DE602005010830D1 - Verfahren und vorrichtungen zum verringern von übersprechen in elektrischen verbindern - Google Patents
Verfahren und vorrichtungen zum verringern von übersprechen in elektrischen verbindernInfo
- Publication number
- DE602005010830D1 DE602005010830D1 DE602005010830T DE602005010830T DE602005010830D1 DE 602005010830 D1 DE602005010830 D1 DE 602005010830D1 DE 602005010830 T DE602005010830 T DE 602005010830T DE 602005010830 T DE602005010830 T DE 602005010830T DE 602005010830 D1 DE602005010830 D1 DE 602005010830D1
- Authority
- DE
- Germany
- Prior art keywords
- jack
- contacts
- plug
- devices
- electrical connectors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
- H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/941—Crosstalk suppression
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US54405004P | 2004-02-12 | 2004-02-12 | |
US55801904P | 2004-03-31 | 2004-03-31 | |
US55987604P | 2004-04-06 | 2004-04-06 | |
US11/055,344 US7179131B2 (en) | 2004-02-12 | 2005-02-10 | Methods and apparatus for reducing crosstalk in electrical connectors |
PCT/US2005/004705 WO2005081369A1 (en) | 2004-02-12 | 2005-02-11 | Methods and apparatus for reducing crosstalk in electrical connectors |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005010830D1 true DE602005010830D1 (de) | 2008-12-18 |
Family
ID=34841891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005010830T Active DE602005010830D1 (de) | 2004-02-12 | 2005-02-11 | Verfahren und vorrichtungen zum verringern von übersprechen in elektrischen verbindern |
Country Status (7)
Country | Link |
---|---|
US (7) | US7179131B2 (de) |
EP (3) | EP2073320A3 (de) |
JP (1) | JP4828434B2 (de) |
CN (1) | CN101107753B (de) |
AT (1) | ATE413706T1 (de) |
DE (1) | DE602005010830D1 (de) |
WO (1) | WO2005081369A1 (de) |
Families Citing this family (87)
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US7265300B2 (en) | 2003-03-21 | 2007-09-04 | Commscope Solutions Properties, Llc | Next high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes |
US7182649B2 (en) | 2003-12-22 | 2007-02-27 | Panduit Corp. | Inductive and capacitive coupling balancing electrical connector |
US7179131B2 (en) * | 2004-02-12 | 2007-02-20 | Panduit Corp. | Methods and apparatus for reducing crosstalk in electrical connectors |
CN102082367B (zh) | 2004-03-12 | 2013-11-20 | 泛达公司 | 减小电连接器中串扰的方法及装置 |
US7153168B2 (en) * | 2004-04-06 | 2006-12-26 | Panduit Corp. | Electrical connector with improved crosstalk compensation |
US7190594B2 (en) | 2004-05-14 | 2007-03-13 | Commscope Solutions Properties, Llc | Next high frequency improvement by using frequency dependent effective capacitance |
US7980900B2 (en) * | 2004-05-14 | 2011-07-19 | Commscope, Inc. Of North Carolina | Next high frequency improvement by using frequency dependent effective capacitance |
WO2006017332A1 (en) | 2004-07-13 | 2006-02-16 | Panduit Corp. | Communications connector with flexible printed circuit board |
US7175476B2 (en) * | 2005-01-11 | 2007-02-13 | Daeun Electronics Co., Ltd. | Crosstalk canceling pattern for high-speed communications and modular jack having the same |
US7285025B2 (en) * | 2005-07-14 | 2007-10-23 | Tyco Electronics Corporation | Enhanced jack with plug engaging printed circuit board |
US7455538B2 (en) * | 2005-08-31 | 2008-11-25 | Leviton Manufacturing Co., Inc. | Electrical wiring devices with a protective shutter |
US7335066B2 (en) * | 2005-12-16 | 2008-02-26 | James A. Carroll | Network connector and connection system |
WO2007095533A1 (en) * | 2006-02-13 | 2007-08-23 | Panduit Corp. | Connector with crosstalk compensation |
US7381098B2 (en) * | 2006-04-11 | 2008-06-03 | Adc Telecommunications, Inc. | Telecommunications jack with crosstalk multi-zone crosstalk compensation and method for designing |
US7591686B2 (en) | 2006-04-18 | 2009-09-22 | Commscope, Inc. Of North Carolina | Communications connectors with jackwire contacts and printed circuit boards |
US7479043B2 (en) * | 2006-05-08 | 2009-01-20 | The Siemon Company | Targeted compensation in telecommunications connectors |
US7686650B2 (en) * | 2006-05-17 | 2010-03-30 | Bel Fuse Ltd. | High speed modular jack with flexible compensation circuit |
EP2082458B1 (de) | 2006-10-13 | 2015-06-03 | Tyco Electronics Services GmbH | Verbindungshardware mit mehrstufigem induktivem und kapazitivem übersprechungsausgleich |
DE102006056001B4 (de) * | 2006-11-24 | 2008-12-04 | Phoenix Contact Gmbh & Co. Kg | Konfektionierbarer Rundsteckverbinder für Ethernet |
CN101584089B (zh) | 2006-12-13 | 2012-06-13 | 泛达公司 | 具有分层的插头接口触头的通信插座 |
US7874878B2 (en) * | 2007-03-20 | 2011-01-25 | Panduit Corp. | Plug/jack system having PCB with lattice network |
US7427218B1 (en) * | 2007-05-23 | 2008-09-23 | Commscope, Inc. Of North Carolina | Communications connectors with staggered contacts that connect to a printed circuit board via contact pads |
CN201112941Y (zh) * | 2007-06-11 | 2008-09-10 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
US7481678B2 (en) * | 2007-06-14 | 2009-01-27 | Ortronics, Inc. | Modular insert and jack including bi-sectional lead frames |
US7967645B2 (en) * | 2007-09-19 | 2011-06-28 | Leviton Manufacturing Co., Inc. | High speed data communications connector circuits, systems, and methods for reducing crosstalk in communications systems |
US7736195B1 (en) * | 2009-03-10 | 2010-06-15 | Leviton Manufacturing Co., Inc. | Circuits, systems and methods for implementing high speed data communications connectors that provide for reduced modal alien crosstalk in communications systems |
KR20100074141A (ko) * | 2007-09-19 | 2010-07-01 | 레비톤 메뉴팩튜어링 캄파니 인코포레이티드 | 통신 콘센트 내에 위치된 플렉서블 인쇄회로보드 상에 형성되는 내부 누화 보상 회로와 이에 관련된 방법 및 시스템 |
US7841909B2 (en) | 2008-02-12 | 2010-11-30 | Adc Gmbh | Multistage capacitive far end crosstalk compensation arrangement |
US7976348B2 (en) * | 2008-05-07 | 2011-07-12 | Ortronics, Inc. | Modular insert and jack including moveable reactance section |
US7601034B1 (en) * | 2008-05-07 | 2009-10-13 | Ortronics, Inc. | Modular insert and jack including moveable reactance section |
US7914345B2 (en) * | 2008-08-13 | 2011-03-29 | Tyco Electronics Corporation | Electrical connector with improved compensation |
BRPI0917950A2 (pt) * | 2008-08-13 | 2015-11-17 | Panduit Corp | jaque de comunicação para uso em rede de comunicação |
EP2329566B1 (de) * | 2008-08-20 | 2018-08-01 | Panduit Corp. | Hochgeschwindigkeitsverbinder mit mehrstufiger kompensation |
US7794286B2 (en) * | 2008-12-12 | 2010-09-14 | Hubbell Incorporated | Electrical connector with separate contact mounting and compensation boards |
US7708603B1 (en) * | 2009-01-12 | 2010-05-04 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector with improved crosstalk features |
US8357013B2 (en) * | 2009-01-22 | 2013-01-22 | Hirose Electric Co., Ltd. | Reducing far-end crosstalk in electrical connectors |
US8047879B2 (en) * | 2009-01-26 | 2011-11-01 | Commscope, Inc. Of North Carolina | Printed wiring boards and communication connectors having series inductor-capacitor crosstalk compensation circuits that share a common inductor |
KR101135491B1 (ko) * | 2009-02-13 | 2012-04-13 | 삼성에스디아이 주식회사 | 리튬 이차 전지용 양극 및 이를 포함하는 리튬 이차 전지 |
US7896672B2 (en) * | 2009-07-28 | 2011-03-01 | Tyco Electronics Corporation | EMI suppression for electrical connector |
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-
2005
- 2005-02-10 US US11/055,344 patent/US7179131B2/en active Active
- 2005-02-11 AT AT05713549T patent/ATE413706T1/de not_active IP Right Cessation
- 2005-02-11 EP EP08016738A patent/EP2073320A3/de not_active Withdrawn
- 2005-02-11 CN CN2005800049464A patent/CN101107753B/zh not_active Expired - Fee Related
- 2005-02-11 JP JP2006553333A patent/JP4828434B2/ja not_active Expired - Fee Related
- 2005-02-11 DE DE602005010830T patent/DE602005010830D1/de active Active
- 2005-02-11 WO PCT/US2005/004705 patent/WO2005081369A1/en active Application Filing
- 2005-02-11 EP EP10180151A patent/EP2337165A2/de not_active Withdrawn
- 2005-02-11 EP EP05713549A patent/EP1719215B1/de not_active Not-in-force
-
2007
- 2007-01-16 US US11/623,578 patent/US7452246B2/en active Active
-
2008
- 2008-11-17 US US12/272,127 patent/US7874879B2/en not_active Expired - Fee Related
-
2010
- 2010-12-16 US US12/969,779 patent/US8262415B2/en active Active
-
2012
- 2012-09-07 US US13/606,420 patent/US8550850B2/en not_active Expired - Fee Related
-
2013
- 2013-10-07 US US14/047,629 patent/US8834207B2/en not_active Expired - Fee Related
-
2014
- 2014-09-15 US US14/486,273 patent/US9531128B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ATE413706T1 (de) | 2008-11-15 |
CN101107753B (zh) | 2010-05-26 |
US8550850B2 (en) | 2013-10-08 |
US7179131B2 (en) | 2007-02-20 |
US9531128B2 (en) | 2016-12-27 |
US8834207B2 (en) | 2014-09-16 |
EP2073320A2 (de) | 2009-06-24 |
US20090075523A1 (en) | 2009-03-19 |
WO2005081369A1 (en) | 2005-09-01 |
US20070117469A1 (en) | 2007-05-24 |
US20110086549A1 (en) | 2011-04-14 |
JP2007524207A (ja) | 2007-08-23 |
EP2337165A2 (de) | 2011-06-22 |
EP1719215B1 (de) | 2008-11-05 |
US7874879B2 (en) | 2011-01-25 |
US20140038461A1 (en) | 2014-02-06 |
CN101107753A (zh) | 2008-01-16 |
US7452246B2 (en) | 2008-11-18 |
US20050181676A1 (en) | 2005-08-18 |
JP4828434B2 (ja) | 2011-11-30 |
EP1719215A1 (de) | 2006-11-08 |
US8262415B2 (en) | 2012-09-11 |
US20150004849A1 (en) | 2015-01-01 |
EP2073320A3 (de) | 2009-11-25 |
US20120329326A1 (en) | 2012-12-27 |
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