DE602005006324D1 - Verfahren zum verbinden zweier freier oberflächen eines ersten beziehungsweise zweiten substrats - Google Patents

Verfahren zum verbinden zweier freier oberflächen eines ersten beziehungsweise zweiten substrats

Info

Publication number
DE602005006324D1
DE602005006324D1 DE602005006324T DE602005006324T DE602005006324D1 DE 602005006324 D1 DE602005006324 D1 DE 602005006324D1 DE 602005006324 T DE602005006324 T DE 602005006324T DE 602005006324 T DE602005006324 T DE 602005006324T DE 602005006324 D1 DE602005006324 D1 DE 602005006324D1
Authority
DE
Germany
Prior art keywords
substrate
group
free surface
free
free surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005006324T
Other languages
English (en)
Other versions
DE602005006324T2 (de
Inventor
Marek Kostrzewa
Cioccio Lea Di
Guillaume Delapierre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE602005006324D1 publication Critical patent/DE602005006324D1/de
Application granted granted Critical
Publication of DE602005006324T2 publication Critical patent/DE602005006324T2/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Recrystallisation Techniques (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Semiconductor Lasers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Photovoltaic Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Ceramic Products (AREA)
DE602005006324T 2004-12-15 2005-12-06 Verfahren zum verbinden zweier freier oberflächen eines ersten beziehungsweise zweiten substrats Expired - Fee Related DE602005006324T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0413353 2004-12-15
FR0413353A FR2879208B1 (fr) 2004-12-15 2004-12-15 Procede de collage de deux surfaces libres, respectivement de premier et second substrats differents
PCT/FR2005/003049 WO2006064106A1 (fr) 2004-12-15 2005-12-06 Procede de collage de deux surfaces libres, respectivement de premier et second substrats differents

Publications (2)

Publication Number Publication Date
DE602005006324D1 true DE602005006324D1 (de) 2008-06-05
DE602005006324T2 DE602005006324T2 (de) 2009-07-09

Family

ID=34953791

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005006324T Expired - Fee Related DE602005006324T2 (de) 2004-12-15 2005-12-06 Verfahren zum verbinden zweier freier oberflächen eines ersten beziehungsweise zweiten substrats

Country Status (7)

Country Link
US (1) US20080009123A1 (de)
EP (1) EP1833938B1 (de)
JP (1) JP2008524837A (de)
AT (1) ATE393195T1 (de)
DE (1) DE602005006324T2 (de)
FR (1) FR2879208B1 (de)
WO (1) WO2006064106A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266562A (ja) 2006-03-03 2007-10-11 Matsushita Electric Ind Co Ltd 配線部材、樹脂付金属部品及び樹脂封止半導体装置、並びにこれらの製造方法
FR2900932B1 (fr) * 2006-05-11 2008-10-03 Eads Space Transp Sas Soc Par Procede pour ameliorer la tenue mecanique de collages realises avec un adhesif a base d'une resine durcissable par polymerisation en chaine
WO2009028156A1 (ja) * 2007-08-29 2009-03-05 Panasonic Corporation 配線部材、樹脂付金属部品及び樹脂封止半導体装置、並びにこれらの製造方法
US8409901B2 (en) * 2008-03-11 2013-04-02 The Royal Institution For The Advancement Of Learning/Mcgill University Low temperature wafer level processing for MEMS devices
US8993879B2 (en) 2010-06-14 2015-03-31 The Boeing Company Solar cell structure and composition and method for forming the same
JP2013131650A (ja) * 2011-12-21 2013-07-04 Fujitsu Ltd 半導体装置及びその製造方法
FR3011679B1 (fr) * 2013-10-03 2017-01-27 Commissariat Energie Atomique Procede ameliore d'assemblage par collage direct entre deux elements, chaque element comprenant des portions de metal et de materiaux dielectriques

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8204783A (nl) * 1982-12-10 1984-07-02 Philips Nv Werkwijze voor het aanbrengen van een metaallaag op een substraat.
JP3432572B2 (ja) * 1993-03-25 2003-08-04 住友化学工業株式会社 液晶オリゴマー重合物フィルム、その製造方法、並びに液晶オリゴマー重合物フィルムを用いた位相差板および液晶表示装置
EP0617111B1 (de) * 1993-03-25 1997-09-17 Sumitomo Chemical Company Limited Optisch anisotropisches Material, Verfahren zur Herstellung, Verzögerungsplatte und flüssigkristalline Anzeige, die es verwendet
DE19818962A1 (de) * 1998-04-28 1999-11-04 Degussa Verfahren zum Verbinden zweier Festkörper und das so hergestellte Bauelement
US6902987B1 (en) * 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure

Also Published As

Publication number Publication date
JP2008524837A (ja) 2008-07-10
EP1833938A1 (de) 2007-09-19
ATE393195T1 (de) 2008-05-15
EP1833938B1 (de) 2008-04-23
FR2879208B1 (fr) 2007-02-09
DE602005006324T2 (de) 2009-07-09
WO2006064106A1 (fr) 2006-06-22
US20080009123A1 (en) 2008-01-10
FR2879208A1 (fr) 2006-06-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee