DE602005007173D1 - Rahmen für eine Vorrichtung, die über einer Leiterplatte in einem elektronischen Gerät montiert ist - Google Patents

Rahmen für eine Vorrichtung, die über einer Leiterplatte in einem elektronischen Gerät montiert ist

Info

Publication number
DE602005007173D1
DE602005007173D1 DE602005007173T DE602005007173T DE602005007173D1 DE 602005007173 D1 DE602005007173 D1 DE 602005007173D1 DE 602005007173 T DE602005007173 T DE 602005007173T DE 602005007173 T DE602005007173 T DE 602005007173T DE 602005007173 D1 DE602005007173 D1 DE 602005007173D1
Authority
DE
Germany
Prior art keywords
frame
circuit board
printed circuit
pcb
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005007173T
Other languages
English (en)
Inventor
Chao Chen
Jason Griffin
Tim Kyowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BlackBerry Ltd
Original Assignee
Research in Motion Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research in Motion Ltd filed Critical Research in Motion Ltd
Publication of DE602005007173D1 publication Critical patent/DE602005007173D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Telephone Set Structure (AREA)
  • Facsimiles In General (AREA)
DE602005007173T 2005-02-11 2005-02-11 Rahmen für eine Vorrichtung, die über einer Leiterplatte in einem elektronischen Gerät montiert ist Active DE602005007173D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05101043A EP1691593B1 (de) 2005-02-11 2005-02-11 Rahmen für eine Vorrichtung, die über einer Leiterplatte in einem elektronischen Gerät montiert ist

Publications (1)

Publication Number Publication Date
DE602005007173D1 true DE602005007173D1 (de) 2008-07-10

Family

ID=34938721

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005007173T Active DE602005007173D1 (de) 2005-02-11 2005-02-11 Rahmen für eine Vorrichtung, die über einer Leiterplatte in einem elektronischen Gerät montiert ist

Country Status (8)

Country Link
EP (1) EP1691593B1 (de)
CN (1) CN1819753B (de)
AT (1) ATE397373T1 (de)
CA (2) CA2779468C (de)
DE (1) DE602005007173D1 (de)
HK (1) HK1094129A1 (de)
IN (1) IN2015DE00285A (de)
SG (1) SG125183A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110261001A1 (en) * 2010-04-23 2011-10-27 Jin Liu Apparatus and method for impact resistant touchscreen display module
US9081428B2 (en) 2010-04-23 2015-07-14 Psion Inc. Apparatus and method for impact resistant touchscreen display module
CN202019374U (zh) * 2010-10-13 2011-10-26 中兴通讯股份有限公司 一种手机中用于断板结构主板的支撑板
US9411385B2 (en) * 2013-05-13 2016-08-09 Google Technology Holdings LLC Electronic device assembly with compression gasket
CN103326190B (zh) * 2013-06-03 2016-03-02 华为终端有限公司 射频同轴连接器的屏蔽结构及具有该屏蔽结构的机顶盒

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3594500B2 (ja) * 1998-11-12 2004-12-02 松下電器産業株式会社 液晶表示器取付接続装置
US6304458B1 (en) * 1999-09-22 2001-10-16 Ericsson Inc RF shielded LCD assembly and PCB assembly including the same
CN2523172Y (zh) * 2001-12-21 2002-11-27 雷特国际股份有限公司 电子产品的机壳装置
TW591999B (en) * 2002-09-23 2004-06-11 High Tech Comp Corp Assembly process and structure for a personal digital assistant
DE10250907A1 (de) * 2002-10-31 2004-06-03 Siemens Ag Leiterplatte für Mobiltelefone

Also Published As

Publication number Publication date
EP1691593A1 (de) 2006-08-16
EP1691593B1 (de) 2008-05-28
CA2779468A1 (en) 2006-08-11
ATE397373T1 (de) 2008-06-15
CA2779468C (en) 2017-01-24
CA2535186A1 (en) 2006-08-11
IN2015DE00285A (de) 2015-07-24
CN1819753B (zh) 2010-09-29
CN1819753A (zh) 2006-08-16
SG125183A1 (en) 2006-09-29
HK1094129A1 (en) 2007-03-16
CA2535186C (en) 2012-09-11

Similar Documents

Publication Publication Date Title
IN2015DE00285A (de)
EP1657154A3 (de) Gerät zur Montage eines elektrischen Bauteils eines Fahrrads
EP1884992A4 (de) Leiterplatte
MY145344A (en) Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
AT10247U3 (de) Verfahren zur integration wenigstens eines elektronischen bauteils in eine leiterplatte sowie leiterplatte
EP2436933A8 (de) Tragegestell für einen Lüfter
ATE375602T1 (de) Eine vorrichtung und ein verfahren um ein fluidmeniskus herzustellen
EP1850648A4 (de) Mehrschichtige Leiterplatte für ein Halbleiterbauelement und Herstellungsverfahren dafür
ATE342538T1 (de) Vorrichtung zur sicherung elektronischer schaltungen gegen unberechtigten zugang
EP1698218A4 (de) Metallstruktur-erzeugungsverfahren, dadurch erhaltene metallstruktur, leiterplatte, verfahren zur erzeugung eines leitfähigen films und dadurch erhaltener leitfähiger film
DE102004035827A1 (de) Elektronische Steuereinheit
EP1662850A4 (de) Verfahren zur herstellung einer leiterplatte und leiterplatte
EP2287898A3 (de) Schrumpfverpackung an Bord
TW200704303A (en) Electronic device
EP0946087A3 (de) Vorrichtung zum Bestücken von Leiterplatten mit elektronischen Bauteilen
ATE529834T1 (de) Verfahren zur herstellung eines tragbaren datenträgers
TW200607411A (en) Wiring board and method of manufacturing wiring board
WO2006136362A3 (de) Einrichtung zur behandlung von flachen und flächigen gegenständen
TW200735749A (en) Combined circuit board tie-wrap bracket
HK1083963A1 (en) Keypad and microphone arrangement
ATE410798T1 (de) Elektrischer verbinder und elektrisches system für ein bauteil in einem elektronischen gerät
JP2005159144A5 (de)
DE29905472U1 (de) Vorrichtung zur Herstellung von Leiterbahn-Platinen
ATE557579T1 (de) Verfahren zur herstellung einer elektromagnetischen abschirmung
TW200506440A (en) Array substrate and method of inspecting array substrate

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: MERH-IP, 80336 MUENCHEN