DE602004030756D1 - Liquid cooling system - Google Patents

Liquid cooling system

Info

Publication number
DE602004030756D1
DE602004030756D1 DE602004030756T DE602004030756T DE602004030756D1 DE 602004030756 D1 DE602004030756 D1 DE 602004030756D1 DE 602004030756 T DE602004030756 T DE 602004030756T DE 602004030756 T DE602004030756 T DE 602004030756T DE 602004030756 D1 DE602004030756 D1 DE 602004030756D1
Authority
DE
Germany
Prior art keywords
cooling system
liquid cooling
liquid
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004030756T
Other languages
German (de)
Inventor
Rintaro Minamitani
Shigeo Ohashi
Takashi Naganawa
Shinji Matsushita
Hironori Oikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE602004030756D1 publication Critical patent/DE602004030756D1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE602004030756T 2004-02-16 2004-12-30 Liquid cooling system Active DE602004030756D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004038180A JP4234621B2 (en) 2004-02-16 2004-02-16 Liquid cooling system and electronic device

Publications (1)

Publication Number Publication Date
DE602004030756D1 true DE602004030756D1 (en) 2011-02-10

Family

ID=34697952

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004030756T Active DE602004030756D1 (en) 2004-02-16 2004-12-30 Liquid cooling system

Country Status (7)

Country Link
US (1) US7624789B2 (en)
EP (1) EP1564626B1 (en)
JP (1) JP4234621B2 (en)
KR (1) KR100618482B1 (en)
CN (1) CN1658744B (en)
DE (1) DE602004030756D1 (en)
TW (1) TWI272892B (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086452B1 (en) * 2000-06-30 2006-08-08 Intel Corporation Method and an apparatus for cooling a computer
TWI417604B (en) * 2005-12-28 2013-12-01 Semiconductor Energy Lab Display device
JP2008027374A (en) 2006-07-25 2008-02-07 Fujitsu Ltd Heat receiver for liquid cooling unit, liquid cooling unit, and electronic device
JP5283836B2 (en) * 2006-07-25 2013-09-04 富士通株式会社 Heat receiver and liquid cooling unit for liquid cooling unit and electronic device
US7978474B2 (en) * 2007-05-22 2011-07-12 Apple Inc. Liquid-cooled portable computer
TWI422313B (en) * 2007-12-04 2014-01-01 Asia Vital Components Co Ltd Radiative fin manufacturing method
JP5065202B2 (en) * 2008-08-28 2012-10-31 トヨタ自動車株式会社 Semiconductor device
JP5161757B2 (en) * 2008-12-26 2013-03-13 パナソニック株式会社 Image display device
CN102819303A (en) * 2011-06-09 2012-12-12 鸿富锦精密工业（深圳）有限公司 Computer case
CN103179837A (en) * 2011-12-20 2013-06-26 研能科技股份有限公司 Cooling system applied to portable electronic device
US20130255281A1 (en) * 2012-03-29 2013-10-03 General Electric Company System and method for cooling electrical components
US9472487B2 (en) * 2012-04-02 2016-10-18 Raytheon Company Flexible electronic package integrated heat exchanger with cold plate and risers
US9801310B2 (en) 2013-04-03 2017-10-24 International Business Machines Corporation Server cooling system without the use of vapor compression refrigeration
US9970687B2 (en) * 2013-06-26 2018-05-15 Tai-Her Yang Heat-dissipating structure having embedded support tube to form internally recycling heat transfer fluid and application apparatus
WO2015199726A1 (en) * 2014-06-27 2015-12-30 Hewlett-Packard Development Company, L. P. Heat distribution of computing devices
US10355356B2 (en) 2014-07-14 2019-07-16 Palo Alto Research Center Incorporated Metamaterial-based phase shifting element and phased array
CN204084274U (en) * 2014-07-30 2015-01-07 深圳Tcl新技术有限公司 radiator, backlight module and display module
US10060686B2 (en) * 2015-06-15 2018-08-28 Palo Alto Research Center Incorporated Passive radiative dry cooling module/system using metamaterials
CN107175813A (en) * 2017-06-30 2017-09-19 北京金达雷科技有限公司 Cool down substrate, cooling component, display module, resin pool component, 3D printer
CN109426049B (en) * 2017-08-21 2021-03-05 深圳光峰科技股份有限公司 Liquid cooling circulation heat abstractor, liquid cooling circulation heat dissipation system and optical projection system
DE102018129983A1 (en) * 2018-11-27 2020-05-28 Bayerische Motoren Werke Aktiengesellschaft Stator with a cooling jacket, electrical machine and motor vehicle
EP3842726A1 (en) * 2019-12-25 2021-06-30 Showa Denko Packaging Co., Ltd. Heat exchanger and inner fin thereof
CN112762732A (en) * 2020-12-28 2021-05-07 深圳市宝晟互联信息技术有限公司 Heat sink device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3327776A (en) * 1965-10-24 1967-06-27 Trane Co Heat exchanger
US4155402A (en) * 1977-01-03 1979-05-22 Sperry Rand Corporation Compliant mat cooling
US5132873A (en) * 1988-09-30 1992-07-21 Microelectronics And Computer Technology Corporation Diaphragm sealing apparatus
US5245693A (en) * 1991-03-15 1993-09-14 In-Touch Products Co. Parenteral fluid warmer apparatus and disposable cassette utilizing thin, flexible heat-exchange membrane
US5381510A (en) * 1991-03-15 1995-01-10 In-Touch Products Co. In-line fluid heating apparatus with gradation of heat energy from inlet to outlet
US5205348A (en) * 1991-05-31 1993-04-27 Minnesota Mining And Manufacturing Company Semi-rigid heat transfer devices
JP2801998B2 (en) 1992-10-12 1998-09-21 富士通株式会社 Electronic equipment cooling device
US5485671A (en) 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
TW422946B (en) * 1996-12-31 2001-02-21 Compaq Computer Corp Apparatus for liquid cooling of specific computer components
AU753320B2 (en) * 1998-07-01 2002-10-17 Showa Denko Kabushiki Kaisha Heat sink device for electronic devices
JP4055323B2 (en) 1999-12-13 2008-03-05 松下電器産業株式会社 Radiator, cooling device using the same, and electronic device equipped with the cooling device
US6808015B2 (en) * 2000-03-24 2004-10-26 Denso Corporation Boiling cooler for cooling heating element by heat transfer with boiling
JP2002098454A (en) * 2000-07-21 2002-04-05 Mitsubishi Materials Corp Liquid-cooled heat sink and its manufacturing method
US6367543B1 (en) * 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
US6587336B2 (en) 2001-06-27 2003-07-01 International Business Machines Corporation Cooling system for portable electronic and computer devices
CN2496065Y (en) * 2001-08-17 2002-06-19 创微国际开发股份有限公司 Microloop heat pipe
JP3636118B2 (en) 2001-09-04 2005-04-06 株式会社日立製作所 Water cooling device for electronic equipment
JP3961844B2 (en) 2002-02-08 2007-08-22 株式会社日立製作所 Coolant tank
TWI234063B (en) 2002-05-15 2005-06-11 Matsushita Electric Ind Co Ltd Cooling apparatus for electronic equipment
JP2004047843A (en) 2002-07-15 2004-02-12 Hitachi Ltd Electronic equipment

Also Published As

Publication number Publication date
TWI272892B (en) 2007-02-01
CN1658744B (en) 2010-07-21
TW200529735A (en) 2005-09-01
US20050178533A1 (en) 2005-08-18
KR100618482B1 (en) 2006-08-31
JP4234621B2 (en) 2009-03-04
CN1658744A (en) 2005-08-24
US7624789B2 (en) 2009-12-01
EP1564626A1 (en) 2005-08-17
EP1564626B1 (en) 2010-12-29
KR20050081867A (en) 2005-08-19
JP2005229036A (en) 2005-08-25

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