DE602005015344D1 - Silber-mikroband-zusammensetzung und herstellungsverfahren - Google Patents

Silber-mikroband-zusammensetzung und herstellungsverfahren

Info

Publication number
DE602005015344D1
DE602005015344D1 DE602005015344T DE602005015344T DE602005015344D1 DE 602005015344 D1 DE602005015344 D1 DE 602005015344D1 DE 602005015344 T DE602005015344 T DE 602005015344T DE 602005015344 T DE602005015344 T DE 602005015344T DE 602005015344 D1 DE602005015344 D1 DE 602005015344D1
Authority
DE
Germany
Prior art keywords
microband
silver
manufacturing
composition
silver microband
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005015344T
Other languages
English (en)
Inventor
Yun Chea Chang
Eric Richard Schmittou
Peter Jerome Cowdery-Corvan
Seshadri Jagannathan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of DE602005015344D1 publication Critical patent/DE602005015344D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B11/00—Obtaining noble metals
    • C22B11/04—Obtaining noble metals by wet processes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/15—Nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2303/00—Functional details of metal or compound in the powder or product
    • B22F2303/01—Main component
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2303/00—Functional details of metal or compound in the powder or product
    • B22F2303/05—Compulsory alloy component
DE602005015344T 2004-09-29 2005-09-29 Silber-mikroband-zusammensetzung und herstellungsverfahren Active DE602005015344D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/953,409 US20060068025A1 (en) 2004-09-29 2004-09-29 Silver microribbon composition and method of making
PCT/US2005/034955 WO2006039380A2 (en) 2004-09-29 2005-09-29 Silver microribbon composition and method of production

Publications (1)

Publication Number Publication Date
DE602005015344D1 true DE602005015344D1 (de) 2009-08-20

Family

ID=35985179

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005015344T Active DE602005015344D1 (de) 2004-09-29 2005-09-29 Silber-mikroband-zusammensetzung und herstellungsverfahren

Country Status (5)

Country Link
US (1) US20060068025A1 (de)
EP (1) EP1794763B1 (de)
DE (1) DE602005015344D1 (de)
TW (1) TW200619826A (de)
WO (1) WO2006039380A2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102103541B1 (ko) * 2005-08-12 2020-04-23 캄브리오스 필름 솔루션스 코포레이션 나노와이어 기반의 투명 도전체
AU2008260162B2 (en) 2007-05-29 2013-06-20 Tpk Holding Co., Ltd. Surfaces having particles and related methods
US7642463B2 (en) 2008-01-28 2010-01-05 Honeywell International Inc. Transparent conductors and methods for fabricating transparent conductors
US7960027B2 (en) * 2008-01-28 2011-06-14 Honeywell International Inc. Transparent conductors and methods for fabricating transparent conductors
JP2012500865A (ja) 2008-08-21 2012-01-12 イノーバ ダイナミクス インコーポレイテッド 増強された表面、コーティング、および関連方法
US8029700B2 (en) * 2009-04-30 2011-10-04 Chung-Shan Institute of Science and Technology Armaments Bureau, Ministry of National Defense Compound of silver nanowire with polymer and compound of metal nanostructure with polymer
TWI398271B (zh) * 2009-07-16 2013-06-11 Ind Tech Res Inst 長效性抗微生物之奈米線組合物及其形成之抗微生物薄膜及噴霧劑
WO2011038309A1 (en) * 2009-09-26 2011-03-31 Ferro Corporation Silver ribbons, methods of their making and applications thereof
EP2539904A4 (de) * 2010-02-27 2018-01-10 Innova Dynamics, Inc. Strukturen mit in den oberflächen eingebetteten zusatzstoffen und herstellungsverfahren dafür
US8749009B2 (en) 2010-08-07 2014-06-10 Innova Dynamics, Inc. Device components with surface-embedded additives and related manufacturing methods
US9327348B2 (en) * 2010-11-22 2016-05-03 Junping Zhang Nanowire preparation methods, compositions, and articles
US8613888B2 (en) 2010-11-23 2013-12-24 Carestream Health, Inc. Nanowire preparation methods, compositions, and articles
TWI476160B (zh) 2011-12-19 2015-03-11 Ind Tech Res Inst 奈米銀線之製備方法
CN104797363B (zh) 2012-09-27 2018-09-07 罗地亚经营管理公司 制造银纳米结构的方法和可用于此方法的共聚物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3231217A (en) * 1963-02-14 1966-01-25 Steel Heddle Mfg Co Narrow metallic ribbon package
US3664837A (en) * 1970-01-16 1972-05-23 Trw Inc Production of a line pattern on a glass plate
US5858637A (en) * 1997-06-27 1999-01-12 Eastman Kodak Company Process of preparing a photothermographic composition of enhanced photosensitivity
US6277740B1 (en) * 1998-08-14 2001-08-21 Avery N. Goldstein Integrated circuit trenched features and method of producing same

Also Published As

Publication number Publication date
WO2006039380A2 (en) 2006-04-13
TW200619826A (en) 2006-06-16
EP1794763A2 (de) 2007-06-13
WO2006039380A8 (en) 2007-12-06
WO2006039380A3 (en) 2007-08-23
EP1794763B1 (de) 2009-07-08
US20060068025A1 (en) 2006-03-30

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