Government Method of bright electroplating of tin-lead alloy
US4696773A (en) * 1986-07-07 1987-09-29 Johnson & Johnson Baby Products Company Process for the preparation of isethionic acid
US4987250A (en) * 1987-09-25 1991-01-22 Union Oil Company Of California Synthesis of hydroxy sulfonic acids
JP3981430B2 (en) * 1997-01-20 2007-09-26 株式会社Ａｄｅｋａ Process for producing pure alkanesulfonic acid
US6251253B1 (en) * 1999-03-19 2001-06-26 Technic, Inc. Metal alloy sulfate electroplating baths

Also Published As

Publication number Publication date
TW200536955A (en) 2005-11-16
EP1555335B1 (en) 2010-03-17
CN1670259A (en) 2005-09-21
EP1555335A3 (en) 2007-06-20
EP1555335A2 (en) 2005-07-20
US20050155514A1 (en) 2005-07-21
JP2005200714A (en) 2005-07-28
KR20050075692A (en) 2005-07-21

Similar Documents

Publication Publication Date Title
DE602005022650D1 (en) Improved plating process
ATE424904T1 (en) KIT FOR COMPLEX CONSTRUCTIONS
DE602006017421D1 (en) SCREENING PROCEDURE FOR KOKUMI-INTERMEDIATE AGENTS
DE602006015776D1 (en) JET-solder bath
DE602005027248D1 (en) FINGERHOOK STRUCTURE FOR SCISSORS
DE502005005002D1 (en) Post for guide
DE602005008175D1 (en) Metal ring for metal straps
DE112005001372T5 (en) plating
DE502005010620D1 (en) Upper belt cross-section for Kranteleskopteile
DE602005019930D1 (en) Addition for plating bath
GB0518509D0 (en) Bath fixing extrusion
DE112005001782A5 (en) Connection part for prostheses
DE602005002003D1 (en) Holding eye for screws
DE502004008685D1 (en) FADENFÜHRERVORRICHTUNG FOR RINGSPINDEL
DE602005001522D1 (en) Electrodeposition paint
DE602004031650D1 (en) DREHBUND FOR HUBSÄGE
GB0408345D0 (en) Bath n easy
DE602005025674D1 (en) INHIBITOR FOR DARMPOLYPES
ATE439475T1 (en) INTERMEDIATE PIECE FOR CONDUITS
UA13738S (en) BATH
DE602006003106D1 (en) Revolving structure for spectacle part
DE602005022555D1 (en) LANDEKLAPPENFÜHRUNG FOR PLANE
UA15712S (en) BATH
UA14461S (en) BATH
UA14460S (en) BATH

Legal Events

Date Code Title Description
8364 No opposition during term of opposition